DE68911376D1 - MOSFET mit Drainspannungsdetektorfunktion. - Google Patents
MOSFET mit Drainspannungsdetektorfunktion.Info
- Publication number
- DE68911376D1 DE68911376D1 DE89305284T DE68911376T DE68911376D1 DE 68911376 D1 DE68911376 D1 DE 68911376D1 DE 89305284 T DE89305284 T DE 89305284T DE 68911376 T DE68911376 T DE 68911376T DE 68911376 D1 DE68911376 D1 DE 68911376D1
- Authority
- DE
- Germany
- Prior art keywords
- mosfet
- voltage detector
- drain voltage
- detector function
- function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
- H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
- H10D62/299—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
- H10D62/307—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations the doping variations being parallel to the channel lengths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
- H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12740388 | 1988-05-25 | ||
JP1034404A JP2698645B2 (ja) | 1988-05-25 | 1989-02-14 | Mosfet |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68911376D1 true DE68911376D1 (de) | 1994-01-27 |
DE68911376T2 DE68911376T2 (de) | 1994-05-05 |
Family
ID=26373212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE89305284T Expired - Fee Related DE68911376T2 (de) | 1988-05-25 | 1989-05-25 | MOSFET mit Drainspannungsdetektorfunktion. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4994904A (de) |
EP (1) | EP0343977B1 (de) |
JP (1) | JP2698645B2 (de) |
DE (1) | DE68911376T2 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5264719A (en) * | 1986-01-07 | 1993-11-23 | Harris Corporation | High voltage lateral semiconductor device |
JP2513874B2 (ja) * | 1989-12-28 | 1996-07-03 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US5258641A (en) * | 1989-12-28 | 1993-11-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device for extracting a signal used to monitor potential of a high voltage island at a low voltage island and method of manufacturing the same |
JP2715399B2 (ja) * | 1990-07-30 | 1998-02-18 | 株式会社デンソー | 電力用半導体装置 |
JP2833610B2 (ja) * | 1991-10-01 | 1998-12-09 | 株式会社デンソー | 絶縁ゲート型バイポーラトランジスタ |
US5289028A (en) * | 1991-11-04 | 1994-02-22 | Motorola, Inc. | High power semiconductor device with integral on-state voltage detection structure |
GB9207849D0 (en) * | 1992-04-09 | 1992-05-27 | Philips Electronics Uk Ltd | A semiconductor device |
US5286995A (en) * | 1992-07-14 | 1994-02-15 | Texas Instruments Incorporated | Isolated resurf LDMOS devices for multiple outputs on one die |
GB9215654D0 (en) * | 1992-07-23 | 1992-09-09 | Philips Electronics Uk Ltd | A semiconductor component |
US5282107A (en) * | 1992-09-01 | 1994-01-25 | Power Integrations, Inc. | Power MOSFET safe operating area current limiting device |
US5371394A (en) * | 1993-11-15 | 1994-12-06 | Motorola, Inc. | Double implanted laterally diffused MOS device and method thereof |
WO1995019646A1 (en) * | 1994-01-12 | 1995-07-20 | Atmel Corporation | Input/output transistors with optimized esd protection |
JP3275569B2 (ja) * | 1994-10-03 | 2002-04-15 | 富士電機株式会社 | 横型高耐圧電界効果トランジスタおよびその製造方法 |
KR970004074A (ko) * | 1995-06-05 | 1997-01-29 | 빈센트 비. 인그라시아 | 절연 게이트 전계 효과 트랜지스터 및 그 제조 방법 |
US5828112A (en) * | 1995-09-18 | 1998-10-27 | Kabushiki Kaisha Toshiba | Semiconductor device incorporating an output element having a current-detecting section |
US5817561A (en) * | 1996-09-30 | 1998-10-06 | Motorola, Inc. | Insulated gate semiconductor device and method of manufacture |
US5879999A (en) * | 1996-09-30 | 1999-03-09 | Motorola, Inc. | Method of manufacturing an insulated gate semiconductor device having a spacer extension |
JP3857462B2 (ja) * | 1999-03-19 | 2006-12-13 | 株式会社東芝 | 交流スイッチ回路 |
JP4995364B2 (ja) * | 1999-03-25 | 2012-08-08 | セイコーインスツル株式会社 | 半導体集積回路装置 |
DE60123813T2 (de) * | 2000-04-06 | 2007-08-02 | Asm America Inc., Phoenix | Sperrschicht für glasartige werkstoffe |
US6433573B1 (en) | 2000-08-07 | 2002-08-13 | Koninklijke Philips Electronics N.V. | Method and apparatus for measuring parameters of an electronic device |
US6855985B2 (en) * | 2002-09-29 | 2005-02-15 | Advanced Analogic Technologies, Inc. | Modular bipolar-CMOS-DMOS analog integrated circuit & power transistor technology |
US20080164537A1 (en) * | 2007-01-04 | 2008-07-10 | Jun Cai | Integrated complementary low voltage rf-ldmos |
CN100444371C (zh) * | 2004-09-13 | 2008-12-17 | 国际整流器公司 | 功率半导体封装 |
US20060097292A1 (en) * | 2004-10-29 | 2006-05-11 | Kabushiki Kaisha Toshiba | Semiconductor device |
JP2006332539A (ja) * | 2005-05-30 | 2006-12-07 | Sanken Electric Co Ltd | 半導体集積回路装置 |
JP2009081381A (ja) * | 2007-09-27 | 2009-04-16 | Panasonic Corp | 半導体装置 |
JP2009088317A (ja) | 2007-10-01 | 2009-04-23 | Panasonic Corp | 高耐圧半導体スイッチング素子 |
JP2009260119A (ja) * | 2008-04-18 | 2009-11-05 | Panasonic Corp | 半導体装置、及び該半導体装置を用いたエネルギー伝達装置 |
TWI451571B (zh) * | 2012-05-18 | 2014-09-01 | Leadtrend Tech Corp | 超高壓元件與操作超高壓元件的方法 |
CN103427603B (zh) * | 2012-05-22 | 2016-09-21 | 通嘉科技股份有限公司 | 超高压组件与操作超高压组件的方法 |
JP5983122B2 (ja) * | 2012-07-17 | 2016-08-31 | 富士通セミコンダクター株式会社 | 半導体装置 |
FR2995892B1 (fr) | 2012-09-27 | 2014-10-17 | Herakles | Procede de fabrication d'une piece en cmc |
JP6123516B2 (ja) * | 2013-06-28 | 2017-05-10 | 株式会社ソシオネクスト | 半導体装置 |
CN106601818B (zh) * | 2016-12-15 | 2019-09-10 | 深圳市锐骏半导体股份有限公司 | 电流检测电路的检测方法 |
US10355132B2 (en) * | 2017-03-20 | 2019-07-16 | North Carolina State University | Power MOSFETs with superior high frequency figure-of-merit |
FR3071830B1 (fr) | 2017-10-02 | 2021-03-12 | Safran Ceram | Procede pour la realisation d'une piece creuse en materiau composite a matrice ceramique |
US12110256B2 (en) | 2018-08-03 | 2024-10-08 | Safran Ceramics | Method for manufacturing a part made from CMC |
CN117334694B (zh) * | 2023-12-01 | 2024-01-26 | 南京芯舟科技有限公司 | 一种过流防护器件 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4344081A (en) * | 1980-04-14 | 1982-08-10 | Supertex, Inc. | Combined DMOS and a vertical bipolar transistor device and fabrication method therefor |
NL8204855A (nl) * | 1982-12-16 | 1984-07-16 | Philips Nv | Veldeffekttransistor met geisoleerde stuurelektrode en werkwijze ter vervaardiging daarvan. |
JPS60196974A (ja) * | 1984-03-19 | 1985-10-05 | Toshiba Corp | 導電変調型mosfet |
US4553084A (en) * | 1984-04-02 | 1985-11-12 | Motorola, Inc. | Current sensing circuit |
JPS60254764A (ja) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | Cmos回路装置 |
JPH073854B2 (ja) * | 1985-12-18 | 1995-01-18 | 株式会社日立製作所 | 複合半導体装置 |
US4823173A (en) * | 1986-01-07 | 1989-04-18 | Harris Corporation | High voltage lateral MOS structure with depleted top gate region |
JP2552880B2 (ja) * | 1986-11-12 | 1996-11-13 | シリコニックス・インコーポレイテッド | 垂直dmosセル構造 |
-
1989
- 1989-02-14 JP JP1034404A patent/JP2698645B2/ja not_active Expired - Fee Related
- 1989-05-24 US US07/356,371 patent/US4994904A/en not_active Expired - Lifetime
- 1989-05-25 EP EP89305284A patent/EP0343977B1/de not_active Expired - Lifetime
- 1989-05-25 DE DE89305284T patent/DE68911376T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0343977A2 (de) | 1989-11-29 |
JP2698645B2 (ja) | 1998-01-19 |
EP0343977A3 (en) | 1990-10-31 |
EP0343977B1 (de) | 1993-12-15 |
JPH02138773A (ja) | 1990-05-28 |
US4994904A (en) | 1991-02-19 |
DE68911376T2 (de) | 1994-05-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |