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DE68911376D1 - MOSFET mit Drainspannungsdetektorfunktion. - Google Patents

MOSFET mit Drainspannungsdetektorfunktion.

Info

Publication number
DE68911376D1
DE68911376D1 DE89305284T DE68911376T DE68911376D1 DE 68911376 D1 DE68911376 D1 DE 68911376D1 DE 89305284 T DE89305284 T DE 89305284T DE 68911376 T DE68911376 T DE 68911376T DE 68911376 D1 DE68911376 D1 DE 68911376D1
Authority
DE
Germany
Prior art keywords
mosfet
voltage detector
drain voltage
detector function
function
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89305284T
Other languages
English (en)
Other versions
DE68911376T2 (de
Inventor
Akio Intellectual Pro Nakagawa
Yoshihiro Intellectu Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE68911376D1 publication Critical patent/DE68911376D1/de
Application granted granted Critical
Publication of DE68911376T2 publication Critical patent/DE68911376T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/603Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • H10D62/299Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
    • H10D62/307Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations the doping variations being parallel to the channel lengths
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • H10D64/516Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
DE89305284T 1988-05-25 1989-05-25 MOSFET mit Drainspannungsdetektorfunktion. Expired - Fee Related DE68911376T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12740388 1988-05-25
JP1034404A JP2698645B2 (ja) 1988-05-25 1989-02-14 Mosfet

Publications (2)

Publication Number Publication Date
DE68911376D1 true DE68911376D1 (de) 1994-01-27
DE68911376T2 DE68911376T2 (de) 1994-05-05

Family

ID=26373212

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89305284T Expired - Fee Related DE68911376T2 (de) 1988-05-25 1989-05-25 MOSFET mit Drainspannungsdetektorfunktion.

Country Status (4)

Country Link
US (1) US4994904A (de)
EP (1) EP0343977B1 (de)
JP (1) JP2698645B2 (de)
DE (1) DE68911376T2 (de)

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Publication number Priority date Publication date Assignee Title
US5264719A (en) * 1986-01-07 1993-11-23 Harris Corporation High voltage lateral semiconductor device
JP2513874B2 (ja) * 1989-12-28 1996-07-03 三菱電機株式会社 半導体装置およびその製造方法
US5258641A (en) * 1989-12-28 1993-11-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for extracting a signal used to monitor potential of a high voltage island at a low voltage island and method of manufacturing the same
JP2715399B2 (ja) * 1990-07-30 1998-02-18 株式会社デンソー 電力用半導体装置
JP2833610B2 (ja) * 1991-10-01 1998-12-09 株式会社デンソー 絶縁ゲート型バイポーラトランジスタ
US5289028A (en) * 1991-11-04 1994-02-22 Motorola, Inc. High power semiconductor device with integral on-state voltage detection structure
GB9207849D0 (en) * 1992-04-09 1992-05-27 Philips Electronics Uk Ltd A semiconductor device
US5286995A (en) * 1992-07-14 1994-02-15 Texas Instruments Incorporated Isolated resurf LDMOS devices for multiple outputs on one die
GB9215654D0 (en) * 1992-07-23 1992-09-09 Philips Electronics Uk Ltd A semiconductor component
US5282107A (en) * 1992-09-01 1994-01-25 Power Integrations, Inc. Power MOSFET safe operating area current limiting device
US5371394A (en) * 1993-11-15 1994-12-06 Motorola, Inc. Double implanted laterally diffused MOS device and method thereof
WO1995019646A1 (en) * 1994-01-12 1995-07-20 Atmel Corporation Input/output transistors with optimized esd protection
JP3275569B2 (ja) * 1994-10-03 2002-04-15 富士電機株式会社 横型高耐圧電界効果トランジスタおよびその製造方法
KR970004074A (ko) * 1995-06-05 1997-01-29 빈센트 비. 인그라시아 절연 게이트 전계 효과 트랜지스터 및 그 제조 방법
US5828112A (en) * 1995-09-18 1998-10-27 Kabushiki Kaisha Toshiba Semiconductor device incorporating an output element having a current-detecting section
US5817561A (en) * 1996-09-30 1998-10-06 Motorola, Inc. Insulated gate semiconductor device and method of manufacture
US5879999A (en) * 1996-09-30 1999-03-09 Motorola, Inc. Method of manufacturing an insulated gate semiconductor device having a spacer extension
JP3857462B2 (ja) * 1999-03-19 2006-12-13 株式会社東芝 交流スイッチ回路
JP4995364B2 (ja) * 1999-03-25 2012-08-08 セイコーインスツル株式会社 半導体集積回路装置
DE60123813T2 (de) * 2000-04-06 2007-08-02 Asm America Inc., Phoenix Sperrschicht für glasartige werkstoffe
US6433573B1 (en) 2000-08-07 2002-08-13 Koninklijke Philips Electronics N.V. Method and apparatus for measuring parameters of an electronic device
US6855985B2 (en) * 2002-09-29 2005-02-15 Advanced Analogic Technologies, Inc. Modular bipolar-CMOS-DMOS analog integrated circuit & power transistor technology
US20080164537A1 (en) * 2007-01-04 2008-07-10 Jun Cai Integrated complementary low voltage rf-ldmos
CN100444371C (zh) * 2004-09-13 2008-12-17 国际整流器公司 功率半导体封装
US20060097292A1 (en) * 2004-10-29 2006-05-11 Kabushiki Kaisha Toshiba Semiconductor device
JP2006332539A (ja) * 2005-05-30 2006-12-07 Sanken Electric Co Ltd 半導体集積回路装置
JP2009081381A (ja) * 2007-09-27 2009-04-16 Panasonic Corp 半導体装置
JP2009088317A (ja) 2007-10-01 2009-04-23 Panasonic Corp 高耐圧半導体スイッチング素子
JP2009260119A (ja) * 2008-04-18 2009-11-05 Panasonic Corp 半導体装置、及び該半導体装置を用いたエネルギー伝達装置
TWI451571B (zh) * 2012-05-18 2014-09-01 Leadtrend Tech Corp 超高壓元件與操作超高壓元件的方法
CN103427603B (zh) * 2012-05-22 2016-09-21 通嘉科技股份有限公司 超高压组件与操作超高压组件的方法
JP5983122B2 (ja) * 2012-07-17 2016-08-31 富士通セミコンダクター株式会社 半導体装置
FR2995892B1 (fr) 2012-09-27 2014-10-17 Herakles Procede de fabrication d'une piece en cmc
JP6123516B2 (ja) * 2013-06-28 2017-05-10 株式会社ソシオネクスト 半導体装置
CN106601818B (zh) * 2016-12-15 2019-09-10 深圳市锐骏半导体股份有限公司 电流检测电路的检测方法
US10355132B2 (en) * 2017-03-20 2019-07-16 North Carolina State University Power MOSFETs with superior high frequency figure-of-merit
FR3071830B1 (fr) 2017-10-02 2021-03-12 Safran Ceram Procede pour la realisation d'une piece creuse en materiau composite a matrice ceramique
US12110256B2 (en) 2018-08-03 2024-10-08 Safran Ceramics Method for manufacturing a part made from CMC
CN117334694B (zh) * 2023-12-01 2024-01-26 南京芯舟科技有限公司 一种过流防护器件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4344081A (en) * 1980-04-14 1982-08-10 Supertex, Inc. Combined DMOS and a vertical bipolar transistor device and fabrication method therefor
NL8204855A (nl) * 1982-12-16 1984-07-16 Philips Nv Veldeffekttransistor met geisoleerde stuurelektrode en werkwijze ter vervaardiging daarvan.
JPS60196974A (ja) * 1984-03-19 1985-10-05 Toshiba Corp 導電変調型mosfet
US4553084A (en) * 1984-04-02 1985-11-12 Motorola, Inc. Current sensing circuit
JPS60254764A (ja) * 1984-05-31 1985-12-16 Fujitsu Ltd Cmos回路装置
JPH073854B2 (ja) * 1985-12-18 1995-01-18 株式会社日立製作所 複合半導体装置
US4823173A (en) * 1986-01-07 1989-04-18 Harris Corporation High voltage lateral MOS structure with depleted top gate region
JP2552880B2 (ja) * 1986-11-12 1996-11-13 シリコニックス・インコーポレイテッド 垂直dmosセル構造

Also Published As

Publication number Publication date
EP0343977A2 (de) 1989-11-29
JP2698645B2 (ja) 1998-01-19
EP0343977A3 (en) 1990-10-31
EP0343977B1 (de) 1993-12-15
JPH02138773A (ja) 1990-05-28
US4994904A (en) 1991-02-19
DE68911376T2 (de) 1994-05-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee