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DE69912861D1 - Druckempfindliche Klebstoffschichten und Verfahren zu deren Herstellung - Google Patents

Druckempfindliche Klebstoffschichten und Verfahren zu deren Herstellung

Info

Publication number
DE69912861D1
DE69912861D1 DE69912861T DE69912861T DE69912861D1 DE 69912861 D1 DE69912861 D1 DE 69912861D1 DE 69912861 T DE69912861 T DE 69912861T DE 69912861 T DE69912861 T DE 69912861T DE 69912861 D1 DE69912861 D1 DE 69912861D1
Authority
DE
Germany
Prior art keywords
manufacture
sensitive adhesive
pressure sensitive
adhesive layers
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69912861T
Other languages
English (en)
Other versions
DE69912861T2 (de
Inventor
Hitoshi Takahira
Masahiro Oura
Takao Yoshikawa
Hiroaki Kishioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE69912861D1 publication Critical patent/DE69912861D1/de
Application granted granted Critical
Publication of DE69912861T2 publication Critical patent/DE69912861T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C08L2666/44—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69912861T 1998-01-16 1999-01-18 Druckempfindliche Klebstoffschichten und Verfahren zu deren Herstellung Expired - Fee Related DE69912861T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP705198 1998-01-16
JP00705198A JP4383531B2 (ja) 1998-01-16 1998-01-16 感圧性接着シ―ト類とその製造方法

Publications (2)

Publication Number Publication Date
DE69912861D1 true DE69912861D1 (de) 2003-12-24
DE69912861T2 DE69912861T2 (de) 2004-04-22

Family

ID=11655270

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69912861T Expired - Fee Related DE69912861T2 (de) 1998-01-16 1999-01-18 Druckempfindliche Klebstoffschichten und Verfahren zu deren Herstellung

Country Status (4)

Country Link
US (1) US6299975B1 (de)
EP (1) EP0930322B1 (de)
JP (1) JP4383531B2 (de)
DE (1) DE69912861T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3819661B2 (ja) * 2000-02-24 2006-09-13 日東電工株式会社 感圧性接着シ―ト類および機能性フイルムの固定方法
JP2002134767A (ja) * 2000-10-25 2002-05-10 Lintec Corp 太陽電池モジュール用保護シート
DE10109067A1 (de) * 2001-02-24 2002-09-12 Tesa Ag Haftklebemasse mit geringem Ausgasungsverhalten
US6866899B2 (en) * 2001-12-21 2005-03-15 3M Innovative Properties Company Polymerization method comprising sequential irradiation
JP2004196939A (ja) * 2002-12-18 2004-07-15 Hitachi Chem Co Ltd セパレータ付き感圧型接着シート及び光学部材組立体並びにその組立方法
JP2005023133A (ja) * 2003-06-30 2005-01-27 Nitto Denko Corp 粘着剤組成物、粘着剤層、プラズマディスプレイパネル用フィルタ、及びプラズマディスプレイパネル表示装置
US20080220249A1 (en) * 2005-08-23 2008-09-11 Yuki Saitou Adhesive Sheet for Glass Protection and Protective Film for Automobile Glass
JP4869748B2 (ja) * 2006-03-14 2012-02-08 日東電工株式会社 ガラス保護用粘着シートおよび自動車ガラス用保護フィルム
JP2008088395A (ja) * 2006-09-07 2008-04-17 Sekisui Chem Co Ltd 移動体通信端末用両面粘着シート、及び、移動体通信端末
US7807015B2 (en) * 2006-09-18 2010-10-05 Xerox Corporation Adhesion promoter
US8282754B2 (en) 2007-04-05 2012-10-09 Avery Dennison Corporation Pressure sensitive shrink label
RU2505573C2 (ru) 2007-04-05 2014-01-27 Эвери Деннисон Копэрейшн Самоклеящаяся усадочная этикетка и изделие с этикеткой
JP4673344B2 (ja) * 2007-06-07 2011-04-20 日東電工株式会社 光学フィルム用粘着シートの製造方法
JP4975696B2 (ja) * 2008-07-28 2012-07-11 日東電工株式会社 放射線硬化型粘着シート、及び、放射線硬化型粘着シートの使用方法
JP5009887B2 (ja) * 2008-10-02 2012-08-22 ソニーケミカル＆インフォメーションデバイス株式会社 粘着シートの製造方法
JP4806730B2 (ja) 2008-10-15 2011-11-02 三菱樹脂株式会社 透明粘着シートおよび画像表示装置
JP2009161763A (ja) * 2009-02-13 2009-07-23 Nitto Denko Corp 感圧性接着シート
JP4994413B2 (ja) * 2009-04-01 2012-08-08 日東電工株式会社 両面粘着シート、両面粘着シートの製造方法、粘着型光学的機能性フィルムおよび粘着型ハードコートフィルム
JP2010285548A (ja) * 2009-06-11 2010-12-24 Nitto Denko Corp 光学部材用粘着テープ
JP6296674B2 (ja) * 2009-06-18 2018-03-20 日東電工株式会社 光学用粘着シート
FR2950059B1 (fr) * 2009-09-16 2016-09-16 Jacret Composition pour adhesif structural
JP5518436B2 (ja) 2009-11-09 2014-06-11 日東電工株式会社 光学用粘着シート
JP2010065235A (ja) * 2009-12-20 2010-03-25 Nitto Denko Corp 感圧性接着シート
EP2752366A1 (de) 2010-01-28 2014-07-09 Avery Dennison Corporation Gurtsystem für Etikettenapplikator
JP2012062351A (ja) * 2010-09-14 2012-03-29 Nitto Denko Corp 光学用粘着シート
JP2012062345A (ja) * 2010-09-14 2012-03-29 Nitto Denko Corp 光学用粘着シート
JP2011090312A (ja) * 2010-11-09 2011-05-06 Nitto Denko Corp 画像表示装置の光学フィルム用粘着シート、粘着型光学フィルムおよび画像表示装置
JP5758647B2 (ja) * 2011-02-17 2015-08-05 日東電工株式会社 光学用粘着シート
JP5814037B2 (ja) * 2011-08-05 2015-11-17 日東電工株式会社 粘着テープ
JP2013129704A (ja) * 2011-12-20 2013-07-04 Nitto Denko Corp 光学用粘着シート
KR20130131795A (ko) * 2012-05-24 2013-12-04 (주)엘지하우시스 유연도가 높은 점착 조성물
JP6097205B2 (ja) * 2013-11-14 2017-03-15 パナック株式会社 工程用保護フィルム
DE102014208814A1 (de) * 2014-05-09 2015-11-12 Tesa Se Primer zur Verbesserung der Adhäsion von Klebebändern auf hydrophilen Oberflächen
US20200399501A1 (en) * 2018-02-14 2020-12-24 Dlm Holding Group Llc Sealant composition and zero discharge impregnation process
CN113166481A (zh) * 2018-12-20 2021-07-23 亨斯迈先进材料许可(瑞士)有限公司 具有延迟添加剂的粘合剂组合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4716194A (en) * 1985-11-25 1987-12-29 National Starch And Chemical Corporation Removable pressure sensitive adhesive
DE69307008T2 (de) 1992-03-27 1997-04-17 Nitto Denko Corp Druckempfindliche Klebstoffe mit guter Wärmebeständigkeit, Klebplatten daraus und Verfahren zur deren Herstellung
US5354600A (en) * 1993-05-17 1994-10-11 Adco Products, Inc. Fortified pressure sensitive adhesive

Also Published As

Publication number Publication date
EP0930322A3 (de) 1999-08-11
DE69912861T2 (de) 2004-04-22
JPH11199832A (ja) 1999-07-27
EP0930322B1 (de) 2003-11-19
JP4383531B2 (ja) 2009-12-16
US6299975B1 (en) 2001-10-09
EP0930322A2 (de) 1999-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee