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DE60304505D1 - Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten - Google Patents

Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten

Info

Publication number
DE60304505D1
DE60304505D1 DE60304505T DE60304505T DE60304505D1 DE 60304505 D1 DE60304505 D1 DE 60304505D1 DE 60304505 T DE60304505 T DE 60304505T DE 60304505 T DE60304505 T DE 60304505T DE 60304505 D1 DE60304505 D1 DE 60304505D1
Authority
DE
Germany
Prior art keywords
polishing
conductive
article
substrate
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60304505T
Other languages
English (en)
Other versions
DE60304505T2 (de
Inventor
Yongqi Hu
Yan Wang
Alain Duboust
Feng Q Liu
Rashid Mavliev
Liang-Yuh Chen
Ratson Morad
Sasson Somekh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE60304505D1 publication Critical patent/DE60304505D1/de
Application granted granted Critical
Publication of DE60304505T2 publication Critical patent/DE60304505T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electroplating Methods And Accessories (AREA)
DE60304505T 2002-05-07 2003-05-02 Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten Expired - Lifetime DE60304505T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US140010 1987-12-31
US10/140,010 US6979248B2 (en) 2002-05-07 2002-05-07 Conductive polishing article for electrochemical mechanical polishing

Publications (2)

Publication Number Publication Date
DE60304505D1 true DE60304505D1 (de) 2006-05-24
DE60304505T2 DE60304505T2 (de) 2006-09-07

Family

ID=29249779

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60304505T Expired - Lifetime DE60304505T2 (de) 2002-05-07 2003-05-02 Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten

Country Status (9)

Country Link
US (1) US6979248B2 (de)
EP (1) EP1361023B1 (de)
JP (2) JP2004134732A (de)
KR (3) KR20030087569A (de)
CN (3) CN2737501Y (de)
AT (1) ATE322959T1 (de)
DE (1) DE60304505T2 (de)
SG (1) SG117444A1 (de)
TW (3) TWI274386B (de)

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CN2737501Y (zh) 2005-11-02
DE60304505T2 (de) 2006-09-07
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CN1458671A (zh) 2003-11-26
KR200331228Y1 (ko) 2003-10-23
JP2004134732A (ja) 2004-04-30
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