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DE69015375D1 - Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers. - Google Patents

Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers.

Info

Publication number
DE69015375D1
DE69015375D1 DE69015375T DE69015375T DE69015375D1 DE 69015375 D1 DE69015375 D1 DE 69015375D1 DE 69015375 T DE69015375 T DE 69015375T DE 69015375 T DE69015375 T DE 69015375T DE 69015375 D1 DE69015375 D1 DE 69015375D1
Authority
DE
Germany
Prior art keywords
electronic components
mounting electronic
adhesive
circuit board
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69015375T
Other languages
English (en)
Other versions
DE69015375T2 (de
Inventor
Takashi Akiguchi
Yukio Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1007219A external-priority patent/JPH0832861B2/ja
Priority claimed from JP722289A external-priority patent/JP2653146B2/ja
Priority claimed from JP722189A external-priority patent/JP2697064B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69015375D1 publication Critical patent/DE69015375D1/de
Application granted granted Critical
Publication of DE69015375T2 publication Critical patent/DE69015375T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69015375T 1989-01-13 1990-01-12 Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers. Expired - Fee Related DE69015375T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1007219A JPH0832861B2 (ja) 1989-01-13 1989-01-13 電子部品用接着剤
JP722289A JP2653146B2 (ja) 1989-01-13 1989-01-13 電子部品の取付け方法
JP722189A JP2697064B2 (ja) 1989-01-13 1989-01-13 電子部品の取付け方法

Publications (2)

Publication Number Publication Date
DE69015375D1 true DE69015375D1 (de) 1995-02-09
DE69015375T2 DE69015375T2 (de) 1995-05-04

Family

ID=27277514

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69015375T Expired - Fee Related DE69015375T2 (de) 1989-01-13 1990-01-12 Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers.

Country Status (3)

Country Link
US (1) US5427642A (de)
EP (1) EP0378233B1 (de)
DE (1) DE69015375T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0141229B1 (ko) * 1993-09-22 1998-07-15 김광호 국부 경화방법
JP3030201B2 (ja) * 1994-04-26 2000-04-10 富士通株式会社 半導体装置の製造方法及び半導体装置の製造装置
EP1089608B1 (de) * 1998-02-27 2006-11-02 Matsushita Electric Industrial Co., Ltd. Bauteilerkennungsverfahren und -vorrichtung
US5880203A (en) * 1998-05-28 1999-03-09 Eurotech Ltd. Adhesive composition
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6251211B1 (en) * 1998-07-22 2001-06-26 Micron Technology, Inc. Circuitry interconnection method
US6727320B2 (en) * 1998-11-02 2004-04-27 Henkel Loctite Corporation Polymerizable compositions in non-flowable forms
JP3453075B2 (ja) * 1998-11-13 2003-10-06 武蔵エンジニアリング株式会社 ペーストの形成方法
US7229517B2 (en) * 2000-06-06 2007-06-12 Applied Extrusion Technologies, Inc. Labeling apparatus and method employing radiation curable adhesive
US6551439B1 (en) 2000-06-06 2003-04-22 Applied Extrusion Technologies, Inc. Ultraviolet labeling apparatus and method
US7074295B2 (en) * 2000-06-06 2006-07-11 Applied Extrusion Technologies, Inc. Labelling apparatus and method for correcting visual adhesive defects
AU2001275318B2 (en) * 2000-06-06 2004-09-30 Applied Extrusion Technologies Inc. Labeling apparatus and method employing radiation curable adhesive
JP3696131B2 (ja) * 2001-07-10 2005-09-14 株式会社東芝 アクティブマトリクス基板及びその製造方法
DE10327195A1 (de) * 2003-05-02 2004-11-25 Marconi Communications Gmbh Klebeverfahren und -vorrichtung
EP1621058B1 (de) * 2003-05-02 2008-05-21 Ericsson AB Klebeverfahren und -vorrichtung
US7404613B2 (en) * 2004-06-30 2008-07-29 Lexmark International, Inc. Inkjet print cartridge having an adhesive with improved dimensional control
US7297407B2 (en) * 2004-09-20 2007-11-20 E. I. Du Pont De Nemours And Company Glass laminates for reduction of sound transmission
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
US20080310110A1 (en) * 2007-06-12 2008-12-18 General Electric Company System and method for mounting a cooling device and method of fabrication
EP3471135A4 (de) * 2016-06-08 2019-05-01 Fuji Corporation Verfahren zur herstellung einer schaltung
EP4021153A4 (de) * 2019-08-23 2022-09-07 Fuji Corporation Elektronikschaltvorrichtung und ihr herstellungsverfahren

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3746682A (en) * 1972-10-03 1973-07-17 Goodyear Tire & Rubber Synergistic antiblock systems for a 2-ethhylhexyl acrylate/acrylonitrile copolymer
US3928270A (en) * 1973-02-08 1975-12-23 Phillips Petroleum Co Thermosetting compositions
US4135033A (en) * 1977-02-16 1979-01-16 Lawton William R Heat-activated adhesive coating
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
JPS5542890A (en) * 1978-09-22 1980-03-26 Fuji Photo Film Co Ltd Desensitizing solution for lithographic printing
US4382108A (en) * 1981-12-21 1983-05-03 The Upjohn Company Novel compositions and process
JPS58180090A (ja) * 1982-04-15 1983-10-21 松下電器産業株式会社 電子部品の取付け方法
US4444932A (en) * 1982-06-01 1984-04-24 Atlantic Richfield Company Moldable compositions having improved surface gloss
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
EP0154819B1 (de) * 1984-01-07 1988-07-06 Takeda Chemical Industries, Ltd. Verfahren zum Verkleben und Klebstoffmasse dafür
JPS634510A (ja) * 1986-06-25 1988-01-09 アイシン精機株式会社 電気，電子部品の封止方法
DE3706860A1 (de) * 1987-03-04 1988-09-15 Byk Chemie Gmbh Thixotrope zubereitungen, verwendung von polycarbonsaeureamiden zu ihrer herstellung und mit polycarbonsaeureamiden beschichtetes siliciumdioxid

Also Published As

Publication number Publication date
EP0378233B1 (de) 1994-12-28
US5427642A (en) 1995-06-27
DE69015375T2 (de) 1995-05-04
EP0378233A3 (de) 1991-10-16
EP0378233A2 (de) 1990-07-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee