CN2816904Y - Liquid-cooled computer structure - Google Patents
Liquid-cooled computer structure Download PDFInfo
- Publication number
- CN2816904Y CN2816904Y CN 200520113019 CN200520113019U CN2816904Y CN 2816904 Y CN2816904 Y CN 2816904Y CN 200520113019 CN200520113019 CN 200520113019 CN 200520113019 U CN200520113019 U CN 200520113019U CN 2816904 Y CN2816904 Y CN 2816904Y
- Authority
- CN
- China
- Prior art keywords
- liquid
- power supply
- computer
- casing
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域technical field
本实用新型是关于一种电脑结构,尤指一种适用于具有液冷式散热系统的电脑结构。The utility model relates to a computer structure, in particular to a computer structure suitable for a liquid cooling heat dissipation system.
背景技术Background technique
请参阅图1为一公知液冷式电脑内部结构的俯视图。图中显示有一公知液冷式散热系统4,液冷式散热系统4包含散热风扇45,液冷式散热系统4主要功用为散逸电脑中央处理器运作时产生的高热。Please refer to FIG. 1 , which is a top view of the internal structure of a conventional liquid-cooled computer. The figure shows a known liquid-cooled
然而,公知散热风扇45装设的位置没有特定方向,只是将热风吹散至电脑机壳内部空间,无法有效地将液冷式散热系统4自中央处理器所吸收的热能,以有效方式排出电脑机壳之外,而仅在机壳的内产生内部紊流,散热效率并不理想。However, the known
实用新型内容Utility model content
本实用新型的目的在于提供一种液冷式电脑的结构。由本实用新型的实施,不但能够增加流入电源供应器内的气流量,针对电源供应器散逸更多热能外,还可在电脑外壳的内部空间里形成有效风场,以引导各种电子元件所发出的高热,能顺利流进电源供应器并一起排出电脑外壳之外。The purpose of the utility model is to provide a structure of a liquid-cooled computer. The implementation of the utility model can not only increase the flow of air flowing into the power supply, but also dissipate more heat energy from the power supply, and also form an effective wind field in the internal space of the computer shell to guide the energy emitted by various electronic components. The high heat can flow smoothly into the power supply and be discharged out of the computer case together.
为实现上述目的,本实用新型提供的液冷式电脑结构,包括:In order to achieve the above purpose, the liquid-cooled computer structure provided by the utility model includes:
一电脑外壳,包括有一内部空间、一侧面、及一出风口其贯设于该侧面上;A computer casing, including an inner space, a side, and an air outlet, which is provided through the side;
一电源供应器,组设于该电脑外壳的该内部空间内,该电源供应器并包括有一壳体、及一散热风扇,该壳体并包括有一前板、一侧板、及一后板,该前板开设有一前入风口其连通至该电脑外壳的该内部空间,该侧板开设有至少一个侧入风口,该后板开设有一后排风口其对应连通至该电脑外壳的该出风口,该散热风扇组设于该壳体内并对应至该前板的该前入风口;以及A power supply is assembled in the inner space of the computer casing, the power supply also includes a casing, and a cooling fan, and the casing includes a front panel, a side panel, and a rear panel, The front panel is provided with a front air inlet, which is connected to the internal space of the computer casing, the side panel is provided with at least one side air inlet, and the rear panel is provided with a rear air outlet, which is correspondingly connected to the air outlet of the computer casing. , the cooling fan group is arranged in the casing and corresponds to the front air inlet of the front plate; and
一液冷式散热系统,包括有一散热器、及一散热风扇其组设于该散热器的外侧,该散热器的内侧并组设于该电源供应器的该侧板外、并对应至该至少一个侧入风口。A liquid-cooled heat dissipation system includes a radiator and a cooling fan which are assembled on the outside of the radiator, and the inside of the radiator is arranged on the outside of the side plate of the power supply and correspond to the at least A side inlet.
其中该液冷式散热系统的该散热器包括有一散热鳍片模组。Wherein the radiator of the liquid-cooled heat dissipation system includes a heat dissipation fin module.
其中该液冷式散热系统并包括有一储液箱、一泵浦、一集热器、及复数支连通管,该等连通管依序将该储液箱、该泵浦、该集热器、及该散热器串接形成一循环管路。The liquid-cooled heat dissipation system also includes a liquid storage tank, a pump, a heat collector, and a plurality of connecting pipes, and the connecting pipes sequentially connect the liquid storage tank, the pump, the heat collector, and the radiator are connected in series to form a circulation pipeline.
其中该集热器贴附组设于一中央处理器上方。Wherein the heat collector attaching group is arranged above a central processing unit.
其中该电脑外壳包括一上盖、及一底壳。Wherein the computer case includes a top cover and a bottom case.
如此一来,当液冷式散热系统的散热风扇旋转而吹出气流,得以先流经散热器以带走热能,再经由电源供应器侧板上的至少一个侧入风口而进入电源供应器壳体内部;继而受到电源供应器的散热风扇旋转所产生的气流吹动,而一并经由电源供应器后板的后排风口、与电脑外壳侧面的出风口散逸至电脑外壳外部。In this way, when the heat dissipation fan of the liquid-cooled heat dissipation system rotates and the air blows out, it can first flow through the heat sink to take away heat energy, and then enter the power supply case through at least one side air inlet on the side plate of the power supply Inside; then blown by the airflow generated by the rotation of the cooling fan of the power supply unit, and then dissipate to the outside of the computer case through the rear air outlet on the rear panel of the power supply unit and the air outlet on the side of the computer case.
附图说明Description of drawings
图1为一公知液冷式电脑内部结构的俯视图。FIG. 1 is a top view of the internal structure of a conventional liquid-cooled computer.
图2为本实用新型一较佳具体实施例的俯视图。Fig. 2 is a top view of a preferred embodiment of the utility model.
图3为本实用新型一较佳具体实施例的局部分解图。Fig. 3 is a partial exploded view of a preferred embodiment of the present invention.
图4为本实用新型一较佳具体实施例的冷却回路图。Fig. 4 is a cooling circuit diagram of a preferred embodiment of the utility model.
具体实施方式Detailed ways
请先一并参阅图2,为本实用新型一较佳具体实施例的俯视图、以及图3为本实用新型一较佳具体实施例的局部分解图。图中显示有本实施例的电脑外壳1、电源供应器2、以及液冷式散热系统3。Please refer to FIG. 2 , which is a top view of a preferred embodiment of the present invention, and FIG. 3 , which is a partial exploded view of a preferred embodiment of the present invention. The figure shows a computer casing 1 , a
本例的电脑外壳1是由一上盖11盖合于底壳12上所组成,而底壳12的侧方具有一侧面121。电脑外壳1的内部形成一内部空间10,并在侧面121上贯设有出风口122。The computer case 1 of this example is composed of an
电源供应器2组设在内部空间10内,并包含壳体21、以及散热风扇22。壳体21还包含前板211、侧板212、以及后板213。前板211上开设有前入风口214,前入风口214可连通到电脑外壳1的内部空间10。侧板212上开设有复数个侧入风口215;而后板213上开设有后排风口216,后排风口216可对应连通到出风口122。散热风扇22则组设在壳体21内,并对应到前入风口214。The
请再同时参阅图4,为本实用新型一较佳具体实施例的冷却回路图。Please refer to FIG. 4 at the same time, which is a cooling circuit diagram of a preferred embodiment of the present invention.
图中显示有一液冷式散热系统3,其包含储液箱31、泵浦32、集热器33、散热器34、复数支连通管30、以及散热风扇35。复数支连通管30依序将储液箱31、泵浦32、集热器33、以及散热器34串接形成一循环管路。集热器33是贴附组设在中央处理器(Central Processing Unit,CPU)上方,以收集中央处理器运作时产生的高热。散热器34具有散热鳍片模组,并包含外侧341、以及内侧342。散热风扇35是组在外侧341上,而内侧342并结合组设在侧板212外,且对应到复数个侧入风口215。The figure shows a liquid cooling
当散热风扇35旋转而吹出气流,能先流经散热器34以带走热能,再通过复数个侧入风口215而进入壳体21内部,继而受到散热风扇22的旋转气流吹动,而一起经由后排风口216、以及出风口122散逸到电脑外壳1的外部。When the
如此一来,不但能够增加流入电源供应器2内的气流量,针对电源供应器2散逸更多热能外,还可在电脑外壳1的内部空间10里形成有效风场,以引导各种电子元件所发出的高热,能顺利流进电源供应器2并一起排出电脑外壳1之外。In this way, not only can the airflow flowing into the
上述实施例仅是为了方便说明而举例而已,本实用新型所主张的权利范围自应以申请专利范围所述为准,而非仅限于上述实施例。The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the utility model shall be subject to the scope of the patent application, rather than limited to the above-mentioned embodiments.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520113019 CN2816904Y (en) | 2005-07-11 | 2005-07-11 | Liquid-cooled computer structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520113019 CN2816904Y (en) | 2005-07-11 | 2005-07-11 | Liquid-cooled computer structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2816904Y true CN2816904Y (en) | 2006-09-13 |
Family
ID=36996715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200520113019 Expired - Fee Related CN2816904Y (en) | 2005-07-11 | 2005-07-11 | Liquid-cooled computer structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2816904Y (en) |
-
2005
- 2005-07-11 CN CN 200520113019 patent/CN2816904Y/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN2713643Y (en) | heat sink | |
CN101615061A (en) | Adjustable ventilation structure | |
CN111813206A (en) | A new type of water-cooled water-cooled radiator with built-in fan | |
CN102137581B (en) | Dual fan heat sink | |
US20090014160A1 (en) | Heat dissipation module | |
CN2604550Y (en) | heat sink | |
CN2816904Y (en) | Liquid-cooled computer structure | |
TWI432944B (en) | A dual fan heat dissipation device | |
CN101312635B (en) | Air guide cover with heat pipe and radiating fin and electronic device provided with air guide cover | |
CN2483754Y (en) | Laptop cooling device | |
CN2762348Y (en) | heat sink | |
CN106873741A (en) | The heat dissipation equipment of computer housing heat generating components | |
CN1186535C (en) | Side blown heat sink | |
CN1266567C (en) | computer device | |
TW201248371A (en) | Heat dissipating system for computer | |
CN212256247U (en) | Novel water pump separation type water-cooling radiator with built-in fan | |
CN2610390Y (en) | Air deflector for computer motherboard radiator | |
CN102158052A (en) | Ventilation structure of high-power power conversion device based on heat pipe radiators | |
CN208459959U (en) | Air cooling equipment for computer cabinet side | |
CN106354232A (en) | Dustproof water-cooling computer case | |
CN100447708C (en) | Computer cooling system and cooling method | |
CN201528499U (en) | Heat sink device | |
CN2805090Y (en) | Liquid-cooled heat sink | |
CN2353947Y (en) | cooling fan | |
CN2845003Y (en) | Airflow cooling device for microcomputer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060913 Termination date: 20100711 |