EP1745107A2 - Feuchtigkeitsvernetzbare alkoxysilylfunktionelle partikel enthaltende zusammensetzung - Google Patents
Feuchtigkeitsvernetzbare alkoxysilylfunktionelle partikel enthaltende zusammensetzungInfo
- Publication number
- EP1745107A2 EP1745107A2 EP05759567A EP05759567A EP1745107A2 EP 1745107 A2 EP1745107 A2 EP 1745107A2 EP 05759567 A EP05759567 A EP 05759567A EP 05759567 A EP05759567 A EP 05759567A EP 1745107 A2 EP1745107 A2 EP 1745107A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- particles
- compositions
- groups
- functional
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 80
- 239000002245 particle Substances 0.000 title claims abstract description 70
- 238000004132 cross linking Methods 0.000 title claims abstract description 15
- 125000005370 alkoxysilyl group Chemical group 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 239000011230 binding agent Substances 0.000 claims abstract description 27
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 150000001282 organosilanes Chemical class 0.000 claims abstract description 8
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910008051 Si-OH Inorganic materials 0.000 claims abstract description 3
- 229910006358 Si—OH Inorganic materials 0.000 claims abstract description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 3
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 3
- 229940075614 colloidal silicon dioxide Drugs 0.000 claims abstract 2
- 239000000377 silicon dioxide Substances 0.000 claims abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract 2
- -1 aspartate ester Chemical class 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 150000002148 esters Chemical group 0.000 claims description 5
- 125000005842 heteroatom Chemical group 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Chemical group 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 125000004103 aminoalkyl group Chemical group 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 229940009098 aspartate Drugs 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 150000003573 thiols Chemical group 0.000 claims description 3
- 229910003849 O-Si Inorganic materials 0.000 claims description 2
- 229910003872 O—Si Inorganic materials 0.000 claims description 2
- 125000004429 atom Chemical group 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical group NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 238000004627 transmission electron microscopy Methods 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 3
- 239000008119 colloidal silica Substances 0.000 claims 1
- 230000001698 pyrogenic effect Effects 0.000 claims 1
- 125000000547 substituted alkyl group Chemical group 0.000 claims 1
- 229910002808 Si–O–Si Inorganic materials 0.000 abstract description 5
- 239000010703 silicon Substances 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 150000004756 silanes Chemical class 0.000 description 14
- 238000000576 coating method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 230000009257 reactivity Effects 0.000 description 7
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000008199 coating composition Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000007306 functionalization reaction Methods 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- QUPDWYMUPZLYJZ-UHFFFAOYSA-N ethyl Chemical compound C[CH2] QUPDWYMUPZLYJZ-UHFFFAOYSA-N 0.000 description 3
- 229920001002 functional polymer Polymers 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- QRFPECUQGPJPMV-UHFFFAOYSA-N isocyanatomethyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CN=C=O QRFPECUQGPJPMV-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- QRANWKHEGLJBQC-UHFFFAOYSA-N n-(trimethoxysilylmethyl)cyclohexanamine Chemical compound CO[Si](OC)(OC)CNC1CCCCC1 QRANWKHEGLJBQC-UHFFFAOYSA-N 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BLIIUNFDDXZNKB-UHFFFAOYSA-N trimethoxy(morpholin-4-ylmethyl)silane Chemical compound CO[Si](OC)(OC)CN1CCOCC1 BLIIUNFDDXZNKB-UHFFFAOYSA-N 0.000 description 3
- GTEXIOINCJRBIO-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]-n,n-dimethylethanamine Chemical compound CN(C)CCOCCN(C)C GTEXIOINCJRBIO-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- MJUJXFBTEFXVKU-UHFFFAOYSA-N diethyl phosphonate Chemical compound CCOP(=O)OCC MJUJXFBTEFXVKU-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical class O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 2
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- LTRPLRHNXPTOIN-UHFFFAOYSA-N [diethoxy(methyl)silyl]methanamine Chemical compound CCO[Si](C)(CN)OCC LTRPLRHNXPTOIN-UHFFFAOYSA-N 0.000 description 1
- GXDZOSLIAABYHM-UHFFFAOYSA-N [diethoxy(methyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)COC(=O)C(C)=C GXDZOSLIAABYHM-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000005840 aryl radicals Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000589 high-performance liquid chromatography-mass spectrometry Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical class CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- NPHYNRXAEIFHOQ-UHFFFAOYSA-N methyl n-(triethoxysilylmethyl)carbamate Chemical compound CCO[Si](OCC)(OCC)CNC(=O)OC NPHYNRXAEIFHOQ-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- VGWSBMBGMVITHT-UHFFFAOYSA-N n-(triethoxysilylmethyl)ethanamine Chemical compound CCNC[Si](OCC)(OCC)OCC VGWSBMBGMVITHT-UHFFFAOYSA-N 0.000 description 1
- FVMHCRMQWNASEI-UHFFFAOYSA-N n-[[diethoxy(methyl)silyl]methyl]aniline Chemical compound CCO[Si](C)(OCC)CNC1=CC=CC=C1 FVMHCRMQWNASEI-UHFFFAOYSA-N 0.000 description 1
- REODOQPOCJZARG-UHFFFAOYSA-N n-[[diethoxy(methyl)silyl]methyl]cyclohexanamine Chemical compound CCO[Si](C)(OCC)CNC1CCCCC1 REODOQPOCJZARG-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000006120 scratch resistant coating Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000002444 silanisation Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- YWOSGXSBVHJBEJ-UHFFFAOYSA-N silylmethanamine Chemical class NC[SiH3] YWOSGXSBVHJBEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- SWBCLJBJSRNGNA-UHFFFAOYSA-N triethoxy(methoxymethyl)silane Chemical compound CCO[Si](COC)(OCC)OCC SWBCLJBJSRNGNA-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- UOCZMUZYGLTGHO-UHFFFAOYSA-N triethoxy(morpholin-4-ylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)CN1CCOCC1 UOCZMUZYGLTGHO-UHFFFAOYSA-N 0.000 description 1
- KRKBPDSHHSQBKA-UHFFFAOYSA-N triethoxy(piperazin-1-ylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)CN1CCNCC1 KRKBPDSHHSQBKA-UHFFFAOYSA-N 0.000 description 1
- ROWWCTUMLAVVQB-UHFFFAOYSA-N triethoxysilylmethanamine Chemical compound CCO[Si](CN)(OCC)OCC ROWWCTUMLAVVQB-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
- C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
- C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
- C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
- C08G18/8025—Masked aliphatic or cycloaliphatic polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Definitions
- the invention relates to compositions which contain alkoxysilyl-functional particles and can be cured by ingress of moisture, and to processes for the preparation of these compositions.
- Moisture-crosslinkable compositions which, after hardening, contain compositions with e.g. delivering high mechanical hardness are known. They include in EP-A-571 073 and EP-A-1 123 951.
- the moisture-crosslinking prepolymers contained in the compositions are produced, for example, by reacting isocyanates or isocyanate-functional prepolymers with amino-functional silanes, such as e.g. Aminopropyltrimethoxysilane.
- they can also be obtained by reacting polyols or OH-functional polyurethanes with isocyanate-functional alkoxysilanes, e.g. Isocyanatopropyltrimethoxysilane produce.
- Fillers e.g. CaCO3, carbon black, etc.
- the fillers are usually not reactive towards the polymer matrix, i.e. they are not covalently bound to the polymer matrix in the course of curing.
- radical-curable compositions are known, inter alia from WO 00/22052 or WO 99/52964, which contain nanoscale fillers and, after they have cured, have high-mass compositions mechanical hardness and chemical resistance. These are used in particular for the production of scratch-resistant coatings.
- the high mechanical hardness of the cured compositions is due to the fact that appropriately functionalized particles are chemically incorporated into the polymer matrix during curing.
- the particles are equipped with functional groups on the surface by reaction with alkoxysilanes which are reactive towards the functionality of the polymer matrix.
- US Pat. Nos. 4,455,205 or 4,491,508 describe radiation-curable coating compositions which contain an acrylic-functional matrix polymer and methacrylic-functional SiO 2 particles.
- the functionalization of particles carrying metal OH (MeOH) and / or Si-OH groups is preferably carried out with alkoxysilanes which do not have any additional reactive organic function, for example with methyltrimethoxysilane, or with silanes whose additional reactive organic function is provided by a propyl group is separated from the alkoxysilyl function, such as, for example, aminopropyltrimethoxysilane.
- catalysts are also used.
- Corresponding systems are described, for example, in EP 1 249 470 A and EP 1 245 627 A.
- silyl groups are attached, which have not yet hydrolyzed silicon-bonded alkoxy groups. These can be in the presence of moisture, e.g. Humidity, with itself, with other alkoxysilyl compounds or also with alkoxysilyl-functional polymers condensation reactions. This is done by hydrolysis of the alkoxysilyl groups and subsequent condensation with the formation of Si-O-Si bonds. In this way, the corresponding material can be cured on contact with (atmospheric) moisture.
- the conventional silanes described above have such a low reactivity that this reaction cannot take place or only extremely slowly and in the presence of catalysts Systems with a high hardening speed cannot be realized in this way.
- the tin catalysts which are generally used to accelerate the hardening are toxicologically questionable.
- Alkoxysilane-terminated systems show a particularly low reactivity to moisture, if the methoxy silyl groups are used and the less reactive ones
- the latter ethoxy crosslinking systems in particular would be particularly desirable in many cases because they only release the toxicologically safe ethanol instead of methanol during curing.
- compositions which contain alkoxysilyl-functionalized particles with a significantly increased reactivity to (atmospheric) moisture and which are exposed to atmospheric moisture 4 Cure to materials in which the particles are covalently embedded in the matrix.
- WO 03/18658 and WO 03/14226 use functionalized alkoxysilanes for the silane termination of polydimethylsiloxanes and of organic polymers, which are characterized in that they contain alkoxysilyl groups which are separated from a heteroatom by a methylene spacer.
- These silanes or the silane-crosslinking polymers produced from these silanes are distinguished by a drastically increased rate of hydrolysis and condensation on contact with (atmospheric) moisture. The acceleration of the reaction is so considerable that the proportion of required catalysts can be significantly reduced or even a " catalyst additive can be dispensed with.
- the use of these highly reactive silanes has so far only been described for the functionalization of (pre-) polymers " .
- Such highly reactive prepolymers can be obtained, for example, by reacting OH-functional polymers with alkoxysilanes by copolymerizing
- Methacrylatomethylsilanes with ethylenically unsaturated monomers such as described in DE 101 40 131 A, or by reacting isocyanate-functional polymers with aminosilanes, such as e.g. described in WO 03/018658, manufacture and are, inter alia, as a binder for coatings and as a sealant or adhesive.
- the present invention is based on the object of providing moisture-crosslinking compositions comprising alkoxysilyl-functional particles which do not have the disadvantages of the known systems mentioned above have and is characterized in particular by a significantly increased curing speed.
- the invention relates to moisture-crosslinking compositions Z containing
- Binder B which is selected from alkoxysilyl-functional binders BS and OH-functional binders BO, and moisture-crosslinkable particles PS, which can be prepared by reacting
- Particles P made of a material which is selected from metal oxides, mixed metal-silicon oxides, silicon dioxide, in particular pyrogenic and colloidal silicon dioxide, and ' organopolysiloxane resins and their combinations, the above
- organosilanes S Functions that are selected from Me-OH, Si-OH, Me-O-Me, Me-O-Si, Si-O-Si, Me-OR 2 , Si-OR 2 and groups reactive towards group A. H, via which a reaction with the organosilanes S can take place, with organosilanes S of the general formula I,
- A is a group selected from -OR 4 , -P (0) (OR 4 ) 2 , -N (R) 2 , - NH-CO-N (R 4 ), -N (R 4 ) -CO-NH (R 4 ), -O-CO-N (R 4 ) 2 , -NH-CO-OR 4 ,
- R 1 is alkyl, cycloalkyl, aryl or arylalkyl radicals each having 1 to 12 carbon atoms, where the carbon chain can be interrupted by non-adjacent oxygen, sulfur or NR 3 groups
- R 2 is hydrogen, alkyl, cycloalkyl or aryl radical with 1 to 6 C atoms each, where the carbon chain can be interrupted by non-adjacent oxygen, sulfur or NR 3 groups
- R 3 is hydrogen, alkyl, cycloalkyl, arylalkyl, aryl, aminoalkyl or aspartate ester radical,
- R 5 is a difunctional, optionally substituted ' -_ alkyl or arylalkyl radical which may have oxygen atoms, carbonyl groups, NH or an NR 4 function in the alkyl chain and v is 0, 1 or 2.
- compositions Z contain alkoxysilyl-functional particles PS, the particle-bound alkoxysilyl groups of which are separated from a heteroatom by a methylene group. As a result, the particles show a high reactivity to moisture.
- the compositions Z thus have a significantly increased compared to the known systems
- compositions Z cure on entry of moisture with polycondensation to materials in which the particles PS are covalently bound to the binder B via Si-O-Si bonds.
- the covalent incorporation of the particles into the matrix results in a significant improvement in the properties of the cured materials.
- the organosilicon component of the particles PS introduced by the organosilanes S can be bound to the particles via the Si or via the group A.
- This organosilicon component of the particles PS is reactive towards the binder BO and / or BS and moisture.
- alkoxy-functional binders BS Compounds whose alkoxysilyl functions are separated from a hetero atom by a methylene group are preferably used as alkoxy-functional binders BS.
- the alkoxysilyl-functional binder BS can be in the form of monomeric, oligomeric or polymeric compounds.
- suitable monomeric binders are silicic acid esters, such as, for example, tetraethoxysilane.
- suitable oligomeric and polymeric binders are alkoxysilyl-functional compounds whose backbone consists of an epoxy resin, a polyurethane, a poly (meth) acrylate, a polyether or polyester.
- Compounds which are reactive towards the alkoxysilyl-functional particles PS are preferably used as OH-functional binders BO. If such binders BO are used, they are based on the
- Alkoxysilyl functions of the particle PS preferably in the deficit, so that alkoxysilyl functions remain in the composition Z, which allow moisture crosslinking of the composition .Z.
- Preferred examples of such binders are, in particular, Si-OH-functional siloxanes.
- compositions Z one or more different binders BO, binders BS or mixtures thereof "may. Be used.
- the amount of the particles PS contained in the composition Z is, based on the total weight, preferably at least 5% by weight, particularly preferably at least 10% by weight, in particular at least 15% by weight.
- the production of the particles PS can be carried out in the presence or absence of the binder B.
- compositions Z are preferably prepared in a two-stage process.
- the particles P are functionalized with alkoxysilanes S.
- the functionalized particles PS are introduced into the binder B.
- the composition Z is produced by the particles P being functionalized with the alkoxysilanes S in the presence of the binder B. If the particles PS are produced in the presence of the binder BO, then both the particle P and the OH-functional can
- Binder BO can be functionalized with Silan S. In this way, starting from a mixture containing binder BO and particle P, the composition Z containing binder BO and particle PS can be obtained. This process is referred to below as the in-situ process.
- all metal oxide and metal mixed oxide particles for example aluminum oxides such as corundum, " -.
- silicon oxide particles for example colloidal silicic acid, pyrogenic silicic acid, precipitated silicic acid
- silicon oxide compounds in which some valences of the silicon are provided with organic residues eg organopolysiloxane resins.
- the particles P are further characterized in that they have metal (MeOH) and / or silicon hydroxide functions (SiOH) and / or metal (MeOR 2 ) and / or silicon alkoxide functions (SiOR 2 ) and / or SiOSi and / or MeOMe and / or MeOSi units and / or reactive towards group A.
- the functions H are organic functions which are reactive towards the organic function A of the alkoxysilanes S of the general formula I.
- the organic functions H are preferably selected from carboxyl, carbonyl, ester, thiol , A ino, carbinol, epoxy, acrylic and methacrylic groups, with particular preference being given to amino, carbinol, epoxy, acrylic and methacrylic groups.
- the particles P and PS preferably have a medium one
- the particles P consist of pyrogenic silica.
- colloidal silicon or metal oxides are used as particles P, which preferably - as a dispersion of the corresponding oxide particles of submicron size in an aqueous or organic
- Solvents are present.
- the oxides of the metals aluminum, titanium, zirconium, tantalum, tungsten, hafnium and tin can preferably be used.
- particles P made of silicone resins of the general formula II,
- R 6 is hydrogen, an optionally halogen-substituted, epoxy, acrylic, methacrylic, carboxyl, carbonyl, ester, aromatic, or an in, thiol, carbinol functional aliphatic hydrocarbon radical with 1-18 carbon atoms and
- R 7 have the meanings of R 2 , k a value greater than or equal to 0, 1 a value greater than or equal to 0, m a value greater than or equal to 0, n a value greater than or equal to 0 . t a value greater than or equal to 0 ; and the sum of k + 1 + m + n is a value of at least 1, preferably at least 5.
- compositions Z. or PS are used.
- systems can be produced that contain corundum in addition to nanoscale Si0 2 .
- Preferred silanes S of the general formula I are ⁇ -
- Aminomethylsilanes such as aminomethyl-triethoxysilane, aminomethyl-methyldiethoxysilane, JV-cyclohexylaminomethyl-triethoxysilane, N-cyclohexylaminomethyl -methyldiethoxysilan, N-ethylaminomethyl-triethoxysilane, JV-ethylnylmethylaminomethyl-methyldilamethyl-methyl-nilamethyl-methyl-nilamethyl-methyl-niethyl-methyl-niethyl-methyl-n-amyl triethoxysilane, N-phenylaminomethyl-methyldiethoxysilane, O-methyl-carbamatomethyl-triethoxysilane, O-methyl-carbamatomethyl-methyldiethoxysilane, N, -diethylaminomethyl-triethoxysilane, JV, iV-diethylaminomethyl-methyldiethoxys
- ⁇ -oxymethylsilanes such as methacryloxymethyl-triethoxysilane, methacryloxymethyl-methyldiethoxysilane, methoxymethyl-triethoxysilane methoxymethyl-methyldiethidoxydoxysiloxymyloxiloxymiloxiloxymiloxiloxysiloxysiloxysilane-methoxysiloxysilane-methoxysiloxysilane-methoxysiloxysilane
- .alpha.-phosphonatomethylsilanes such as diethylphosphonic acid ester methyl triethoxysilane, diethylphosphonic acid ester methyl methyldiethoxysilane.
- the corresponding methoxysilanes are also preferred.
- an alkoxysilane S " - individually or a mixture of different silanes S of the general formula I or also a mixture of silanes S of the general formula I with other alkoxysilanes can be used.
- particles P can be present both as a dispersion or sol in a preferably non-aqueous solvent or as a powder.
- the production of the particles PS can be carried out in different ways:
- the particles PS contained in the compositions Z are preferably produced by a process in which MeOH- and / or SiOH-functional particles P are reacted with alkoxysilanes S of the general formula I.
- the alkoxysilanes S are attached via a Si-O-Si and / or Me-O-Si bond the particles bound. Due to the high reactivity of the silanes S of the general formula I, whose alkoxysilyl group is separated from a heteroatom by a methyl group, these compounds are highly suitable for the surface functionalization of particles.
- the functionalization of the particles P with these reactive silanes takes place quickly and completely.
- the particles P in particular organopolysiloxane resins, which have functions on their surface which are selected from MeOH, SiOH, MeOR 2 , SiOR 2 , SiOSi, MeOMe and SiOMe, by means of equilibration or cohydrolysis functionalized the silanes S. Both cohydrolysis and aquilibration can be carried out in the presence * of catalysts.
- the basic processes of cohydrolysis and aquilibration for the production of functionalized particles, in particular organopolysiloxane resins have been described many times in the literature.
- the particles PS contained in the compositions Z can be produced by reacting particles P which have organic functions H on their surface with organosilanes S of the general formula I.
- the alkoxysilanes S are bound via the organic function A to the organic function H of the particle.
- the particles PS can be present both as a dispersion, preferably in the non-aqueous solvent, in the solid state or - in the case of organopolysiloxane resins - as a liquid.
- compositions Z can also contain common solvents and the additives and additives customary in formulations. These include: Leveling agents, surface-active substances, adhesion promoters, light stabilizers such as UV absorbers and / or radical scavengers, thixotropic agents and other solids and fillers. Additives of this type are particularly preferred for generating the desired property profiles of both the compositions Z and the cured compositions. This applies in particular when compositions Z are to be used as coatings. Compositions Z may also contain dyes and / or pigments.
- compositions Z are cured by admission of atmospheric moisture. Curing is preferably carried out at 0-100 ° C, particularly preferably at 10-40 ° C.
- compositions obtained after curing compositions Z show better properties than the corresponding compositions without particles. For example, at
- compositions Z Use of the cured compositions Z as an elastomer increases the tensile strength. If the hardened compositions Z are used as a coating, the mechanical hardness can be improved.
- organopolysiloxane resins used in the examples for the particles P can be prepared in accordance with the processes described in US 5548053 A, EP 640 109 A and DE 19857348 A.
- the OH group-free MQ resin 803 used is available under the name MQ resin powder 803 from Wacker-Chemie GmbH, Kunststoff.
- mi R4 are each independently from each other hydrogen or ethyl radical, an average molecular weight Mw of 1400 g / mol and an OH group content of 3.4 wt .-%), phenyl (resin of the composition
- the crosslinked films were after-treated at 100 ° C. for 72 h.
- Example 2 5.00 g of the MQ resin used in Example 1 were reacted with 2.15 g of ⁇ -aminopropyltrimethoxysilane.
- Example 2 5.00 g of the MQ resin used in Example 1 were reacted with 2.15 g of ⁇ -aminopropyltrimethoxysilane.
- the measured data are summarized in Table 1.
- the measurement results of the reaction products of the MQ resin 803 (entry comparative example VI), which has no SiOH functions, and of the MQ resin (entry example la), which has an OH content of 3.4% by weight, are directly comparable with one another and show the covalent incorporation of the surface-modified MQ resin.
- Example 2 Analogously to Example 1, 5.00 g of the MQ resin used in Example 1, which has an OH content of 3.4% by weight, was reacted with 2.65 g of morpholinomethyltrimethoxysilane (1.2 equivalents based on the OH content of the resin). The toluene solution obtained was then mixed analogously to Example 1 with 12.85 g (10 mol% based on the OH content of the resin) of an OH-terminated polydimethylsiloxane (Mw approx. 12600, viscosity 582 mm 2 / s) and the mixture for 30 min stirred at room temperature.
- Mw approx. 12600 OH-terminated polydimethylsiloxane
- the mixture obtained after distilling off the solvent was made into a 3 mm high knife using a doctor blade Polytetrafluoroethylene form elapsed.
- the mass was stored for 24 hours at room temperature, 72 hours at 100 ° C. and 14 days at room temperature with the entry of atmospheric humidity.
- a composition not according to the invention was prepared and cured analogously to Example 3, in that instead of the MQ resin used in Example 3, 5.00 g of the MQ resin 803, which has no SiOH functions, was reacted with 2.65 g of morpholinomethyltrimethoxysilane.
- Example 3 Analogously to Example 3 shows a composition not according to the invention was prepared and cured by 5.00g of '.-- in Example 3 used MQ resin having an OH content of
- Example 4 To determine the mechanical properties of the compositions described in Example 3 and Comparative Examples 3 and 4, punched out of these S1 test specimens and their tensile properties measured in accordance with EN ISO 527-2 on a Z010 from Zwick. The properties determined are listed in Table 2.
- Example 5 A mixture of 10.00 g (59.45 mmol) of hexamethylene diisocyanate (HDI) and 63.25 g (356.88 mmol) of isocyanatomethyl-trimethoxysilane was placed in a 250 ml reaction vessel with stirring, cooling and heating facilities and applied Heated to 60 ° C. Then 0.03 g of dibutyltin dilaurate and 41.22 g (158.54 mmol) of a polypropylene glycerol with an average molecular weight of 260 g / mol. The temperature should not rise above 80 ° C. After the addition was complete, the mixture was stirred at 60 ° C. for a further 60 min.
- HDI hexamethylene diisocyanate
- 63.25 g (356.88 mmol) of isocyanatomethyl-trimethoxysilane was placed in a 250 ml reaction vessel with stirring, cooling and heating facilities and applied Heated to
- Example 6 To 38.50 g of an SiO 2 organosol (IPA-ST® from Nissan Chemicals, 30% by weight SiO, 12 n) 7.00 g of tri-ethoxysilylmethylcarbamic acid methyl ester are added dropwise within 1 min and the mixture for 3 d stirred at room temperature. 3.46 g of the silane-crosslinking end are added to the transparent dispersion
- Example 7 The coating formulation of Example 7 was knife coated using a film-drawing device Coatmaster ® 509 MC Fa .. Erichsen with a doctor blade gap height of 120 micrometers on a glass plate. It was then cured at room temperature (20 ° C, 30% humidity). The tack-free time was about 15 minutes, and after 24 hours the paint was very hard, although not yet final. To ensure complete curing, the coating was stored for 2 weeks at room temperature.
- the scratch resistance of the paint films produced according to Example 8 is determined using a Peter Dahn abrasion tester.
- a scouring fleece Scotch Brite ® 2297 with an area of 45 x 45 mm is weighted with a weight of 1 kg and scratched with 50 strokes.
- the gloss of the respective coating is measured using a Micro gloss 20 ° gloss meter from Byk.
- the loss of gloss is determined as a measure of the scratch resistance of the respective coating (average of 3 paint samples each):
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- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
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- Paints Or Removers (AREA)
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- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Abstract
Description
Claims
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DE102004022400A DE102004022400A1 (de) | 2004-05-06 | 2004-05-06 | Feuchtigkeitsvernetzbare alkoxysilyfunktionelle Partikel enthaltende Zusammensetzung |
PCT/EP2005/004301 WO2005108495A2 (de) | 2004-05-06 | 2005-04-21 | Feuchtigkeitsvernetzbare alkoxysilylfunktionelle partikel enthaltende zusammensetzung |
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EP1745107A2 true EP1745107A2 (de) | 2007-01-24 |
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EP05759567A Withdrawn EP1745107A2 (de) | 2004-05-06 | 2005-04-21 | Feuchtigkeitsvernetzbare alkoxysilylfunktionelle partikel enthaltende zusammensetzung |
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US (1) | US20070232729A1 (de) |
EP (1) | EP1745107A2 (de) |
JP (1) | JP2007536418A (de) |
KR (1) | KR100810553B1 (de) |
CN (1) | CN1950458A (de) |
DE (1) | DE102004022400A1 (de) |
WO (1) | WO2005108495A2 (de) |
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DE102012208864A1 (de) * | 2012-05-25 | 2013-11-28 | Wacker Chemie Ag | Vernetzbare Massen auf der Basis von Organosiliciumverbindungen |
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DE19857348A1 (de) * | 1998-12-11 | 2000-06-15 | Wacker Chemie Gmbh | Organopolysiloxanharze |
ATE366279T1 (de) * | 2001-03-30 | 2007-07-15 | Degussa | Siliciumorganische nano-mikrohybridsysteme oder mikrohybridsysteme enthaltende zusammensetzung für kratz- und abriebfeste beschichtungen |
EP1249470A3 (de) * | 2001-03-30 | 2005-12-28 | Degussa AG | Hochgefüllte pastöse siliciumorganische Nano- und/oder Mikrohybridkapseln enthaltende Zusammensetzung für kratz- und/oder abriebfeste Beschichtungen |
DE10139132A1 (de) * | 2001-08-09 | 2003-02-27 | Consortium Elektrochem Ind | Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen |
DE10140131B4 (de) * | 2001-08-16 | 2007-05-24 | Wacker Polymer Systems Gmbh & Co. Kg | Silan-modifizierte Polyvinylacetale |
US7153923B2 (en) * | 2001-08-28 | 2006-12-26 | Consortium Fur Elektrochemische Industrie Gmbh | Rapid-cure, one-component mixtures, which contain alkoxysilane-terminated polymers |
JP2006526668A (ja) * | 2003-04-07 | 2006-11-24 | コンゾルテイウム フユール エレクトロケミツシエ インヅストリー ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | オルガノシリル官能化された粒子およびその製造 |
DE10319937A1 (de) * | 2003-05-02 | 2004-12-02 | Wacker-Chemie Gmbh | Organofunktionelle oberflächenmodifizierte Metalloxide |
DE102004014684A1 (de) * | 2004-03-25 | 2005-10-13 | Consortium für elektrochemische Industrie GmbH | Oberflächenmodifizierte Partikel enthaltende härtbare Zusammensetzung |
DE102004014686A1 (de) * | 2004-03-25 | 2005-10-13 | Consortium für elektrochemische Industrie GmbH | Oberflächenmodifizierte Partikel enthaltende härtbare Zusammensetzung |
-
2004
- 2004-05-06 DE DE102004022400A patent/DE102004022400A1/de not_active Withdrawn
-
2005
- 2005-04-21 KR KR1020067023840A patent/KR100810553B1/ko not_active Expired - Fee Related
- 2005-04-21 CN CNA2005800144670A patent/CN1950458A/zh active Pending
- 2005-04-21 EP EP05759567A patent/EP1745107A2/de not_active Withdrawn
- 2005-04-21 WO PCT/EP2005/004301 patent/WO2005108495A2/de active Application Filing
- 2005-04-21 US US11/568,637 patent/US20070232729A1/en not_active Abandoned
- 2005-04-21 JP JP2007511924A patent/JP2007536418A/ja not_active Withdrawn
Non-Patent Citations (1)
Title |
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See references of WO2005108495A2 * |
Also Published As
Publication number | Publication date |
---|---|
JP2007536418A (ja) | 2007-12-13 |
WO2005108495A2 (de) | 2005-11-17 |
US20070232729A1 (en) | 2007-10-04 |
CN1950458A (zh) | 2007-04-18 |
KR100810553B1 (ko) | 2008-03-18 |
DE102004022400A1 (de) | 2005-12-15 |
WO2005108495A3 (de) | 2006-01-26 |
KR20070007363A (ko) | 2007-01-15 |
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