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DE69536084D1 - Halbleiterbauelement und Verfahren zu seiner Herstellung - Google Patents

Halbleiterbauelement und Verfahren zu seiner Herstellung

Info

Publication number
DE69536084D1
DE69536084D1 DE69536084T DE69536084T DE69536084D1 DE 69536084 D1 DE69536084 D1 DE 69536084D1 DE 69536084 T DE69536084 T DE 69536084T DE 69536084 T DE69536084 T DE 69536084T DE 69536084 D1 DE69536084 D1 DE 69536084D1
Authority
DE
Germany
Prior art keywords
production
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69536084T
Other languages
English (en)
Inventor
Makoto Iijima
Tetsushi Wakabayashi
Toshio Hamano
Masaharu Minamizawa
Masashi Takenaka
Taturou Yamashita
Masataka Mizukoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Semiconductor Ltd
Original Assignee
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Application granted granted Critical
Publication of DE69536084D1 publication Critical patent/DE69536084D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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    • H05K2201/09209—Shape and layout details of conductors
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE69536084T 1994-04-28 1995-04-13 Halbleiterbauelement und Verfahren zu seiner Herstellung Expired - Lifetime DE69536084D1 (de)

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KR100199437B1 (ko) 1999-06-15
EP0685878A3 (de) 1996-11-06
US5978222A (en) 1999-11-02
KR950030321A (ko) 1995-11-24
US6088233A (en) 2000-07-11
EP1715512A3 (de) 2013-02-13
JPH0817964A (ja) 1996-01-19
EP0915504A1 (de) 1999-05-12
EP1198000A1 (de) 2002-04-17
EP0685878B1 (de) 2010-06-23
EP0685878A2 (de) 1995-12-06
EP1715512A2 (de) 2006-10-25
US5729435A (en) 1998-03-17
US6184133B1 (en) 2001-02-06
TW559338U (en) 2003-10-21
TW563902U (en) 2003-11-21
JP3034180B2 (ja) 2000-04-17

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