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DE68920540D1 - Schaltungsteil unter Verwendung von mehrschichtigen gedruckten Leiterplatten und Verfahren zu dessen Herstellung. - Google Patents

Schaltungsteil unter Verwendung von mehrschichtigen gedruckten Leiterplatten und Verfahren zu dessen Herstellung.

Info

Publication number
DE68920540D1
DE68920540D1 DE68920540T DE68920540T DE68920540D1 DE 68920540 D1 DE68920540 D1 DE 68920540D1 DE 68920540 T DE68920540 T DE 68920540T DE 68920540 T DE68920540 T DE 68920540T DE 68920540 D1 DE68920540 D1 DE 68920540D1
Authority
DE
Germany
Prior art keywords
production
multilayer printed
printed circuit
circuit boards
circuit part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920540T
Other languages
English (en)
Other versions
DE68920540T2 (de
Inventor
Cynthia J Broddus
Eugene M Scales
Carl C Sissenstein
John P Wiley
John R Jephson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68920540D1 publication Critical patent/DE68920540D1/de
Application granted granted Critical
Publication of DE68920540T2 publication Critical patent/DE68920540T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
DE68920540T 1988-10-11 1989-07-12 Schaltungsteil unter Verwendung von mehrschichtigen gedruckten Leiterplatten und Verfahren zu dessen Herstellung. Expired - Fee Related DE68920540T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/255,310 US4916260A (en) 1988-10-11 1988-10-11 Circuit member for use in multilayered printed circuit board assembly and method of making same

Publications (2)

Publication Number Publication Date
DE68920540D1 true DE68920540D1 (de) 1995-02-23
DE68920540T2 DE68920540T2 (de) 1995-07-06

Family

ID=22967744

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920540T Expired - Fee Related DE68920540T2 (de) 1988-10-11 1989-07-12 Schaltungsteil unter Verwendung von mehrschichtigen gedruckten Leiterplatten und Verfahren zu dessen Herstellung.

Country Status (4)

Country Link
US (1) US4916260A (de)
EP (1) EP0365755B1 (de)
JP (1) JPH0728134B2 (de)
DE (1) DE68920540T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2760829B2 (ja) * 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
US5229550A (en) * 1990-10-30 1993-07-20 International Business Machines Corporation Encapsulated circuitized power core alignment and lamination
US5315069A (en) * 1992-10-02 1994-05-24 Compaq Computer Corp. Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards
DE4300616A1 (de) * 1993-01-13 1994-07-14 Herberts Gmbh Emulgatorfreies, hitzehärtbares Überzugsmittel, dessen Herstellung und Verwendung
US5603847A (en) * 1993-04-07 1997-02-18 Zycon Corporation Annular circuit components coupled with printed circuit board through-hole
US5357672A (en) * 1993-08-13 1994-10-25 Lsi Logic Corporation Method and system for fabricating IC packages from laminated boards and heat spreader
US5755026A (en) * 1996-08-15 1998-05-26 Delco Electronics Corporation Method of preventing condensation on a surface housing an electronic apparatus
US5830374A (en) * 1996-09-05 1998-11-03 International Business Machines Corporation Method for producing multi-layer circuit board and resulting article of manufacture
US6106923A (en) * 1997-05-20 2000-08-22 Fujitsu Limited Venting hole designs for multilayer conductor-dielectric structures
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
US6720501B1 (en) * 1998-04-14 2004-04-13 Formfactor, Inc. PC board having clustered blind vias
US6637102B2 (en) * 2000-07-19 2003-10-28 Ngk Insulators, Ltd. Process for producing an industrial member having throughholes of high aspect ratio
JP3708005B2 (ja) * 2000-08-09 2005-10-19 日本無線株式会社 プリント配線板の穴埋め方法
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法
US20030168249A1 (en) * 2002-02-14 2003-09-11 Ngk Spark Plug Co., Ltd. Wiring board and method for producing the same
WO2004004432A1 (en) * 2002-06-27 2004-01-08 Ppg Industries Ohio, Inc. Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
US7152313B2 (en) * 2003-11-26 2006-12-26 Intel Corporation Package substrate for integrated circuit and method of making the substrate
FR2913173B1 (fr) * 2007-02-22 2009-05-15 Airbus France Sa Carte electronique et aeronef la comportant
US20110051385A1 (en) * 2009-08-31 2011-03-03 Gainteam Holdings Limited High-density memory assembly
GB2482342A (en) * 2010-07-30 2012-02-01 Vestas Wind Sys As Cooling of fibrous sheet for composite structure during machining
US11596058B2 (en) * 2019-03-08 2023-02-28 Qorvo Us, Inc. Fiducials for laminate structures
KR20230103659A (ko) * 2021-12-31 2023-07-07 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판 및 이를 포함하는 전자장치

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516156A (en) * 1967-12-11 1970-06-23 Ibm Circuit package assembly process
US3617613A (en) * 1968-10-17 1971-11-02 Spaulding Fibre Co Punchable printed circuit board base
US3739469A (en) * 1971-12-27 1973-06-19 Ibm Multilayer printed circuit board and method of manufacture
ES401673A1 (es) * 1972-04-12 1972-07-01 Orbaiceta Mejoras introducidas en la fabricacion de circuitos impre- sos de pequeno formato para generacion de calor.
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
US3958317A (en) * 1974-09-25 1976-05-25 Rockwell International Corporation Copper surface treatment for epoxy bonding
US4105819A (en) * 1975-03-04 1978-08-08 Technigaz Laminated sheets particularly for cryogenic enclosures, pipes, and the like
US4093768A (en) * 1976-02-19 1978-06-06 Freeman Chemical Corporation Copper foil electrical laminate with reinforced plastics
US4191800A (en) * 1976-05-27 1980-03-04 Bell Telephone Laboratories, Incorporated Devices employing flexible substrates and method for making same
DE2952440C2 (de) * 1978-12-27 1982-12-16 Mitsubishi Gas Chemical Co., Inc., Tokyo Quervernetzbare Harzzusammensetzung und deren Verwendung zur Herstellung eines Laminats
JPS55126418A (en) * 1979-03-26 1980-09-30 Kanegafuchi Chem Ind Co Ltd Method and apparatus for continuous preparation of laminated material
US4446188A (en) * 1979-12-20 1984-05-01 The Mica Corporation Multi-layered circuit board
JPS5856276B2 (ja) * 1980-03-31 1983-12-14 日立化成工業株式会社 難燃耐熱性銅張り積層板の製造法
US4522667A (en) * 1980-06-25 1985-06-11 General Electric Company Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion
US4496793A (en) * 1980-06-25 1985-01-29 General Electric Company Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion
FR2493662A1 (fr) * 1980-11-05 1982-05-07 Rhone Poulenc Ind Substrats metallises pour circuits imprimes et leur procede de preparation
US4366198A (en) * 1981-03-24 1982-12-28 Rca Corporation Sheet material separation construction
US4446173A (en) * 1981-08-11 1984-05-01 Glasteel Tennessee, Inc. Copper-clad polyester-glass fiber laminates using zinc-coated copper
US4420509A (en) * 1981-08-11 1983-12-13 Glasteel Tennessee, Inc. Copper-clad polyester-glass fiber laminates
US4554405A (en) * 1982-06-28 1985-11-19 International Business Machines Corporation High density encapsulated wire circuit board
US4662963A (en) * 1982-06-28 1987-05-05 International Business Machines Corporation Method of manufacturing high density encapsulated wire circuit board
US4515878A (en) * 1982-08-30 1985-05-07 International Business Machines Corporation Printed circuit board modification process
US4551747A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
DE3371592D1 (en) * 1983-06-01 1987-06-19 Ibm Deutschland Production method of printed circuits with one conductive layer
US4560962A (en) * 1983-08-30 1985-12-24 Burroughs Corporation Multilayered printed circuit board with controlled 100 ohm impedance
US4689270A (en) * 1984-07-20 1987-08-25 W. C. Heraeus Gmbh Composite substrate for printed circuits and printed circuit-substrate combination
DE3576900D1 (de) * 1985-12-30 1990-05-03 Ibm Deutschland Verfahren zum herstellen von gedruckten schaltungen.
US4700016A (en) * 1986-05-16 1987-10-13 International Business Machines Corporation Printed circuit board with vias at fixed and selectable locations
JPS62274795A (ja) * 1986-05-23 1987-11-28 新神戸電機株式会社 多層回路板の製造法
EP0264105A3 (de) * 1986-10-17 1988-07-27 Hitachi, Ltd. Verfahren zur Herstellung einer mehrschichtigen Leiterplatte mit metallischem Kern

Also Published As

Publication number Publication date
EP0365755B1 (de) 1995-01-11
EP0365755A1 (de) 1990-05-02
US4916260A (en) 1990-04-10
JPH0728134B2 (ja) 1995-03-29
JPH02129994A (ja) 1990-05-18
DE68920540T2 (de) 1995-07-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee