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FR2690597B1 - Procede de fabrication d'une plaque de cablage a film conducteur transparent. - Google Patents

Procede de fabrication d'une plaque de cablage a film conducteur transparent.

Info

Publication number
FR2690597B1
FR2690597B1 FR9304941A FR9304941A FR2690597B1 FR 2690597 B1 FR2690597 B1 FR 2690597B1 FR 9304941 A FR9304941 A FR 9304941A FR 9304941 A FR9304941 A FR 9304941A FR 2690597 B1 FR2690597 B1 FR 2690597B1
Authority
FR
France
Prior art keywords
manufacturing
conductive film
transparent conductive
wiring plate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9304941A
Other languages
English (en)
Other versions
FR2690597A1 (fr
Inventor
Ogawa Yukio
Yamaura Tatsuo
Namikawa Mamoru
Inoue Akira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Futaba Corp
Original Assignee
Futaba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Futaba Corp filed Critical Futaba Corp
Publication of FR2690597A1 publication Critical patent/FR2690597A1/fr
Application granted granted Critical
Publication of FR2690597B1 publication Critical patent/FR2690597B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/22—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
FR9304941A 1992-04-27 1993-04-27 Procede de fabrication d'une plaque de cablage a film conducteur transparent. Expired - Fee Related FR2690597B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4107945A JP2581373B2 (ja) 1992-04-27 1992-04-27 透明導電膜配線基板の製造方法

Publications (2)

Publication Number Publication Date
FR2690597A1 FR2690597A1 (fr) 1993-10-29
FR2690597B1 true FR2690597B1 (fr) 1997-07-04

Family

ID=14472040

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9304941A Expired - Fee Related FR2690597B1 (fr) 1992-04-27 1993-04-27 Procede de fabrication d'une plaque de cablage a film conducteur transparent.

Country Status (4)

Country Link
US (1) US5536466A (fr)
JP (1) JP2581373B2 (fr)
KR (1) KR0128687B1 (fr)
FR (1) FR2690597B1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
EP0959051A4 (en) * 1996-08-13 1999-12-15 Nippon Sheet Glass Co Ltd Laser machining method for glass substrate, diffraction type optical device fabricated by the machining method, and method of manufacturing optical device
KR100430664B1 (ko) 1997-10-03 2004-06-16 가부시끼가이샤 히다치 세이사꾸쇼 가스방전형표시장치의제조방법
WO1999056300A1 (fr) * 1998-04-28 1999-11-04 Matsushita Electric Industrial Co., Ltd. Ecran a plasma et son procede de fabrication
WO2000026937A1 (fr) 1998-10-29 2000-05-11 Mitsubishi Denki Kabushiki Kaisha Ecran a plasma a decharge plate en courant alternatif
WO2000070405A1 (fr) * 1999-05-14 2000-11-23 3M Innovative Properties Company Couche ameliorant l'ablation
ATE301917T1 (de) * 1999-09-07 2005-08-15 Ibiden Co Ltd Keramisches heizelement
DE10005330A1 (de) * 2000-02-08 2001-09-06 Fraunhofer Ges Forschung Verfahren zur Herstellung von leitfähigen transparenten Strukturen sowie Verwendung von transparenten, leitfähigen Oxidschichten zur Strukturierung von leitfähigen, transparenten Bereichen
KR20020032883A (ko) * 2000-10-27 2002-05-04 한기관 마킹용 레이저를 이용한 투명 아이티오 전극 패턴 제작 방법
US6743488B2 (en) 2001-05-09 2004-06-01 Cpfilms Inc. Transparent conductive stratiform coating of indium tin oxide
US6739760B2 (en) * 2001-09-17 2004-05-25 Stratos International, Inc. Parallel fiber optics communications module
US7073955B1 (en) 2001-09-17 2006-07-11 Stratos International, Inc. Transceiver assembly for use in fiber optics communications
US7056032B2 (en) * 2001-09-17 2006-06-06 Stratos International, Inc. Transceiver assembly for use in fiber optics communications
US7073954B1 (en) 2001-09-17 2006-07-11 Stratos International, Inc. Transceiver assembly for use in fiber optics communications
JP2005084493A (ja) * 2003-09-10 2005-03-31 Toppan Printing Co Ltd カラーフィルタ基板の製造方法及びカラーフィルタ基板
CN1914695B (zh) * 2004-02-09 2010-05-05 旭硝子株式会社 透明电极的制造方法
KR101517020B1 (ko) * 2008-05-15 2015-05-04 삼성디스플레이 주식회사 유기전계발광표시장치의 제조장치 및 제조방법
US8168265B2 (en) * 2008-06-06 2012-05-01 Applied Materials, Inc. Method for manufacturing electrochromic devices
KR20100035247A (ko) * 2008-09-26 2010-04-05 에스아이디주식회사 레이저를 이용한 투명 전극의 패턴화 방법 및 터치 패널의신호선 형성 방법
CN101823843B (zh) * 2010-03-25 2012-05-16 深圳南玻伟光导电膜有限公司 镀膜盖板及采用该镀膜盖板的手机
KR101385235B1 (ko) * 2012-08-08 2014-04-16 (주)솔라세라믹 레이저 스크라이빙 기술을 이용한 투명전도막 미세 패터닝 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50126194A (fr) * 1974-03-22 1975-10-03
US4081654A (en) * 1976-12-27 1978-03-28 Western Electric Co., Inc. Methods and apparatus for selectively removing a metallic film from a metallized substrate
JPS57205908A (en) * 1981-06-12 1982-12-17 Takeshi Ikeda Method of producing transparent pattern electrode
JPS581128A (ja) * 1981-06-26 1983-01-06 Takeshi Ikeda 透明パタ−ン電極
JPS58126613A (ja) * 1982-01-22 1983-07-28 鐘淵化学工業株式会社 薄膜電極の加工方法
JPS61240513A (ja) * 1985-04-18 1986-10-25 三洋電機株式会社 透光性導電酸化物の電気的分離方法
JPS6318330A (ja) * 1986-07-10 1988-01-26 Canon Inc 液晶素子のパタ−ン形成方法
US4859496A (en) * 1986-09-02 1989-08-22 Matsushita Electric Industrial Co., Ltd. Method of producing an electrically-conductive transparent film
GB2207669B (en) * 1987-08-06 1991-05-15 Stc Plc Providing metallised pads on transparent electrically conductive tracks on glass substrates
JPH0645483B2 (ja) * 1988-01-06 1994-06-15 株式会社半導体エネルギー研究所 液晶表示装置用基板およびその作製方法
DE68924095T2 (de) * 1988-05-16 1996-04-04 Tosoh Corp Verfahren zur Herstellung eines Sputtertargets zur Erzeugung einer elektrisch leitenden, durchsichtigen Schicht.
JPH02259727A (ja) * 1989-03-31 1990-10-22 Ricoh Co Ltd 液晶表示素子におけるパターン形成法
JPH04114491A (ja) * 1990-09-04 1992-04-15 Toyobo Co Ltd 電子回路パターンとその製法

Also Published As

Publication number Publication date
KR930022255A (ko) 1993-11-23
KR0128687B1 (ko) 1998-04-15
JPH05303916A (ja) 1993-11-16
FR2690597A1 (fr) 1993-10-29
US5536466A (en) 1996-07-16
JP2581373B2 (ja) 1997-02-12

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Legal Events

Date Code Title Description
ST Notification of lapse