JP2598328B2
(ja)
*
|
1989-10-17 |
1997-04-09 |
三菱電機株式会社 |
半導体装置およびその製造方法
|
US5602403A
(en)
*
|
1991-03-01 |
1997-02-11 |
The United States Of America As Represented By The Secretary Of The Navy |
Ion Implantation buried gate insulator field effect transistor
|
US5285102A
(en)
*
|
1991-07-25 |
1994-02-08 |
Texas Instruments Incorporated |
Method of forming a planarized insulation layer
|
JPH05198739A
(ja)
*
|
1991-09-10 |
1993-08-06 |
Mitsubishi Electric Corp |
積層型半導体装置およびその製造方法
|
US6570221B1
(en)
*
|
1993-07-27 |
2003-05-27 |
Hyundai Electronics America |
Bonding of silicon wafers
|
US5612552A
(en)
*
|
1994-03-31 |
1997-03-18 |
Lsi Logic Corporation |
Multilevel gate array integrated circuit structure with perpendicular access to all active device regions
|
JP3187306B2
(ja)
*
|
1995-10-31 |
2001-07-11 |
シャープ株式会社 |
透過型液晶表示装置
|
SE513283C2
(sv)
*
|
1996-07-26 |
2000-08-14 |
Ericsson Telefon Ab L M |
MOS-transistorstruktur med utsträckt driftregion
|
US5950082A
(en)
*
|
1996-09-30 |
1999-09-07 |
Advanced Micro Devices, Inc. |
Transistor formation for multilevel transistors
|
US5808319A
(en)
*
|
1996-10-10 |
1998-09-15 |
Advanced Micro Devices, Inc. |
Localized semiconductor substrate for multilevel transistors
|
US6150695A
(en)
*
|
1996-10-30 |
2000-11-21 |
Advanced Micro Devices, Inc. |
Multilevel transistor formation employing a local substrate formed within a shallow trench
|
US6271542B1
(en)
*
|
1997-12-08 |
2001-08-07 |
International Business Machines Corporation |
Merged logic and memory combining thin film and bulk Si transistors
|
US6191446B1
(en)
|
1998-03-04 |
2001-02-20 |
Advanced Micro Devices, Inc. |
Formation and control of a vertically oriented transistor channel length
|
US6215130B1
(en)
*
|
1998-08-20 |
2001-04-10 |
Lucent Technologies Inc. |
Thin film transistors
|
US6201267B1
(en)
|
1999-03-01 |
2001-03-13 |
Rensselaer Polytechnic Institute |
Compact low power complement FETs
|
US6190985B1
(en)
*
|
1999-08-17 |
2001-02-20 |
Advanced Micro Devices, Inc. |
Practical way to remove heat from SOI devices
|
DE10057665A1
(de)
*
|
2000-11-21 |
2002-06-06 |
Siemens Ag |
Integrierte Schaltung und Herstellungsverfahren dazu
|
US6887753B2
(en)
*
|
2001-02-28 |
2005-05-03 |
Micron Technology, Inc. |
Methods of forming semiconductor circuitry, and semiconductor circuit constructions
|
US6603156B2
(en)
*
|
2001-03-31 |
2003-08-05 |
International Business Machines Corporation |
Strained silicon on insulator structures
|
US6888198B1
(en)
*
|
2001-06-04 |
2005-05-03 |
Advanced Micro Devices, Inc. |
Straddled gate FDSOI device
|
JP2003179157A
(ja)
*
|
2001-12-10 |
2003-06-27 |
Nec Corp |
Mos型半導体装置
|
US6882010B2
(en)
*
|
2002-10-03 |
2005-04-19 |
Micron Technology, Inc. |
High performance three-dimensional TFT-based CMOS inverters, and computer systems utilizing such novel CMOS inverters
|
US7388259B2
(en)
*
|
2002-11-25 |
2008-06-17 |
International Business Machines Corporation |
Strained finFET CMOS device structures
|
US6887798B2
(en)
*
|
2003-05-30 |
2005-05-03 |
International Business Machines Corporation |
STI stress modification by nitrogen plasma treatment for improving performance in small width devices
|
US7329923B2
(en)
*
|
2003-06-17 |
2008-02-12 |
International Business Machines Corporation |
High-performance CMOS devices on hybrid crystal oriented substrates
|
US7279746B2
(en)
*
|
2003-06-30 |
2007-10-09 |
International Business Machines Corporation |
High performance CMOS device structures and method of manufacture
|
US7410846B2
(en)
*
|
2003-09-09 |
2008-08-12 |
International Business Machines Corporation |
Method for reduced N+ diffusion in strained Si on SiGe substrate
|
US6890808B2
(en)
*
|
2003-09-10 |
2005-05-10 |
International Business Machines Corporation |
Method and structure for improved MOSFETs using poly/silicide gate height control
|
US6887751B2
(en)
*
|
2003-09-12 |
2005-05-03 |
International Business Machines Corporation |
MOSFET performance improvement using deformation in SOI structure
|
US7170126B2
(en)
*
|
2003-09-16 |
2007-01-30 |
International Business Machines Corporation |
Structure of vertical strained silicon devices
|
US6869866B1
(en)
|
2003-09-22 |
2005-03-22 |
International Business Machines Corporation |
Silicide proximity structures for CMOS device performance improvements
|
US6872641B1
(en)
*
|
2003-09-23 |
2005-03-29 |
International Business Machines Corporation |
Strained silicon on relaxed sige film with uniform misfit dislocation density
|
US7144767B2
(en)
*
|
2003-09-23 |
2006-12-05 |
International Business Machines Corporation |
NFETs using gate induced stress modulation
|
US20050070070A1
(en)
*
|
2003-09-29 |
2005-03-31 |
International Business Machines |
Method of forming strained silicon on insulator
|
US7119403B2
(en)
|
2003-10-16 |
2006-10-10 |
International Business Machines Corporation |
High performance strained CMOS devices
|
US7037770B2
(en)
*
|
2003-10-20 |
2006-05-02 |
International Business Machines Corporation |
Method of manufacturing strained dislocation-free channels for CMOS
|
US7303949B2
(en)
*
|
2003-10-20 |
2007-12-04 |
International Business Machines Corporation |
High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture
|
US7129126B2
(en)
*
|
2003-11-05 |
2006-10-31 |
International Business Machines Corporation |
Method and structure for forming strained Si for CMOS devices
|
US7015082B2
(en)
*
|
2003-11-06 |
2006-03-21 |
International Business Machines Corporation |
High mobility CMOS circuits
|
US7029964B2
(en)
|
2003-11-13 |
2006-04-18 |
International Business Machines Corporation |
Method of manufacturing a strained silicon on a SiGe on SOI substrate
|
US7122849B2
(en)
*
|
2003-11-14 |
2006-10-17 |
International Business Machines Corporation |
Stressed semiconductor device structures having granular semiconductor material
|
US7247534B2
(en)
*
|
2003-11-19 |
2007-07-24 |
International Business Machines Corporation |
Silicon device on Si:C-OI and SGOI and method of manufacture
|
US7198995B2
(en)
*
|
2003-12-12 |
2007-04-03 |
International Business Machines Corporation |
Strained finFETs and method of manufacture
|
US7247912B2
(en)
*
|
2004-01-05 |
2007-07-24 |
International Business Machines Corporation |
Structures and methods for making strained MOSFETs
|
US7118999B2
(en)
*
|
2004-01-16 |
2006-10-10 |
International Business Machines Corporation |
Method and apparatus to increase strain effect in a transistor channel
|
US7381609B2
(en)
|
2004-01-16 |
2008-06-03 |
International Business Machines Corporation |
Method and structure for controlling stress in a transistor channel
|
US7202132B2
(en)
|
2004-01-16 |
2007-04-10 |
International Business Machines Corporation |
Protecting silicon germanium sidewall with silicon for strained silicon/silicon germanium MOSFETs
|
US7923782B2
(en)
*
|
2004-02-27 |
2011-04-12 |
International Business Machines Corporation |
Hybrid SOI/bulk semiconductor transistors
|
US7205206B2
(en)
*
|
2004-03-03 |
2007-04-17 |
International Business Machines Corporation |
Method of fabricating mobility enhanced CMOS devices
|
US7504693B2
(en)
*
|
2004-04-23 |
2009-03-17 |
International Business Machines Corporation |
Dislocation free stressed channels in bulk silicon and SOI CMOS devices by gate stress engineering
|
US7223994B2
(en)
*
|
2004-06-03 |
2007-05-29 |
International Business Machines Corporation |
Strained Si on multiple materials for bulk or SOI substrates
|
US7037794B2
(en)
*
|
2004-06-09 |
2006-05-02 |
International Business Machines Corporation |
Raised STI process for multiple gate ox and sidewall protection on strained Si/SGOI structure with elevated source/drain
|
US7227205B2
(en)
*
|
2004-06-24 |
2007-06-05 |
International Business Machines Corporation |
Strained-silicon CMOS device and method
|
TWI463526B
(zh)
*
|
2004-06-24 |
2014-12-01 |
Ibm |
改良具應力矽之cmos元件的方法及以該方法製備而成的元件
|
US7288443B2
(en)
*
|
2004-06-29 |
2007-10-30 |
International Business Machines Corporation |
Structures and methods for manufacturing p-type MOSFET with graded embedded silicon-germanium source-drain and/or extension
|
US7217949B2
(en)
*
|
2004-07-01 |
2007-05-15 |
International Business Machines Corporation |
Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI)
|
US6991998B2
(en)
*
|
2004-07-02 |
2006-01-31 |
International Business Machines Corporation |
Ultra-thin, high quality strained silicon-on-insulator formed by elastic strain transfer
|
US7384829B2
(en)
|
2004-07-23 |
2008-06-10 |
International Business Machines Corporation |
Patterned strained semiconductor substrate and device
|
US7315466B2
(en)
*
|
2004-08-04 |
2008-01-01 |
Samsung Electronics Co., Ltd. |
Semiconductor memory device and method for arranging and manufacturing the same
|
CN100440513C
(zh)
*
|
2004-10-15 |
2008-12-03 |
中国科学院上海微系统与信息技术研究所 |
一种三维互补金属氧化物半导体器件结构的制备方法
|
US7193254B2
(en)
*
|
2004-11-30 |
2007-03-20 |
International Business Machines Corporation |
Structure and method of applying stresses to PFET and NFET transistor channels for improved performance
|
US7238565B2
(en)
*
|
2004-12-08 |
2007-07-03 |
International Business Machines Corporation |
Methodology for recovery of hot carrier induced degradation in bipolar devices
|
US7262087B2
(en)
*
|
2004-12-14 |
2007-08-28 |
International Business Machines Corporation |
Dual stressed SOI substrates
|
US7173312B2
(en)
*
|
2004-12-15 |
2007-02-06 |
International Business Machines Corporation |
Structure and method to generate local mechanical gate stress for MOSFET channel mobility modification
|
US7274084B2
(en)
*
|
2005-01-12 |
2007-09-25 |
International Business Machines Corporation |
Enhanced PFET using shear stress
|
US20060160317A1
(en)
*
|
2005-01-18 |
2006-07-20 |
International Business Machines Corporation |
Structure and method to enhance stress in a channel of cmos devices using a thin gate
|
US7432553B2
(en)
*
|
2005-01-19 |
2008-10-07 |
International Business Machines Corporation |
Structure and method to optimize strain in CMOSFETs
|
US7220626B2
(en)
*
|
2005-01-28 |
2007-05-22 |
International Business Machines Corporation |
Structure and method for manufacturing planar strained Si/SiGe substrate with multiple orientations and different stress levels
|
US7256081B2
(en)
*
|
2005-02-01 |
2007-08-14 |
International Business Machines Corporation |
Structure and method to induce strain in a semiconductor device channel with stressed film under the gate
|
US7224033B2
(en)
|
2005-02-15 |
2007-05-29 |
International Business Machines Corporation |
Structure and method for manufacturing strained FINFET
|
US7545004B2
(en)
*
|
2005-04-12 |
2009-06-09 |
International Business Machines Corporation |
Method and structure for forming strained devices
|
US7978561B2
(en)
*
|
2005-07-28 |
2011-07-12 |
Samsung Electronics Co., Ltd. |
Semiconductor memory devices having vertically-stacked transistors therein
|
US7544577B2
(en)
*
|
2005-08-26 |
2009-06-09 |
International Business Machines Corporation |
Mobility enhancement in SiGe heterojunction bipolar transistors
|
US7202513B1
(en)
*
|
2005-09-29 |
2007-04-10 |
International Business Machines Corporation |
Stress engineering using dual pad nitride with selective SOI device architecture
|
US20070096170A1
(en)
*
|
2005-11-02 |
2007-05-03 |
International Business Machines Corporation |
Low modulus spacers for channel stress enhancement
|
US20070099360A1
(en)
*
|
2005-11-03 |
2007-05-03 |
International Business Machines Corporation |
Integrated circuits having strained channel field effect transistors and methods of making
|
US7655511B2
(en)
*
|
2005-11-03 |
2010-02-02 |
International Business Machines Corporation |
Gate electrode stress control for finFET performance enhancement
|
US7785950B2
(en)
*
|
2005-11-10 |
2010-08-31 |
International Business Machines Corporation |
Dual stress memory technique method and related structure
|
US7709317B2
(en)
*
|
2005-11-14 |
2010-05-04 |
International Business Machines Corporation |
Method to increase strain enhancement with spacerless FET and dual liner process
|
US7348638B2
(en)
*
|
2005-11-14 |
2008-03-25 |
International Business Machines Corporation |
Rotational shear stress for charge carrier mobility modification
|
US7564081B2
(en)
*
|
2005-11-30 |
2009-07-21 |
International Business Machines Corporation |
finFET structure with multiply stressed gate electrode
|
US7863197B2
(en)
*
|
2006-01-09 |
2011-01-04 |
International Business Machines Corporation |
Method of forming a cross-section hourglass shaped channel region for charge carrier mobility modification
|
US7776695B2
(en)
*
|
2006-01-09 |
2010-08-17 |
International Business Machines Corporation |
Semiconductor device structure having low and high performance devices of same conductive type on same substrate
|
US7635620B2
(en)
*
|
2006-01-10 |
2009-12-22 |
International Business Machines Corporation |
Semiconductor device structure having enhanced performance FET device
|
US20070158743A1
(en)
*
|
2006-01-11 |
2007-07-12 |
International Business Machines Corporation |
Thin silicon single diffusion field effect transistor for enhanced drive performance with stress film liners
|
US7691698B2
(en)
|
2006-02-21 |
2010-04-06 |
International Business Machines Corporation |
Pseudomorphic Si/SiGe/Si body device with embedded SiGe source/drain
|
US8461009B2
(en)
*
|
2006-02-28 |
2013-06-11 |
International Business Machines Corporation |
Spacer and process to enhance the strain in the channel with stress liner
|
US7608489B2
(en)
*
|
2006-04-28 |
2009-10-27 |
International Business Machines Corporation |
High performance stress-enhance MOSFET and method of manufacture
|
US7615418B2
(en)
*
|
2006-04-28 |
2009-11-10 |
International Business Machines Corporation |
High performance stress-enhance MOSFET and method of manufacture
|
US7521307B2
(en)
*
|
2006-04-28 |
2009-04-21 |
International Business Machines Corporation |
CMOS structures and methods using self-aligned dual stressed layers
|
US8853746B2
(en)
*
|
2006-06-29 |
2014-10-07 |
International Business Machines Corporation |
CMOS devices with stressed channel regions, and methods for fabricating the same
|
US7790540B2
(en)
|
2006-08-25 |
2010-09-07 |
International Business Machines Corporation |
Structure and method to use low k stress liner to reduce parasitic capacitance
|
US7462522B2
(en)
*
|
2006-08-30 |
2008-12-09 |
International Business Machines Corporation |
Method and structure for improving device performance variation in dual stress liner technology
|
US8754446B2
(en)
*
|
2006-08-30 |
2014-06-17 |
International Business Machines Corporation |
Semiconductor structure having undercut-gate-oxide gate stack enclosed by protective barrier material
|
US7972943B2
(en)
*
|
2007-03-02 |
2011-07-05 |
Semiconductor Energy Laboratory Co., Ltd. |
Manufacturing method of semiconductor device
|
US20080237738A1
(en)
*
|
2007-03-27 |
2008-10-02 |
Christoph Andreas Kleint |
Integrated circuit, cell, cell arrangement, method for manufacturing an integrated circuit, method for manufacturing a cell arrangement; memory module
|
WO2009023349A2
(fr)
*
|
2007-05-25 |
2009-02-19 |
Kalburge Amol M |
Nanotube intégré et dispositifs cmos pour des applications de système sur puce (soc) et procédé de formation
|
US8115254B2
(en)
|
2007-09-25 |
2012-02-14 |
International Business Machines Corporation |
Semiconductor-on-insulator structures including a trench containing an insulator stressor plug and method of fabricating same
|
US8492846B2
(en)
|
2007-11-15 |
2013-07-23 |
International Business Machines Corporation |
Stress-generating shallow trench isolation structure having dual composition
|
JP5441362B2
(ja)
*
|
2008-05-30 |
2014-03-12 |
富士フイルム株式会社 |
研磨液及び研磨方法
|
US8598006B2
(en)
*
|
2010-03-16 |
2013-12-03 |
International Business Machines Corporation |
Strain preserving ion implantation methods
|
CN103003934B
(zh)
*
|
2010-07-16 |
2015-07-01 |
株式会社半导体能源研究所 |
半导体器件
|
JP6297783B2
(ja)
*
|
2013-03-08 |
2018-03-20 |
住友電気工業株式会社 |
炭化珪素半導体装置およびその製造方法
|
TWI566328B
(zh)
*
|
2013-07-29 |
2017-01-11 |
高效電源轉換公司 |
具有用於產生附加構件之多晶矽層的氮化鎵電晶體
|
US8916872B1
(en)
|
2014-07-11 |
2014-12-23 |
Inoso, Llc |
Method of forming a stacked low temperature diode and related devices
|
US9087689B1
(en)
|
2014-07-11 |
2015-07-21 |
Inoso, Llc |
Method of forming a stacked low temperature transistor and related devices
|
US9281305B1
(en)
*
|
2014-12-05 |
2016-03-08 |
National Applied Research Laboratories |
Transistor device structure
|
US9559013B1
(en)
|
2015-11-23 |
2017-01-31 |
International Business Machines Corporation |
Stacked nanowire semiconductor device
|