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ES2101032T3 - Metodo para formar un contacto electricamente conductor sobre un sustrato. - Google Patents

Metodo para formar un contacto electricamente conductor sobre un sustrato.

Info

Publication number
ES2101032T3
ES2101032T3 ES92304346T ES92304346T ES2101032T3 ES 2101032 T3 ES2101032 T3 ES 2101032T3 ES 92304346 T ES92304346 T ES 92304346T ES 92304346 T ES92304346 T ES 92304346T ES 2101032 T3 ES2101032 T3 ES 2101032T3
Authority
ES
Spain
Prior art keywords
substrate
contact area
forming
electrically conductive
copper buss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92304346T
Other languages
English (en)
Inventor
Alain Langevin
Auger Benoit
Charles Casavant
Wolfgang Erat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circo Craft Co Inc
Original Assignee
Circo Craft Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circo Craft Co Inc filed Critical Circo Craft Co Inc
Application granted granted Critical
Publication of ES2101032T3 publication Critical patent/ES2101032T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

UN METODO PARA LA FORMACION DE UN CONTACTO ELECTRICAMENTE CONDUCTOR SOBRE UN SUSTRATO AISLADO, COMO POR EJEMPLO, UN TABLERO DE CIRCUITOS IMPRESOS, QUE CONSISTE EN DEFINIR UNA ZONA DE CONTACTO SOBRE EL SUSTRATO Y COLOCAR UNA BARRA COLECTORA DE COBRE SOBRE EL SUSTRATO DE MODO QUE SE EXTIENDA MAS ALLA DE LOS BORDES MARGINALES DE LA ZONA DE CONTACTO. A CONTINUACION SE COLOCA UNA CAPA DELGADA DE MASCARA DE SOLDADURA PARA CUBRIR LA SUPERFICIE SUPERIOR DE LA BARRA COLECTORA DE COBRE FUERA DE LA ZONA DE CONTACTO. DESPUES, SE APLICA UNA PASTA CONDUCTORA DE POLIMERO DE PELICULA GRUESA (TFP) SOBRE LA BARRA COLECTORA EN LA ZONA DE CONTACTO DEFINIDA EN EL SUSTRATO Y SOBRE UNA PEQUEÑA PORCION DE LA MASCARA DE SOLDADURA DE MODO QUE LA BARRA COLECTORA DE COBRE QUEDE TOTALMENTE CUBIERTA.
ES92304346T 1991-10-25 1992-05-14 Metodo para formar un contacto electricamente conductor sobre un sustrato. Expired - Lifetime ES2101032T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78282791A 1991-10-25 1991-10-25

Publications (1)

Publication Number Publication Date
ES2101032T3 true ES2101032T3 (es) 1997-07-01

Family

ID=25127294

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92304346T Expired - Lifetime ES2101032T3 (es) 1991-10-25 1992-05-14 Metodo para formar un contacto electricamente conductor sobre un sustrato.

Country Status (9)

Country Link
US (1) US5686135A (es)
EP (1) EP0538978B1 (es)
KR (1) KR100279112B1 (es)
AT (1) ATE150612T1 (es)
CA (1) CA2055148C (es)
DE (1) DE69218336T2 (es)
DK (1) DK0538978T3 (es)
ES (1) ES2101032T3 (es)
MX (1) MX9206131A (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5871807A (en) * 1995-08-14 1999-02-16 Micron Display Technology, Inc. Multiple level printing in a single pass
US6265051B1 (en) * 1998-11-20 2001-07-24 3Com Corporation Edge connectors for printed circuit boards comprising conductive ink

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
EP0203544A2 (de) * 1985-05-31 1986-12-03 Siemens Aktiengesellschaft Kontaktflächen für Schalteinrichtungen
US4725478A (en) * 1985-09-04 1988-02-16 W. R. Grace & Co. Heat-miniaturizable printed circuit board
JPS62184785U (es) * 1986-05-16 1987-11-24
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
JPH01226273A (ja) * 1988-03-07 1989-09-08 Oki Electric Ind Co Ltd 電子黒板装置
JPH0682926B2 (ja) * 1988-04-22 1994-10-19 日本電気株式会社 多層配線基板の製造方法
JP2773288B2 (ja) * 1989-08-31 1998-07-09 松下電器産業株式会社 プリント配線板
JPH04354398A (ja) * 1991-05-31 1992-12-08 Internatl Business Mach Corp <Ibm> 配線基板及びその製造方法

Also Published As

Publication number Publication date
ATE150612T1 (de) 1997-04-15
DE69218336D1 (de) 1997-04-24
US5686135A (en) 1997-11-11
EP0538978B1 (en) 1997-03-19
EP0538978A2 (en) 1993-04-28
EP0538978A3 (en) 1993-08-18
MX9206131A (es) 1993-04-01
KR100279112B1 (ko) 2001-02-01
DE69218336T2 (de) 1997-09-25
CA2055148C (en) 2002-06-18
DK0538978T3 (da) 1997-09-08
CA2055148A1 (en) 1993-04-26
KR930009487A (ko) 1993-05-22

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