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DK1623613T3 - Sammensat EMI afskærmning - Google Patents

Sammensat EMI afskærmning

Info

Publication number
DK1623613T3
DK1623613T3 DK04737290T DK04737290T DK1623613T3 DK 1623613 T3 DK1623613 T3 DK 1623613T3 DK 04737290 T DK04737290 T DK 04737290T DK 04737290 T DK04737290 T DK 04737290T DK 1623613 T3 DK1623613 T3 DK 1623613T3
Authority
DK
Denmark
Prior art keywords
emi shielding
composite emi
composite
shielding
emi
Prior art date
Application number
DK04737290T
Other languages
English (en)
Inventor
William G Lionetta
Daniel S Yantosca
Daniel S Ventura
Robert E Stiffler
David C Rich
Christopher L Severance
Douglas Nobbs
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Application granted granted Critical
Publication of DK1623613T3 publication Critical patent/DK1623613T3/da

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DK04737290T 2003-02-13 2004-02-13 Sammensat EMI afskærmning DK1623613T3 (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44726303P 2003-02-13 2003-02-13
US46925003P 2003-05-09 2003-05-09
US10/764,956 US7326862B2 (en) 2003-02-13 2004-01-26 Combination metal and plastic EMI shield
PCT/US2004/004225 WO2004080135A2 (en) 2003-02-13 2004-02-13 Composite emi shield

Publications (1)

Publication Number Publication Date
DK1623613T3 true DK1623613T3 (da) 2008-09-29

Family

ID=32872769

Family Applications (1)

Application Number Title Priority Date Filing Date
DK04737290T DK1623613T3 (da) 2003-02-13 2004-02-13 Sammensat EMI afskærmning

Country Status (5)

Country Link
US (1) US7326862B2 (da)
EP (1) EP1623613B1 (da)
DE (1) DE602004014364D1 (da)
DK (1) DK1623613T3 (da)
WO (1) WO2004080135A2 (da)

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US10965333B2 (en) 2016-07-26 2021-03-30 Laird Technologies, Inc. Thermal management assemblies suitable for use with transceivers and other devices
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Also Published As

Publication number Publication date
EP1623613A2 (en) 2006-02-08
EP1623613B1 (en) 2008-06-11
US7326862B2 (en) 2008-02-05
US20040165369A1 (en) 2004-08-26
WO2004080135A3 (en) 2005-01-20
DE602004014364D1 (de) 2008-07-24
WO2004080135A2 (en) 2004-09-16

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