FR2499290B1 - Dispositif de memoire dense remanent electriquement alterable avec electrode de couplage dans le substrat - Google Patents
Dispositif de memoire dense remanent electriquement alterable avec electrode de couplage dans le substratInfo
- Publication number
- FR2499290B1 FR2499290B1 FR8201584A FR8201584A FR2499290B1 FR 2499290 B1 FR2499290 B1 FR 2499290B1 FR 8201584 A FR8201584 A FR 8201584A FR 8201584 A FR8201584 A FR 8201584A FR 2499290 B1 FR2499290 B1 FR 2499290B1
- Authority
- FR
- France
- Prior art keywords
- electrically
- substrate
- memory device
- coupling electrode
- density memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008878 coupling Effects 0.000 title 1
- 238000010168 coupling process Methods 0.000 title 1
- 238000005859 coupling reaction Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C14/00—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/683—Floating-gate IGFETs having only two programming levels programmed by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/230,683 US4486769A (en) | 1979-01-24 | 1981-02-02 | Dense nonvolatile electrically-alterable memory device with substrate coupling electrode |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2499290A1 FR2499290A1 (fr) | 1982-08-06 |
FR2499290B1 true FR2499290B1 (fr) | 1989-09-22 |
Family
ID=22866174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8201584A Expired FR2499290B1 (fr) | 1981-02-02 | 1982-02-01 | Dispositif de memoire dense remanent electriquement alterable avec electrode de couplage dans le substrat |
Country Status (7)
Country | Link |
---|---|
US (1) | US4486769A (it) |
JP (1) | JPS57147282A (it) |
DE (1) | DE3203516A1 (it) |
FR (1) | FR2499290B1 (it) |
GB (1) | GB2092378B (it) |
IT (1) | IT1150377B (it) |
NL (1) | NL8200372A (it) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4577215A (en) * | 1983-02-18 | 1986-03-18 | Rca Corporation | Dual word line, electrically alterable, nonvolatile floating gate memory device |
US4590503A (en) * | 1983-07-21 | 1986-05-20 | Honeywell Inc. | Electrically erasable programmable read only memory |
US4608591A (en) * | 1983-08-17 | 1986-08-26 | Rca Corporation | Electrically alterable programmable nonvolatile floating gate memory device |
US4616245A (en) * | 1984-10-29 | 1986-10-07 | Ncr Corporation | Direct-write silicon nitride EEPROM cell |
JPS61274368A (ja) * | 1985-02-28 | 1986-12-04 | テキサス インスツルメンツ インコ−ポレイテツド | 電気的に消去可能なプログラム可能な固定メモリ・セル |
US4599706A (en) * | 1985-05-14 | 1986-07-08 | Xicor, Inc. | Nonvolatile electrically alterable memory |
US4752912A (en) * | 1985-05-14 | 1988-06-21 | Xicor, Inc. | Nonvolatile electrically alterable memory and method |
US4829482A (en) * | 1985-10-18 | 1989-05-09 | Xicor, Inc. | Current metering apparatus for optimally inducing field emission of electrons in tunneling devices and the like |
US4774202A (en) * | 1985-11-07 | 1988-09-27 | Sprague Electric Company | Memory device with interconnected polysilicon layers and method for making |
US4706102A (en) * | 1985-11-07 | 1987-11-10 | Sprague Electric Company | Memory device with interconnected polysilicon layers and method for making |
US4735919A (en) * | 1986-04-15 | 1988-04-05 | General Electric Company | Method of making a floating gate memory cell |
US4769788A (en) * | 1986-09-22 | 1988-09-06 | Ncr Corporation | Shared line direct write nonvolatile memory cell array |
US4878101A (en) * | 1986-12-29 | 1989-10-31 | Ning Hsieh | Single transistor cell for electrically-erasable programmable read-only memory and array thereof |
JPH0640589B2 (ja) * | 1987-03-16 | 1994-05-25 | 株式会社東芝 | 不揮発性半導体記憶装置 |
US4858185A (en) * | 1988-01-28 | 1989-08-15 | National Semiconductor Corporation | Zero power, electrically alterable, nonvolatile latch |
US5095344A (en) * | 1988-06-08 | 1992-03-10 | Eliyahou Harari | Highly compact eprom and flash eeprom devices |
US5198380A (en) * | 1988-06-08 | 1993-03-30 | Sundisk Corporation | Method of highly compact EPROM and flash EEPROM devices |
US5268319A (en) * | 1988-06-08 | 1993-12-07 | Eliyahou Harari | Highly compact EPROM and flash EEPROM devices |
US5168465A (en) * | 1988-06-08 | 1992-12-01 | Eliyahou Harari | Highly compact EPROM and flash EEPROM devices |
JPH0834297B2 (ja) * | 1988-12-28 | 1996-03-29 | 三菱電機株式会社 | 半導体装置 |
DE69033438T2 (de) * | 1989-04-13 | 2000-07-06 | Sandisk Corp., Santa Clara | Austausch von fehlerhaften Speicherzellen einer EEprommatritze |
US5153691A (en) * | 1989-06-21 | 1992-10-06 | Xicor, Inc. | Apparatus for a dual thickness floating gate memory cell |
DE69025939T2 (de) * | 1989-06-21 | 1996-08-01 | Xicor Inc | Apparat und verfahren zur herstellung einer speicherzelle mit schwebendem gate und doppelter dielektrikumschicht |
US5012132A (en) * | 1989-10-05 | 1991-04-30 | Xicor, Inc. | Dual mode high voltage coupler |
US5343063A (en) * | 1990-12-18 | 1994-08-30 | Sundisk Corporation | Dense vertical programmable read only memory cell structure and processes for making them |
US5512505A (en) * | 1990-12-18 | 1996-04-30 | Sandisk Corporation | Method of making dense vertical programmable read only memory cell structure |
US5291439A (en) * | 1991-09-12 | 1994-03-01 | International Business Machines Corporation | Semiconductor memory cell and memory array with inversion layer |
US5498558A (en) * | 1994-05-06 | 1996-03-12 | Lsi Logic Corporation | Integrated circuit structure having floating electrode with discontinuous phase of metal silicide formed on a surface thereof and process for making same |
JP3959125B2 (ja) * | 1994-09-14 | 2007-08-15 | 株式会社東芝 | 半導体装置 |
US5675531A (en) * | 1995-04-05 | 1997-10-07 | International Business Machines Corporation | Device for information storage using field emission |
US5889704A (en) * | 1997-02-26 | 1999-03-30 | Lucent Technologies Inc. | Load and leave memory cell |
US6025627A (en) | 1998-05-29 | 2000-02-15 | Micron Technology, Inc. | Alternate method and structure for improved floating gate tunneling devices |
DE19930531C2 (de) | 1999-07-01 | 2001-07-05 | Infineon Technologies Ag | Tunnelkontakt und Verfahren zu seiner Herstellung |
US6266075B1 (en) | 1999-07-08 | 2001-07-24 | Brady Worldwide, Inc. | Printer with memory device for storing platen pressures |
US6154392A (en) * | 1999-10-12 | 2000-11-28 | Patti; Robert | Four-terminal EEPROM cell for storing an analog voltage and memory system using the same to store multiple bits per EEPROM cell |
JP2001168306A (ja) * | 1999-12-09 | 2001-06-22 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
US6403455B1 (en) | 2000-08-31 | 2002-06-11 | Samsung Austin Semiconductor, L.P. | Methods of fabricating a memory device |
US6689668B1 (en) | 2000-08-31 | 2004-02-10 | Samsung Austin Semiconductor, L.P. | Methods to improve density and uniformity of hemispherical grain silicon layers |
US7586115B2 (en) * | 2000-12-28 | 2009-09-08 | Epir Technologies, Inc. | Light emission from semiconductor integrated circuits |
US6961279B2 (en) * | 2004-03-10 | 2005-11-01 | Linear Technology Corporation | Floating gate nonvolatile memory circuits and methods |
US6982907B1 (en) * | 2005-01-27 | 2006-01-03 | National Semiconductor Corporation | Retention improvement technique for one time programmable non-volatile memory |
WO2006122271A2 (en) * | 2005-05-10 | 2006-11-16 | Georgia Tech Research Corporation | Systems and methods for programming floating-gate transistors |
US8320191B2 (en) | 2007-08-30 | 2012-11-27 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
US9502581B2 (en) | 2014-07-11 | 2016-11-22 | Atmel Corporation | Non-volatile floating gate memory cells |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7500550A (nl) * | 1975-01-17 | 1976-07-20 | Philips Nv | Halfgeleider-geheugeninrichting. |
US4119995A (en) * | 1976-08-23 | 1978-10-10 | Intel Corporation | Electrically programmable and electrically erasable MOS memory cell |
US4099196A (en) * | 1977-06-29 | 1978-07-04 | Intel Corporation | Triple layer polysilicon cell |
DE2844878A1 (de) * | 1978-10-14 | 1980-04-30 | Itt Ind Gmbh Deutsche | Integrierbarer isolierschicht-feldeffekttransistor |
US4300212A (en) * | 1979-01-24 | 1981-11-10 | Xicor, Inc. | Nonvolatile static random access memory devices |
GB2042296B (en) * | 1979-01-24 | 1983-05-11 | Xicor Inc | Nonvolatile static random access/memory device |
US4314265A (en) * | 1979-01-24 | 1982-02-02 | Xicor, Inc. | Dense nonvolatile electrically-alterable memory devices with four layer electrodes |
US4404577A (en) * | 1980-06-30 | 1983-09-13 | International Business Machines Corp. | Electrically alterable read only memory cell |
-
1981
- 1981-02-02 US US06/230,683 patent/US4486769A/en not_active Expired - Lifetime
-
1982
- 1982-01-29 GB GB8202612A patent/GB2092378B/en not_active Expired
- 1982-01-29 IT IT47685/82A patent/IT1150377B/it active
- 1982-02-01 NL NL8200372A patent/NL8200372A/nl not_active Application Discontinuation
- 1982-02-01 FR FR8201584A patent/FR2499290B1/fr not_active Expired
- 1982-02-02 JP JP1543182A patent/JPS57147282A/ja active Granted
- 1982-02-02 DE DE19823203516 patent/DE3203516A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
US4486769A (en) | 1984-12-04 |
GB2092378B (en) | 1985-04-11 |
IT1150377B (it) | 1986-12-10 |
JPS57147282A (en) | 1982-09-11 |
JPH0343792B2 (it) | 1991-07-03 |
GB2092378A (en) | 1982-08-11 |
IT8247685A0 (it) | 1982-01-29 |
FR2499290A1 (fr) | 1982-08-06 |
DE3203516C2 (it) | 1992-11-19 |
DE3203516A1 (de) | 1982-09-02 |
NL8200372A (nl) | 1982-09-01 |
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