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EP1800797A1 - Poliervorrichtung und polierverfahren - Google Patents

Poliervorrichtung und polierverfahren Download PDF

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Publication number
EP1800797A1
EP1800797A1 EP05781363A EP05781363A EP1800797A1 EP 1800797 A1 EP1800797 A1 EP 1800797A1 EP 05781363 A EP05781363 A EP 05781363A EP 05781363 A EP05781363 A EP 05781363A EP 1800797 A1 EP1800797 A1 EP 1800797A1
Authority
EP
European Patent Office
Prior art keywords
polishing
substrate
unit
polishing unit
side edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05781363A
Other languages
English (en)
French (fr)
Other versions
EP1800797A4 (de
Inventor
A. Mitsuboshi Diamond Industrial Co. Ltd Ejimatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of EP1800797A1 publication Critical patent/EP1800797A1/de
Publication of EP1800797A4 publication Critical patent/EP1800797A4/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Definitions

  • the bonded substrate is used for a plasma display panel (PDP), which is also a type of FPD other than liquid crystal display panel (LCD), an organic EL panel or a transmissive liquid crystal projector substrate and reflective liquid crystal projector substrate, which are included in a liquid crystal projector, or the like.
  • the bonded substrate is used for a field emission display (FED).
  • the size of the bonded substrate for such use varies, ranging from a small size for liquid crystal display panel used in a cell phone to a large size for television and display.
  • a boded substrate a large-sized mother substrate is cut to a predetermined size so as to manufacture individual FPDs.
  • yields of a cutting step and a chamfering step for the bonded substrate are reflected on the cost of manufacturing an FPD.
  • polishing apparatus when four edges of a work are polished, the work is fixed and the edges are polished while the four polishing machines are simultaneously moved along the respective edges. As a result, time required for polishing is significantly shortened. Also, since it is not necessary to move or rotate the work for each polishing, the displacement resulting from the movement of the work and the like does not occur. Thus, polishing can be performed at a high precision. Further, since it is possible to polish all the end faces on one table unit, it is not necessary to provide an apparatus for rotating the table unit. Thus, a large space is not required, thereby realizing miniaturization of the polishing apparatus.
  • the table rotating mechanism has a structure of rotating the center table such that the substrate mounted on the center table is put in a state of being rotated by a predetermined angle of 30 to 60 degrees with respect to the reference state, and the first polishing unit and the second polishing unit have a structure for simultaneously polishing the end faces facing each other of the substrate held on the rotated center table, respectively.
  • the method computes the amount of polishing of each end face based on the image data of the respective polishing sites obtained from the respective image capturing device and controls the respective polishing unit transfer mechanism. Thus, it is possible to always produce a constant amount of polishing.
  • the polishing unit 40a is moved in the X-axis direction by the polishing unit moving mechanism 85A.
  • the polishing grind stone 45i is moved along the end face 33a of the substrate 33, and the upper and lower edges of the end face 33a of the substrate 33 are chamfered by the respective tapered portions 45ia of the polishing grind stone 45i and at the same time, the end face 33a is polished.
  • the upward-and-downward air cylinder 63b is operated, and the second auxiliary supporting base 63 is moved upward and the crest of each of the free bearings 65 provided on the second auxiliary supporting base 63 is moved to the same height as that of the mounting surface of the center table 61. Accordingly, the substrate 33 is supported by the upper surface of the center table 61 and the free bearings 65 of the second auxiliary supporting base 63.
  • the horizontal base plate 52 is lowered, and the crest of the lower end of each of the free bearings provided on the lower surface of the horizontal base plate 52 is moved to the position (Z0+ ⁇ Z'), which is higher than the height (Z0) of the upper surface of the center table 61 by the thickness ( ⁇ Z') of the substrate 33 mounted and fixed on the center table 61.
  • the supporting plate portion 42a is moved upward by the cylinder 53 provided on the horizontal base plate 52, and the crest of the upper end of each of the free bearings 50 provided on the supporting plate portion 42a is moved to the same height (Z0) as the upper surface (Z0) of the center table 61.
  • the entire table unit 60 is operated to rotate the substrate 33 by 90 degrees such that the corner portion B of the substrate 33 is adjacent to the waiting position H of the polishing unit 40a.
  • the polishing unit 40a is positioned by the movement of the polishing unit holding body 83A and the polishing unit 40a such that the corner portion B of the substrate 33 is polished.
  • the polishing unit 40a is moved in the + X-axis direction along the polishing unit holding body 83A so as to polish an end face located between the corner portion B and the corner portion C, from the corner portion B toward the corner portion C.
  • the air blowing device 96 is connected to an air pump (not shown) to blow compressed air to the image capturing device 49.
  • the center table 100 mounts and suction-holds the substrate 33.
  • the image capturing devices 49 capture the alignment marks provided on the substrate 33, so that the captured image data is processed by the image processing device 101, and as a result, the positional data of the alignment marks is generated.
  • the control section 102 computes a displacement amount of the substrate 33 in the X-axis direction and the Y-axis direction with respect to a reference position from the positional data of the alignment marks which have been output from the image processing device 101.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Liquid Crystal (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
EP05781363A 2004-09-03 2005-09-01 Poliervorrichtung und polierverfahren Withdrawn EP1800797A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004291950 2004-09-03
PCT/JP2005/016045 WO2006025507A1 (ja) 2004-09-03 2005-09-01 研磨装置及び研磨方法

Publications (2)

Publication Number Publication Date
EP1800797A1 true EP1800797A1 (de) 2007-06-27
EP1800797A4 EP1800797A4 (de) 2011-01-26

Family

ID=36000156

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05781363A Withdrawn EP1800797A4 (de) 2004-09-03 2005-09-01 Poliervorrichtung und polierverfahren

Country Status (7)

Country Link
US (1) US20090029627A1 (de)
EP (1) EP1800797A4 (de)
JP (1) JP4920416B2 (de)
KR (1) KR101213017B1 (de)
CN (1) CN101005921B (de)
TW (1) TWI394638B (de)
WO (1) WO2006025507A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2995994A3 (de) * 2014-08-19 2016-08-10 Shin-Etsu Chemical Co., Ltd. Rechteckiges substrat für drucklithografie und herstellungsverfahren
CN109333317A (zh) * 2018-12-10 2019-02-15 江西立德传动设备有限公司 一种机械设备加工抛光装置
CN112476151A (zh) * 2020-11-23 2021-03-12 华辰精密装备（昆山）股份有限公司 轧辊支撑方法及用于支撑轧辊的中心架系统

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US8585467B2 (en) * 2008-10-31 2013-11-19 Corning Incorporated Linear pressure feed grinding with voice coil
JP5321813B2 (ja) * 2009-03-11 2013-10-23 株式会社東京精密 面取り加工装置及び面取り加工方法
JP2010264549A (ja) * 2009-05-14 2010-11-25 Olympus Corp ワーク貼付部材および研磨加工方法
JP5384220B2 (ja) * 2009-06-22 2014-01-08 東京応化工業株式会社 アライメント装置およびアライメント方法
KR101377819B1 (ko) 2012-04-25 2014-03-25 현대제철 주식회사 엣지결함개선기능이 구비된 슬라브가공장치 및 그 제어방법
CN102848283B (zh) * 2012-09-17 2015-03-11 深圳市华星光电技术有限公司 液晶面板磨边机
JP6050086B2 (ja) * 2012-10-30 2016-12-21 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
CN103273394B (zh) * 2013-05-08 2015-11-25 深圳市华星光电技术有限公司 一种磨边机及其定盘装置
JP6344566B2 (ja) * 2014-09-26 2018-06-20 日本電気硝子株式会社 ガラス板の端部加工装置及び端部加工方法
CN105729267B (zh) * 2016-02-03 2018-06-12 华中科技大学 一种基于视觉控制的磨边装置及方法
US10685863B2 (en) * 2018-04-27 2020-06-16 Semiconductor Components Industries, Llc Wafer thinning systems and related methods
CN109434664A (zh) * 2018-12-25 2019-03-08 广东大雅智能厨电股份有限公司 一种自动跟踪轮廓的抛光装置
JP2020163529A (ja) * 2019-03-29 2020-10-08 株式会社荏原製作所 基板を保持するための研磨ヘッドおよび基板処理装置
KR102531086B1 (ko) * 2021-01-06 2023-05-11 (주)미래컴퍼니 연마 장치 및 연마 방법
CN113118893B (zh) * 2021-04-19 2022-04-22 秦皇岛永祯钢结构制造有限公司 一种装配式钢结构预制件精加工系统
CN113211286A (zh) * 2021-06-03 2021-08-06 陈平 一种出口木材家具用自动抛光设备
CN115026697B (zh) * 2022-06-10 2023-12-22 宁夏钢铁(集团)有限责任公司 一种耐腐蚀不锈钢覆层钢筋的制备装置及使用方法

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See also references of WO2006025507A1 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2995994A3 (de) * 2014-08-19 2016-08-10 Shin-Etsu Chemical Co., Ltd. Rechteckiges substrat für drucklithografie und herstellungsverfahren
US9884448B2 (en) 2014-08-19 2018-02-06 Shin-Etsu Chemical Co., Ltd. Rectangular substrate for imprint lithography and making method
US11904521B2 (en) 2014-08-19 2024-02-20 Shin-Etsu Chemical Co., Ltd. Rectangular substrate for imprint lithography and making method
CN109333317A (zh) * 2018-12-10 2019-02-15 江西立德传动设备有限公司 一种机械设备加工抛光装置
CN109333317B (zh) * 2018-12-10 2019-12-27 江西立德传动设备有限公司 一种机械设备加工抛光装置
CN112476151A (zh) * 2020-11-23 2021-03-12 华辰精密装备（昆山）股份有限公司 轧辊支撑方法及用于支撑轧辊的中心架系统

Also Published As

Publication number Publication date
CN101005921A (zh) 2007-07-25
CN101005921B (zh) 2010-10-27
US20090029627A1 (en) 2009-01-29
TW200618936A (en) 2006-06-16
TWI394638B (zh) 2013-05-01
JP4920416B2 (ja) 2012-04-18
KR20070046886A (ko) 2007-05-03
JPWO2006025507A1 (ja) 2008-05-08
KR101213017B1 (ko) 2012-12-17
EP1800797A4 (de) 2011-01-26
WO2006025507A1 (ja) 2006-03-09

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