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DE69833943D1 - Harzvergossene elektronische bauelemente vom oberflächenmontierungstyp - Google Patents

Harzvergossene elektronische bauelemente vom oberflächenmontierungstyp

Info

Publication number
DE69833943D1
DE69833943D1 DE69833943T DE69833943T DE69833943D1 DE 69833943 D1 DE69833943 D1 DE 69833943D1 DE 69833943 T DE69833943 T DE 69833943T DE 69833943 T DE69833943 T DE 69833943T DE 69833943 D1 DE69833943 D1 DE 69833943D1
Authority
DE
Germany
Prior art keywords
electronic components
surface mounting
mounting type
resin cast
cast electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69833943T
Other languages
English (en)
Inventor
Masashi Gotoh
Jitsuo Kanazawa
Shuichiro Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE69833943D1 publication Critical patent/DE69833943D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE69833943T 1997-08-05 1998-08-04 Harzvergossene elektronische bauelemente vom oberflächenmontierungstyp Expired - Lifetime DE69833943D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22302997A JP3669463B2 (ja) 1997-08-05 1997-08-05 樹脂封止表面実装型電子部品
PCT/JP1998/003457 WO1999008320A1 (fr) 1997-08-05 1998-08-04 Composants electroniques montes en surface enveloppes dans une resine

Publications (1)

Publication Number Publication Date
DE69833943D1 true DE69833943D1 (de) 2006-05-11

Family

ID=16791736

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69833943T Expired - Lifetime DE69833943D1 (de) 1997-08-05 1998-08-04 Harzvergossene elektronische bauelemente vom oberflächenmontierungstyp

Country Status (5)

Country Link
US (1) US6281436B1 (de)
EP (1) EP1020908B1 (de)
JP (1) JP3669463B2 (de)
DE (1) DE69833943D1 (de)
WO (1) WO1999008320A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196488A (ja) * 1999-10-26 2001-07-19 Nec Corp 電子部品装置及びその製造方法
IL133453A0 (en) 1999-12-10 2001-04-30 Shellcase Ltd Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
JP3376994B2 (ja) * 2000-06-27 2003-02-17 株式会社村田製作所 弾性表面波装置及びその製造方法
DE10133151B4 (de) * 2001-07-07 2004-07-29 Robert Bosch Gmbh Bauteil mit einem Gehäuse umgebenen Bauelement und Vorrichtung und Verfahren, die bei seiner Herstellung einsetzbar sind
JP2004129222A (ja) * 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
JP3748849B2 (ja) * 2002-12-06 2006-02-22 三菱電機株式会社 樹脂封止型半導体装置
JP3913700B2 (ja) * 2003-04-08 2007-05-09 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法
JP2005033390A (ja) * 2003-07-10 2005-02-03 Citizen Watch Co Ltd 圧電デバイスとその製造方法
US7385463B2 (en) 2003-12-24 2008-06-10 Kyocera Corporation Surface acoustic wave device and electronic circuit device
JP2005286300A (ja) * 2004-03-03 2005-10-13 Mitsubishi Paper Mills Ltd 回路基板
DE112005000522T5 (de) * 2004-03-03 2007-01-18 Shinko Electric Industries Co., Ltd. Platinen-Herstellungsverfahren und Platine
JP2006067530A (ja) * 2004-08-30 2006-03-09 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
JP2007042993A (ja) * 2005-08-05 2007-02-15 Daisho Denshi:Kk 多層基板の製造方法
JP4582352B2 (ja) * 2007-10-26 2010-11-17 Ｔｄｋ株式会社 表面弾性波素子を含む高周波モジュール部品及びその集合体
KR101099501B1 (ko) * 2008-06-20 2011-12-27 주식회사 아이에스시테크놀러지 테스트 소켓, 전기적 연결장치 및 그 테스트 소켓의제조방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772101A (en) * 1972-05-01 1973-11-13 Ibm Landless plated-through hole photoresist making process
JPS5629389A (en) 1979-08-17 1981-03-24 Nippon Electric Co Printed board
EP0117211B1 (de) * 1983-02-18 1991-04-17 Fairchild Semiconductor Corporation Verfahren zur Herstellung eines Gehäuses für integrierte Schaltungen
JPS59158588A (ja) 1983-02-28 1984-09-08 イビデン株式会社 プリント配線基板
US4560826A (en) * 1983-12-29 1985-12-24 Amp Incorporated Hermetically sealed chip carrier
JPS631383A (ja) 1986-06-18 1988-01-06 Omron Tateisi Electronics Co 圧電アクチユエ−タ
JPH0699473B2 (ja) 1986-08-21 1994-12-07 味の素株式会社 グリシル―グルタミンの製造方法
JP2636537B2 (ja) * 1991-04-08 1997-07-30 日本電気株式会社 プリント配線板の製造方法
US5592025A (en) * 1992-08-06 1997-01-07 Motorola, Inc. Pad array semiconductor device
JPH07106485A (ja) * 1993-09-29 1995-04-21 Citizen Watch Co Ltd 樹脂封止型ピングリッドアレイ
US5467252A (en) * 1993-10-18 1995-11-14 Motorola, Inc. Method for plating using nested plating buses and semiconductor device having the same
JP3365052B2 (ja) 1994-06-21 2003-01-08 日産自動車株式会社 半導体装置
US5467253A (en) * 1994-06-30 1995-11-14 Motorola, Inc. Semiconductor chip package and method of forming
JPH08250827A (ja) * 1995-03-08 1996-09-27 Shinko Electric Ind Co Ltd 半導体装置用パッケージ及びその製造方法並びに半導体装置
JP3105437B2 (ja) * 1995-11-21 2000-10-30 沖電気工業株式会社 半導体素子パッケージ及びその製造方法
US5796589A (en) * 1995-12-20 1998-08-18 Intel Corporation Ball grid array integrated circuit package that has vias located within the solder pads of a package
JP3149352B2 (ja) * 1996-02-29 2001-03-26 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 基板の導体層の形成方法
JPH10125817A (ja) * 1996-10-15 1998-05-15 Hitachi Cable Ltd ２層配線基板
JPH10150260A (ja) * 1996-11-20 1998-06-02 Sumitomo Wiring Syst Ltd プリント配線基板

Also Published As

Publication number Publication date
JP3669463B2 (ja) 2005-07-06
WO1999008320A1 (fr) 1999-02-18
JPH1155069A (ja) 1999-02-26
EP1020908A4 (de) 2003-08-20
EP1020908A1 (de) 2000-07-19
US6281436B1 (en) 2001-08-28
EP1020908B1 (de) 2006-03-22

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Legal Events

Date Code Title Description
8332 No legal effect for de