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DE69533127D1 - Kühlkörper - Google Patents

Kühlkörper

Info

Publication number
DE69533127D1
DE69533127D1 DE69533127T DE69533127T DE69533127D1 DE 69533127 D1 DE69533127 D1 DE 69533127D1 DE 69533127 T DE69533127 T DE 69533127T DE 69533127 T DE69533127 T DE 69533127T DE 69533127 D1 DE69533127 D1 DE 69533127D1
Authority
DE
Germany
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69533127T
Other languages
English (en)
Other versions
DE69533127T2 (de
Inventor
Tadashi Katsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69533127D1 publication Critical patent/DE69533127D1/de
Application granted granted Critical
Publication of DE69533127T2 publication Critical patent/DE69533127T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69533127T 1995-03-17 1995-10-26 Wärmesenken Expired - Lifetime DE69533127T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05954595A JP3578825B2 (ja) 1995-03-17 1995-03-17 ヒートシンク
JP5954595 1995-03-17

Publications (2)

Publication Number Publication Date
DE69533127D1 true DE69533127D1 (de) 2004-07-15
DE69533127T2 DE69533127T2 (de) 2004-10-14

Family

ID=13116345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69533127T Expired - Lifetime DE69533127T2 (de) 1995-03-17 1995-10-26 Wärmesenken

Country Status (6)

Country Link
US (1) US5689404A (de)
EP (2) EP0732741B1 (de)
JP (1) JP3578825B2 (de)
KR (1) KR100215300B1 (de)
CN (1) CN1099708C (de)
DE (1) DE69533127T2 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
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JPH09172113A (ja) * 1995-12-18 1997-06-30 Nec Corp 半導体装置用ヒートシンク
JP3768598B2 (ja) * 1996-05-31 2006-04-19 山洋電気株式会社 発熱体冷却装置
JPH10303348A (ja) * 1997-01-31 1998-11-13 Thermalloy Inc 熱伝導体及び熱エネルギー放散アセンブリ
JP2959506B2 (ja) * 1997-02-03 1999-10-06 日本電気株式会社 マルチチップモジュールの冷却構造
JP3942248B2 (ja) 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
FI106066B (fi) * 1997-03-04 2000-11-15 Nokia Networks Oy Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuva jäähdytin
DE19712723A1 (de) * 1997-03-26 1998-10-01 Ego Elektro Geraetebau Gmbh Kühlkörper
USD418216S (en) * 1997-10-07 1999-12-28 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
USD408514S (en) * 1997-10-07 1999-04-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
GB2330901B (en) * 1997-11-04 2001-05-09 Sunonwealth Electr Mach Ind Co Heat dissipation device
US5927385A (en) * 1998-01-21 1999-07-27 Yeh; Ming Hsin Cooling device for the CPU of computer
TW438215U (en) * 1998-02-10 2001-05-28 D Link Corp Heat sinks in an electronic production
JP2000012751A (ja) * 1998-06-24 2000-01-14 Nippon Densan Corp 冷却ファン装置
KR100310099B1 (ko) 1998-08-20 2001-12-17 윤종용 반도체집적회로장치용방열장치및그것을구비하는휴대용컴퓨터
US6472781B2 (en) * 1999-03-31 2002-10-29 Toshiba Home Technology Corporation Fan Motor
JP3377182B2 (ja) * 1999-03-31 2003-02-17 東芝ホームテクノ株式会社 ファンモータ
JP3517831B2 (ja) * 1999-07-13 2004-04-12 宏巳 片岡 ヒートシンク並びにその製造方法
US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US6349760B1 (en) 1999-10-22 2002-02-26 Intel Corporation Method and apparatus for improving the thermal performance of heat sinks
GB0106547D0 (en) * 2001-03-16 2001-05-02 Aavid Thermalloy Ltd Heat sinks
US6778390B2 (en) 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
KR20010088565A (ko) * 2001-08-07 2001-09-28 유은종 방열판의 구조
US6589018B2 (en) 2001-08-14 2003-07-08 Lakewood Engineering And Manufacturing Co. Electric fan motor assembly with motor housing control switch and electrical input socket
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
AT413163B (de) 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog Kühlvorrichtung für einen chip sowie verfahren zur herstellung
US6622786B1 (en) * 2002-04-17 2003-09-23 International Business Machines Corporation Heat sink structure with pyramidic and base-plate cut-outs
TW573938U (en) * 2003-06-10 2004-01-21 Delta Electronics Inc Heat dissipation structure
CN2682581Y (zh) * 2003-12-11 2005-03-02 东莞莫仕连接器有限公司 散热装置的导风结构
CN100546019C (zh) 2005-04-15 2009-09-30 富士通株式会社 散热器、电路基板、电子设备
JP2007135372A (ja) * 2005-11-14 2007-05-31 Denso Corp 車両用交流発電機
USD570305S1 (en) * 2007-02-16 2008-06-03 Sunonwealth Electric Machine Industry Co., Ltd. Axial-flow mini heat sink module
TWD120840S1 (zh) * 2007-02-16 2008-01-01 建準電機工業股份有限公司 軸流式微型散熱模組
USD570304S1 (en) * 2007-02-16 2008-06-03 Sunonwealth Electric Machine Industry Co., Ltd. Axial-flow mini heat sink module
USD570303S1 (en) * 2007-02-16 2008-06-03 Sunonwealth Electric Machine Industry Co., Ltd. Axial-flow mini heat sink module
AU2012272752B2 (en) 2011-06-22 2016-11-24 EcoTech LLC Lighting unit and method of controlling
US8632221B2 (en) * 2011-11-01 2014-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. LED module and method of bonding thereof
CN205213228U (zh) * 2015-10-30 2016-05-04 比亚迪股份有限公司 散热器底板以及具有其的散热器和igbt模组
KR20160120224A (ko) 2016-04-01 2016-10-17 (주)텍슨 히트 싱크
KR20160143599A (ko) 2016-09-20 2016-12-14 김현기 해상풍력발전 콘크리트 기초구조물 및 그 제조방법과 설치방법
KR20160143598A (ko) 2016-09-20 2016-12-14 김현기 해상풍력발전 콘크리트 기초구조물
DE102016125348B4 (de) * 2016-12-22 2020-06-25 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats
US10545546B2 (en) * 2018-02-23 2020-01-28 Intel Corporation Reversible direction thermal cooling system
EP3628872B1 (de) 2018-09-27 2023-01-25 INTEL Corporation Volumetrische widerstandsgebläse
CN111246702A (zh) * 2018-11-28 2020-06-05 宸展光电(厦门)股份有限公司 散热托盘组件及电子装置
FR3150393A1 (fr) * 2023-06-26 2024-12-27 Continental Automotive Technologies GmbH Boîtier d’appareil électronique comportant un radiateur et un ventilateur

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US5022462A (en) * 1986-04-30 1991-06-11 International Business Machines Corp. Flexible finned heat exchanger
US4807441A (en) * 1987-07-17 1989-02-28 Allied-Signal Inc. Cooling system for a sealed enclosure
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5583316A (en) * 1992-08-06 1996-12-10 Pfu Limited Heat-generating element cooling device
US5280409A (en) * 1992-10-09 1994-01-18 Sun Microsystems, Inc. Heat sink and cover for tab integrated circuits
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
JP2938704B2 (ja) * 1993-03-19 1999-08-25 富士通株式会社 集積回路パッケージ
GB2276763B (en) * 1993-03-30 1997-05-07 Thermalloy Inc Method and apparatus for dissipating thermal energy
US5484013A (en) * 1993-05-27 1996-01-16 Nippon Densan Corporation Heat sink fan
US5430611A (en) * 1993-07-06 1995-07-04 Hewlett-Packard Company Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US5409352A (en) * 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
GB2298520B (en) * 1995-03-03 1999-09-08 Hong Chen Fu In Heat sink device for integrated circuit

Also Published As

Publication number Publication date
US5689404A (en) 1997-11-18
JPH08255856A (ja) 1996-10-01
EP1383171A1 (de) 2004-01-21
DE69533127T2 (de) 2004-10-14
EP0732741A2 (de) 1996-09-18
KR960036006A (ko) 1996-10-28
KR100215300B1 (ko) 1999-08-16
EP0732741A3 (de) 1996-12-11
EP0732741B1 (de) 2004-06-09
CN1099708C (zh) 2003-01-22
JP3578825B2 (ja) 2004-10-20
CN1132933A (zh) 1996-10-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE