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DE68917813D1 - Verfahren und Vorrichtung zum Spritzgiessen von Leiterplatten. - Google Patents

Verfahren und Vorrichtung zum Spritzgiessen von Leiterplatten.

Info

Publication number
DE68917813D1
DE68917813D1 DE68917813T DE68917813T DE68917813D1 DE 68917813 D1 DE68917813 D1 DE 68917813D1 DE 68917813 T DE68917813 T DE 68917813T DE 68917813 T DE68917813 T DE 68917813T DE 68917813 D1 DE68917813 D1 DE 68917813D1
Authority
DE
Germany
Prior art keywords
printed circuit
injection molding
circuit boards
molding printed
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68917813T
Other languages
English (en)
Other versions
DE68917813T2 (de
Inventor
Russel William Boehm
Rex Allan Guinn
Hans Joachim Koerner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68917813D1 publication Critical patent/DE68917813D1/de
Publication of DE68917813T2 publication Critical patent/DE68917813T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/43—Removing or ejecting moulded articles using fluid under pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
DE68917813T 1988-06-29 1989-06-07 Verfahren und Vorrichtung zum Spritzgiessen von Leiterplatten. Expired - Fee Related DE68917813T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/212,815 US4861534A (en) 1988-06-29 1988-06-29 Method and apparatus for the injection molding of circuit boards

Publications (2)

Publication Number Publication Date
DE68917813D1 true DE68917813D1 (de) 1994-10-06
DE68917813T2 DE68917813T2 (de) 1995-03-30

Family

ID=22792531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68917813T Expired - Fee Related DE68917813T2 (de) 1988-06-29 1989-06-07 Verfahren und Vorrichtung zum Spritzgiessen von Leiterplatten.

Country Status (4)

Country Link
US (1) US4861534A (de)
EP (1) EP0349460B1 (de)
JP (1) JPH0226718A (de)
DE (1) DE68917813T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2693863B2 (ja) * 1990-11-29 1997-12-24 ポリプラスチックス株式会社 複数の独立した立体的導電回路を内蔵封入した立体成形品の製造方法
US5252280A (en) * 1992-04-08 1993-10-12 Motisi Stephen A Method for filling an injection mold
JPH08438B2 (ja) * 1992-08-12 1996-01-10 東北ムネカタ株式会社 プラスチック成形品およびその製造方法と成形用金型
JPH0780745A (ja) * 1993-09-13 1995-03-28 Yasuda Kogyo Kk 工作機械の暖機運転時間短縮方法
US5660782A (en) * 1995-05-31 1997-08-26 The Whitaker Corporation Method and apparatus for injection molding of selected parts
KR0156970B1 (ko) * 1995-08-01 1998-12-15 유기범 광 케이블 접속용 다심 콘넥터를 제작하기 위한 금형 장치
US5711971A (en) * 1995-08-25 1998-01-27 The Whitaker Corporation Reconfigurable mold having traveling ejector system
US5731013A (en) * 1995-09-13 1998-03-24 The Whitaker Corporation Reconfigurable mold having travelling separator assist
CA2179947A1 (en) * 1995-09-25 1997-03-26 Michael Gunnar Johnson Mold assembly for forming apertures in a molded body
US5783224A (en) * 1995-10-31 1998-07-21 The Whitaker Corporation Mold laminate assembly for an injection mold machine
US6078359A (en) * 1996-07-15 2000-06-20 The Regents Of The University Of California Vacuum compatible miniature CCD camera head
DE69918365T2 (de) 1998-04-28 2005-07-14 Sumitomo Wiring Systems, Ltd., Yokkaichi Steckverbindungspaar und Steckverbindersatz
JP3248484B2 (ja) 1998-04-28 2002-01-21 住友電装株式会社 コネクタ成型金型
US6537053B1 (en) 2000-01-28 2003-03-25 Plastic Moldings Company, Llc Modular molding system, and modules for use therewith
US20030025227A1 (en) * 2001-08-02 2003-02-06 Zograph, Llc Reproduction of relief patterns
US20030160362A1 (en) * 2002-02-22 2003-08-28 Lighthouse Industries, Inc. Method of injection molding an article having an array of openings
US7198479B2 (en) * 2004-11-04 2007-04-03 Industrial Technology Research Institute Ejector with multi-ejection pins
ES2329317B1 (es) * 2006-05-16 2011-10-18 Bosnor, Sl Metodo de fabricacion de placas conductivas, aplicables al recubrimiento de suelos o paredes, placa conductiva y maquina inyectora.
TWM309622U (en) * 2006-07-26 2007-04-11 Altek Corp Structure of fastening pillar
DE102010041681A1 (de) * 2010-09-29 2012-03-29 BSH Bosch und Siemens Hausgeräte GmbH Spritzgussverfahren zur wahlweisen Herstellung von Formteilen mit und ohne Durchbruch
US9731349B2 (en) * 2015-03-26 2017-08-15 Pratt & Whitney Canada Corp. Mold assembly and guide element thereof
US11902424B2 (en) * 2020-11-20 2024-02-13 International Business Machines Corporation Secure re-encryption of homomorphically encrypted data
DE102022134432A1 (de) * 2022-12-21 2024-06-27 Komdruck Ag Markierungsmodul, Werkzeug zum Ausformen eines Kunststoffkörpers und Verfahren zum Betrieb eines Markierungsmoduls

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3438127A (en) * 1965-10-21 1969-04-15 Friden Inc Manufacture of circuit modules using etched molds
US3889363A (en) * 1971-02-16 1975-06-17 Richard P Davis Method of making printed circuit boards
US3930778A (en) * 1974-07-24 1976-01-06 Roncelli Paul E Molding ejector device for interchangeable molds
US4164523A (en) * 1976-09-09 1979-08-14 Robert Hanning Method of injection-molding and cooling of shaped synthetic-resin bodies
US4342549A (en) * 1978-12-11 1982-08-03 Lemelson Jerome H Apparatus for coding articles
US4491295A (en) * 1981-02-04 1985-01-01 Ashcombe Products Company Gang cutting tool assembly and method of forming same
DE3124020C2 (de) * 1981-06-19 1983-05-19 Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen Adapterblock zur Anwendung in der Fluid-Technik sowie Verfahren zur Herstellung eines derartigen Adapterblocks
DE3136419A1 (de) * 1981-09-14 1983-03-31 Maschinenfabrik J. Dieffenbacher Gmbh & Co, 7519 Eppingen Spritzpresse
US4552716A (en) * 1983-12-19 1985-11-12 International Business Machines Corporation Method for manufacturing a wire matrix print wire guiding device
US4726925A (en) * 1984-10-09 1988-02-23 Frederick Binder Molding of elongate plastic cylinders
US4591220A (en) * 1984-10-12 1986-05-27 Rollin Mettler Injection molded multi-layer circuit board and method of making same

Also Published As

Publication number Publication date
JPH0586897B2 (de) 1993-12-14
EP0349460A3 (de) 1991-09-18
DE68917813T2 (de) 1995-03-30
EP0349460B1 (de) 1994-08-31
EP0349460A2 (de) 1990-01-03
US4861534A (en) 1989-08-29
JPH0226718A (ja) 1990-01-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee