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TWD120840S1 - 軸流式微型散熱模組 - Google Patents

軸流式微型散熱模組

Info

Publication number
TWD120840S1
TWD120840S1 TW096301135F TW96301135F TWD120840S1 TW D120840 S1 TWD120840 S1 TW D120840S1 TW 096301135 F TW096301135 F TW 096301135F TW 96301135 F TW96301135 F TW 96301135F TW D120840 S1 TWD120840 S1 TW D120840S1
Authority
TW
Taiwan
Prior art keywords
heat sink
axial flow
flow micro
sink module
micro heat
Prior art date
Application number
TW096301135F
Other languages
English (en)
Inventor
洪銀樹
Original Assignee
建準電機工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 建準電機工業股份有限公司 filed Critical 建準電機工業股份有限公司
Priority to TW096301135F priority Critical patent/TWD120840S1/zh
Priority to US29/274,490 priority patent/USD570302S1/en
Publication of TWD120840S1 publication Critical patent/TWD120840S1/zh

Links

Abstract

【物品用途】本創作係運用於新世代掌上型電腦、智慧型手機、影像電話以及更小體積的PDA、GPS、PMP...等小型攜帶式系統之軸流式微型散熱模組。【創作特點】本創作之外觀特點在於:其散熱鰭片係呈等間距的規則型態平行排列,散熱風扇的外殼則是呈現簡潔的立方體型態,且該外殼的入風孔內緣係以流暢的彎弧呈向內傾斜型態,可平衡整體之剛毅線條,使整體視覺效果更柔和。
TW096301135F 2007-02-16 2007-02-16 軸流式微型散熱模組 TWD120840S1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096301135F TWD120840S1 (zh) 2007-02-16 2007-02-16 軸流式微型散熱模組
US29/274,490 USD570302S1 (en) 2007-02-16 2007-04-27 Axial-flow mini heat sink module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096301135F TWD120840S1 (zh) 2007-02-16 2007-02-16 軸流式微型散熱模組

Publications (1)

Publication Number Publication Date
TWD120840S1 true TWD120840S1 (zh) 2008-01-01

Family

ID=39466900

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096301135F TWD120840S1 (zh) 2007-02-16 2007-02-16 軸流式微型散熱模組

Country Status (2)

Country Link
US (1) USD570302S1 (zh)
TW (1) TWD120840S1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD827589S1 (en) * 2016-04-05 2018-09-04 Sumitomo Seika Chemicals Co., Ltd. Heat sink

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3578825B2 (ja) * 1995-03-17 2004-10-20 富士通株式会社 ヒートシンク
US7068506B2 (en) * 1997-09-10 2006-06-27 Sunny Behl Removable memory storage device carrier having a heat sink
USD401686S (en) * 1997-10-07 1998-11-24 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipitation fan
GB2342772A (en) * 1998-10-13 2000-04-19 Kuo Ching Sung Heat dissipating device
JP2005005349A (ja) * 2003-06-10 2005-01-06 Hit:Kk 電子機器
JP4391366B2 (ja) * 2003-09-12 2009-12-24 古河電気工業株式会社 ヒートパイプを備えたヒートシンクおよびその製造方法
US20050276689A1 (en) * 2004-06-15 2005-12-15 Ing-Jer Chiou [fan module]
JP4411147B2 (ja) * 2004-06-24 2010-02-10 株式会社日立製作所 ファン付きヒートシンク
US20060181846A1 (en) * 2005-02-11 2006-08-17 Farnsworth Arthur K Cooling system for a computer environment

Also Published As

Publication number Publication date
USD570302S1 (en) 2008-06-03

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