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DE69015666D1 - MOSFET-Transistor mit nicht-gleichmässiger Schwellspannung im Kanalbereich. - Google Patents

MOSFET-Transistor mit nicht-gleichmässiger Schwellspannung im Kanalbereich.

Info

Publication number
DE69015666D1
DE69015666D1 DE69015666T DE69015666T DE69015666D1 DE 69015666 D1 DE69015666 D1 DE 69015666D1 DE 69015666 T DE69015666 T DE 69015666T DE 69015666 T DE69015666 T DE 69015666T DE 69015666 D1 DE69015666 D1 DE 69015666D1
Authority
DE
Germany
Prior art keywords
threshold voltage
channel area
mosfet transistor
uniform threshold
uniform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69015666T
Other languages
English (en)
Other versions
DE69015666T2 (de
Inventor
Masayuki Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69015666D1 publication Critical patent/DE69015666D1/de
Application granted granted Critical
Publication of DE69015666T2 publication Critical patent/DE69015666T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/351Substrate regions of field-effect devices
    • H10D62/357Substrate regions of field-effect devices of FETs
    • H10D62/364Substrate regions of field-effect devices of FETs of IGFETs
    • H10D62/371Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • H10D62/299Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
    • H10D62/307Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations the doping variations being parallel to the channel lengths
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/671Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor having lateral variation in doping or structure
DE69015666T 1989-03-10 1990-03-09 MOSFET-Transistor mit nicht-gleichmässiger Schwellspannung im Kanalbereich. Expired - Fee Related DE69015666T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1056331A JPH0734475B2 (ja) 1989-03-10 1989-03-10 半導体装置

Publications (2)

Publication Number Publication Date
DE69015666D1 true DE69015666D1 (de) 1995-02-16
DE69015666T2 DE69015666T2 (de) 1995-06-14

Family

ID=13024215

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69015666T Expired - Fee Related DE69015666T2 (de) 1989-03-10 1990-03-09 MOSFET-Transistor mit nicht-gleichmässiger Schwellspannung im Kanalbereich.

Country Status (5)

Country Link
US (1) US5031008A (de)
EP (1) EP0387722B1 (de)
JP (1) JPH0734475B2 (de)
KR (1) KR930008536B1 (de)
DE (1) DE69015666T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233822A (en) * 1989-07-12 1991-01-16 Philips Electronic Associated A thin film field effect transistor
US5536957A (en) * 1990-01-16 1996-07-16 Mitsubishi Denki Kabushiki Kaisha MOS field effect transistor having source/drain regions surrounded by impurity wells
DE69109366T2 (de) * 1990-05-31 1995-10-19 Canon Kk Verfahren zur Herstellung einer Halbleiteranordnung mit Gatestruktur.
US5426327A (en) * 1990-10-05 1995-06-20 Nippon Steel Corporation MOS semiconductor with LDD structure having gate electrode and side spacers of polysilicon with different impurity concentrations
DE69029942T2 (de) * 1990-10-16 1997-08-28 Cons Ric Microelettronica Verfahren zur Herstellung von MOS-Leistungstransistoren mit vertikalem Strom
EP0487022B1 (de) * 1990-11-23 1997-04-23 Texas Instruments Incorporated Verfahren zum gleichzeitigen Herstellen eines Feldeffekttransistors mit isoliertem Gate und eines Bipolartransistors
EP0490535B1 (de) * 1990-12-07 1996-08-21 AT&T Corp. Feldeffekttransistor mit inverser T-förmiger Silizid-Torelektrode
JPH04242938A (ja) * 1991-01-08 1992-08-31 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5510641A (en) * 1992-06-01 1996-04-23 University Of Washington Majority carrier power diode
US5352914A (en) * 1992-08-03 1994-10-04 Hughes Aircraft Company Field-effect transistor with structure for suppressing hot-electron effects, and method of fabricating the transistor
JP2822365B2 (ja) * 1992-11-16 1998-11-11 日本ビクター株式会社 Mosfet
US5372960A (en) * 1994-01-04 1994-12-13 Motorola, Inc. Method of fabricating an insulated gate semiconductor device
US5536959A (en) * 1994-09-09 1996-07-16 Mcnc Self-aligned charge screen (SACS) field effect transistors and methods
US5661048A (en) * 1995-03-21 1997-08-26 Motorola, Inc. Method of making an insulated gate semiconductor device
US5541132A (en) * 1995-03-21 1996-07-30 Motorola, Inc. Insulated gate semiconductor device and method of manufacture
US5612244A (en) * 1995-03-21 1997-03-18 Motorola, Inc. Insulated gate semiconductor device having a cavity under a portion of a gate structure and method of manufacture
US5804496A (en) * 1997-01-08 1998-09-08 Advanced Micro Devices Semiconductor device having reduced overlap capacitance and method of manufacture thereof
US6121666A (en) * 1997-06-27 2000-09-19 Sun Microsystems, Inc. Split gate oxide asymmetric MOS devices
US6093951A (en) * 1997-06-30 2000-07-25 Sun Microsystems, Inc. MOS devices with retrograde pocket regions
US6249027B1 (en) 1998-06-08 2001-06-19 Sun Microsystems, Inc. Partially depleted SOI device having a dedicated single body bias means
DE29910867U1 (de) 1999-06-28 1999-09-30 Stocko Contact Gmbh & Co Kg Elektrischer Kabelsteckverbinder mit Kurzschlußüberbrückung
JP2002198529A (ja) * 2000-10-18 2002-07-12 Hitachi Ltd 半導体装置およびその製造方法
KR100913323B1 (ko) * 2002-12-30 2009-08-20 동부일렉트로닉스 주식회사 반도체 장치의 트렌지스터 형성 방법
US20080246080A1 (en) * 2006-07-28 2008-10-09 Broadcom Corporation Shallow trench isolation (STI) based laterally diffused metal oxide semiconductor (LDMOS)
US7855414B2 (en) * 2006-07-28 2010-12-21 Broadcom Corporation Semiconductor device with increased breakdown voltage
US8110465B2 (en) 2007-07-30 2012-02-07 International Business Machines Corporation Field effect transistor having an asymmetric gate electrode
US20090142915A1 (en) * 2007-12-04 2009-06-04 Weize Xiong Gate structure and method of forming the same
JP5349885B2 (ja) * 2008-09-30 2013-11-20 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8283722B2 (en) 2010-06-14 2012-10-09 Broadcom Corporation Semiconductor device having an enhanced well region
US9123807B2 (en) * 2010-12-28 2015-09-01 Broadcom Corporation Reduction of parasitic capacitance in a semiconductor device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5222480A (en) * 1975-08-14 1977-02-19 Nippon Telegr & Teleph Corp <Ntt> Insulating gate field effect transistor
US4236167A (en) * 1978-02-06 1980-11-25 Rca Corporation Stepped oxide, high voltage MOS transistor with near intrinsic channel regions of different doping levels
US4173818A (en) * 1978-05-30 1979-11-13 International Business Machines Corporation Method for fabricating transistor structures having very short effective channels
JPS58115861A (ja) * 1981-12-29 1983-07-09 Fujitsu Ltd 半導体装置及びその製造方法
JPS62217666A (ja) * 1986-03-18 1987-09-25 Nippon Denso Co Ltd Misトランジスタ
JPS62293772A (ja) * 1986-06-13 1987-12-21 Seiko Epson Corp 半導体装置
JPS63137055A (ja) * 1986-11-28 1988-06-09 Suehiro Sharyo Seisakusho:Kk トレ−ラ−
JPS63144574A (ja) * 1986-12-09 1988-06-16 Nec Corp Mos型半導体装置
JPS63181468A (ja) * 1987-01-23 1988-07-26 Fujitsu Ltd Mis型電界効果トランジスタ
US4714519A (en) * 1987-03-30 1987-12-22 Motorola, Inc. Method for fabricating MOS transistors having gates with different work functions
JPH0666329B2 (ja) * 1988-06-30 1994-08-24 株式会社東芝 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0734475B2 (ja) 1995-04-12
US5031008A (en) 1991-07-09
KR900015353A (ko) 1990-10-26
JPH02237160A (ja) 1990-09-19
DE69015666T2 (de) 1995-06-14
EP0387722B1 (de) 1995-01-04
EP0387722A1 (de) 1990-09-19
KR930008536B1 (ko) 1993-09-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee