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DE60315575D1 - Verfahren und Vorrichtung zur Untersuchung von Oberflächen - Google Patents

Verfahren und Vorrichtung zur Untersuchung von Oberflächen

Info

Publication number
DE60315575D1
DE60315575D1 DE60315575T DE60315575T DE60315575D1 DE 60315575 D1 DE60315575 D1 DE 60315575D1 DE 60315575 T DE60315575 T DE 60315575T DE 60315575 T DE60315575 T DE 60315575T DE 60315575 D1 DE60315575 D1 DE 60315575D1
Authority
DE
Germany
Prior art keywords
examination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60315575T
Other languages
English (en)
Other versions
DE60315575T2 (de
Inventor
Hisashi Isozaki
Michihiro Yamazaki
Hiroshi Yoshikawa
Takehiro Takase
Yutaka Shida
Yoichiro Iwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topcon Corp
Original Assignee
Topcon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topcon Corp filed Critical Topcon Corp
Application granted granted Critical
Publication of DE60315575D1 publication Critical patent/DE60315575D1/de
Publication of DE60315575T2 publication Critical patent/DE60315575T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
DE60315575T 2002-10-09 2003-10-08 Verfahren und Vorrichtung zur Untersuchung von Oberflächen Expired - Lifetime DE60315575T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002295613 2002-10-09
JP2002295613A JP4316853B2 (ja) 2002-10-09 2002-10-09 表面検査方法および装置

Publications (2)

Publication Number Publication Date
DE60315575D1 true DE60315575D1 (de) 2007-09-27
DE60315575T2 DE60315575T2 (de) 2008-04-30

Family

ID=32025528

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60315575T Expired - Lifetime DE60315575T2 (de) 2002-10-09 2003-10-08 Verfahren und Vorrichtung zur Untersuchung von Oberflächen

Country Status (8)

Country Link
US (1) US7394532B2 (de)
EP (1) EP1408326B1 (de)
JP (1) JP4316853B2 (de)
KR (1) KR100721231B1 (de)
CN (1) CN1272844C (de)
DE (1) DE60315575T2 (de)
IL (1) IL158217A0 (de)
TW (1) TWI306946B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005019813A1 (en) * 2003-08-18 2005-03-03 Insight Control Systems International, Inc. Method and system for detection of barrier core material in container preforms
JP4883762B2 (ja) * 2005-03-31 2012-02-22 大日本スクリーン製造株式会社 ムラ検査装置およびムラ検査方法
JP4826750B2 (ja) 2005-04-08 2011-11-30 オムロン株式会社 欠陥検査方法およびその方法を用いた欠陥検査装置
US8073240B2 (en) * 2007-05-07 2011-12-06 Kla-Tencor Corp. Computer-implemented methods, computer-readable media, and systems for identifying one or more optical modes of an inspection system as candidates for use in inspection of a layer of a wafer
WO2010073527A1 (ja) * 2008-12-26 2010-07-01 株式会社 日立ハイテクノロジーズ 検査方法及び検査装置
JP5444823B2 (ja) 2009-05-01 2014-03-19 信越半導体株式会社 Ｓｏｉウェーハの検査方法
JP2011075401A (ja) * 2009-09-30 2011-04-14 Hitachi High-Technologies Corp インライン基板検査装置の光学系校正方法及びインライン基板検査装置
KR101376450B1 (ko) * 2011-06-01 2014-03-19 다이닛뽕스크린 세이조오 가부시키가이샤 화상취득장치, 패턴검사장치 및 화상취득방법
US9606069B2 (en) * 2014-06-25 2017-03-28 Kla-Tencor Corporation Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate
US9599573B2 (en) * 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
TWI583971B (zh) * 2015-01-16 2017-05-21 旺矽科技股份有限公司 檢測設備之操作方法
DE102015114065A1 (de) * 2015-08-25 2017-03-02 Brodmann Technologies GmbH Verfahren und Einrichtung zur berührungslosen Beurteilung der Oberflächenbeschaffenheit eines Wafers
JP7304970B2 (ja) * 2019-11-14 2023-07-07 上▲海▼精▲測▼半▲導▼体技▲術▼有限公司 表面検出装置及び方法
US11609183B2 (en) * 2020-08-18 2023-03-21 Applied Materials, Inc. Methods and systems to measure properties of products on a moving blade in electronic device manufacturing machines

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4795260A (en) 1987-05-15 1989-01-03 Therma-Wave, Inc. Apparatus for locating and testing areas of interest on a workpiece
JPH0820371B2 (ja) * 1988-01-21 1996-03-04 株式会社ニコン 欠陥検査装置及び欠陥検査方法
US5179422A (en) * 1991-05-15 1993-01-12 Environmental Research Institute Of Michigan Contamination detection system
US5381233A (en) * 1993-03-03 1995-01-10 National Tsing Hua University Polarized-light scatterometer for measuring the thickness of a film coated on the partial of a substrate
US5416594A (en) * 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
US5548404A (en) * 1994-09-23 1996-08-20 Sunshine Medical Instruments, Inc. Multiple wavelength polarization-modulated ellipsometer with phase-generated carrier
JPH09229396A (ja) * 1996-02-20 1997-09-05 Fujitsu General Ltd 空気調和機
JPH1164235A (ja) 1997-08-26 1999-03-05 Oki Electric Ind Co Ltd 実装部品自動検査システムおよび実装部品検査基準設定装置および実装部品検査基準設定方法
US6104481A (en) * 1997-11-11 2000-08-15 Kabushiki Kaisha Topcon Surface inspection apparatus
JP4215220B2 (ja) * 1997-11-21 2009-01-28 株式会社トプコン 表面検査方法及び表面検査装置
IL125964A (en) 1998-08-27 2003-10-31 Tevet Process Control Technolo Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate
JP4644329B2 (ja) * 2000-02-24 2011-03-02 株式会社トプコン 表面検査装置
JP4643785B2 (ja) * 2000-02-24 2011-03-02 株式会社トプコン 表面検査装置
JP4409701B2 (ja) * 2000-02-25 2010-02-03 株式会社トプコン 表面検査装置
JP4418078B2 (ja) 2000-04-03 2010-02-17 株式会社トプコン 表面検査装置
DE10042008A1 (de) * 2000-08-26 2002-03-07 Bosch Gmbh Robert Verfahren zum Entleeren des Druckmittels aus einem Hydroaggregat einer hydraulischen Bremsanlage von Kraftfahrzeugen
JP3941863B2 (ja) * 2002-03-27 2007-07-04 株式会社トプコン 表面検査方法及び表面検査装置
JP3729156B2 (ja) * 2002-06-07 2005-12-21 株式会社日立製作所 パターン欠陥検出方法およびその装置
JP4391082B2 (ja) * 2002-12-20 2009-12-24 株式会社トプコン 表面検査方法及びその装置

Also Published As

Publication number Publication date
KR20040032766A (ko) 2004-04-17
IL158217A0 (en) 2004-05-12
TW200417728A (en) 2004-09-16
JP4316853B2 (ja) 2009-08-19
US20040130727A1 (en) 2004-07-08
DE60315575T2 (de) 2008-04-30
US7394532B2 (en) 2008-07-01
EP1408326A3 (de) 2004-06-16
EP1408326B1 (de) 2007-08-15
EP1408326A2 (de) 2004-04-14
CN1272844C (zh) 2006-08-30
CN1497696A (zh) 2004-05-19
TWI306946B (en) 2009-03-01
KR100721231B1 (ko) 2007-05-22
JP2004132755A (ja) 2004-04-30

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