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KR930009487A - 기판상에 전기 전도성 접점을 형성하는 방법 - Google Patents

기판상에 전기 전도성 접점을 형성하는 방법 Download PDF

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Publication number
KR930009487A
KR930009487A KR1019920009999A KR920009999A KR930009487A KR 930009487 A KR930009487 A KR 930009487A KR 1019920009999 A KR1019920009999 A KR 1019920009999A KR 920009999 A KR920009999 A KR 920009999A KR 930009487 A KR930009487 A KR 930009487A
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KR
South Korea
Prior art keywords
conductive
bus
substrate
conductive paste
window
Prior art date
Application number
KR1019920009999A
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English (en)
Other versions
KR100279112B1 (ko
Inventor
랑게빈 애라인
오거 베노이트
카사반트 챠알스
에라트 울프강
Original Assignee
원본미기재
서코 크래프트 컴패니 인코오포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 원본미기재, 서코 크래프트 컴패니 인코오포레이티드 filed Critical 원본미기재
Publication of KR930009487A publication Critical patent/KR930009487A/ko
Application granted granted Critical
Publication of KR100279112B1 publication Critical patent/KR100279112B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

예를들면 인쇄회로판과 같은 절연된 기판상에 전기 전도성 접점을 형성하는 방법은 기판상에 접점 영역을 형성하는 단계와 구리 버스가 접점 영역의 한계 에너지를 벗어나 연장되도록 기판사에 구리 버스를 인가하는 단계를 포함한다. 솔더마스크의 얇은 층은 따라서 접점 영역 외부의 구리 버스의 상면을 덮도록 인가된다. 그런 후, 후막 중합체(TFP) 전도성 페이스트는 기판상에 형성되는 접점영역의 구리 버스위에 인가되고 구리 버스가 완전히 덮이도록 솔더마스크의 적은 부분위에 인가된다.

Description

기판상에 전기 전도성 접점을 형성하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명의 방법에 따라 인쇄회로판위에 형성된 전기전도성 에지 코넥터를 갖는 제3도에 도시된 인쇄회로판의 단면도.
제4도는 라인 4-4를 따라 취한 제3도에 도시된 인쇄회로판의 단면도.
제6도는 라인 6-6를 따라 취한 제5도의 단면도.
제7a도 내지 제7c도는 본 발명의 방법에 따라 인쇄회로판 위에 제3도의 전기 전도성 에지 코넥터를 형성할 때의 인쇄회로판의 중간 형성물의 단면도.

Claims (12)

  1. (i)기판상의 소정 위치에 전도성 버스를 인가하는 단계와; (ii)그것의 한계 에지로부터 이격된 상기 전도성 버스위에 윈도우를 형성하도록 상기 전도성 버스 표면의 선택영역에 솔더마스크를 인가하는 단계와; (iii)상기 전도성 버스의 상면이 실질상 완전하게 덮이도록 전도성 페이스트를 상기 윈도우내의 상기 전도성 버스의 상면에 인가하는 단계를 포함하는 것을 특징으로 하는 기판상에 접점을 형성하는 방법.
  2. 제1항에 있어서, 상기 전도성 버스는 상기 윈도우를 덮고 상기 윈도우의 주변부 주위로 상기 솔더마스크의 일부에 연장되는 것을 특징으로 하는 접점 형성 방법.
  3. 제2항에 있어서, 상기 전도성 버스가 상기 윈도우의 주변 에지로부터 최소한 0.010 인치의 솔더마스크를 덮는 것을 특징으로 하는 접점 형성 방법.
  4. 제2항에 있어서, 상기 윈도우는 평면이 사각형이고 신뢰성이 있는 구리 버스를 전도성 페이스트로 결합하도록 하는 크기인 것을 특징으로 하는 접점 형성 방법.
  5. 제1항에 있어서, 상기 전도성 페이스트는 후막 중합체 전도성 페이스트 형태인 것을 특징으로 하는 접점 형성 방법.
  6. 제1항에 있어서, 상기 전도성 버스는 구리 버스형태인 것을 특징으로 하는 접점 형성 방법.
  7. 제1항에 있어서, 상기 기판상에 다수의 위치가 지정되고 단계(i),(ii) 및 (iii)은 각 위치에서 동시에 실행되는 것을 특징으로 하는 접점 형성 방법.
  8. 제1항에 있어서, 상기 전도성 페이스트는 머신 스크리닝 프로세서를 이용하여 인가되는 것을 특징으로 하는 접점 형성 방법.
  9. 제2항에 있어서, 상기 전도성 페이스트는 후막 중합체 전도성 페이스트 형태인 것을 특징으로 하는 접점 형성 방법.
  10. 제2항에 있어서, 상기 전도성 버스는 구리 버스형태인 것을 특징으로 하는 접점 형성 방법.
  11. 제2항에 있어서, 상기 기판상에 다수의 위치가 지정되고 단계(i),(ii) 및 (iii)은 각 위치에서 동시에 실행되는 것을 특징으로 하는 접점 형성 방법.
  12. 제2항에 있어서, 상기 전도성 페이스트는 머신 스크리닝 프로세서를 이용하여 인가되는 것을 특징으로 하는 접점 형성 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920009999A 1991-10-25 1992-06-10 기판에 전기 전도성 접점을 형성하는 방법 KR100279112B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US78282791A 1991-10-25 1991-10-25
US07/782,827 1991-10-25
US7/782,827 1991-10-25

Publications (2)

Publication Number Publication Date
KR930009487A true KR930009487A (ko) 1993-05-22
KR100279112B1 KR100279112B1 (ko) 2001-02-01

Family

ID=25127294

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920009999A KR100279112B1 (ko) 1991-10-25 1992-06-10 기판에 전기 전도성 접점을 형성하는 방법

Country Status (9)

Country Link
US (1) US5686135A (ko)
EP (1) EP0538978B1 (ko)
KR (1) KR100279112B1 (ko)
AT (1) ATE150612T1 (ko)
CA (1) CA2055148C (ko)
DE (1) DE69218336T2 (ko)
DK (1) DK0538978T3 (ko)
ES (1) ES2101032T3 (ko)
MX (1) MX9206131A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5871807A (en) * 1995-08-14 1999-02-16 Micron Display Technology, Inc. Multiple level printing in a single pass
US6265051B1 (en) * 1998-11-20 2001-07-24 3Com Corporation Edge connectors for printed circuit boards comprising conductive ink

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
EP0203544A2 (de) * 1985-05-31 1986-12-03 Siemens Aktiengesellschaft Kontaktflächen für Schalteinrichtungen
US4725478A (en) * 1985-09-04 1988-02-16 W. R. Grace & Co. Heat-miniaturizable printed circuit board
JPS62184785U (ko) * 1986-05-16 1987-11-24
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
JPH01226273A (ja) * 1988-03-07 1989-09-08 Oki Electric Ind Co Ltd 電子黒板装置
JPH0682926B2 (ja) * 1988-04-22 1994-10-19 日本電気株式会社 多層配線基板の製造方法
JP2773288B2 (ja) * 1989-08-31 1998-07-09 松下電器産業株式会社 プリント配線板
JPH04354398A (ja) * 1991-05-31 1992-12-08 Internatl Business Mach Corp <Ibm> 配線基板及びその製造方法

Also Published As

Publication number Publication date
ATE150612T1 (de) 1997-04-15
DE69218336D1 (de) 1997-04-24
US5686135A (en) 1997-11-11
EP0538978B1 (en) 1997-03-19
EP0538978A2 (en) 1993-04-28
EP0538978A3 (en) 1993-08-18
ES2101032T3 (es) 1997-07-01
MX9206131A (es) 1993-04-01
KR100279112B1 (ko) 2001-02-01
DE69218336T2 (de) 1997-09-25
CA2055148C (en) 2002-06-18
DK0538978T3 (da) 1997-09-08
CA2055148A1 (en) 1993-04-26

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