CN102137581B - Dual fan heat sink - Google Patents

Abstract

The present invention discloses a dual-fan heat dissipation device used on a circuit board, the dual-fan heat dissipation device comprises a heat dissipation module, a hood, a first fan, a second fan and a separator. The hood has a cover plate, the lower wall of the cover plate faces the heat dissipation module, and the cover plate has a first through hole and a second through hole passing therethrough. The first fan is obliquely arranged on the hood and is located in the first through hole. The second fan is obliquely arranged on the hood and is located in the second through hole, and the virtual axis of the rotation center of the second fan intersects with the virtual axis of the rotation center of the first fan outside the upper wall of the cover plate. The separator is arranged in the hood and is located between the first through hole and the second through hole, and the separator blocks the first fan and the second fan.

Description

Dual fan heat sink

technical field

The present invention relates to a heat dissipation device for a circuit board or an electronic device, in particular to a dual-fan heat dissipation device with a structural design of relatively inclined fans.

Background technique

With the rapid development of technology, it has become a trend for electronic devices to use higher-level integrated circuits to enhance their computing capabilities. However, when the integrated circuit performs calculations, the integrated circuit will generate a large amount of heat energy, and the integrated circuit needs to be assisted by a cooling device to dissipate heat. At present, the cooling device includes a single fan and a double fan design. Various approaches, such as:

China Taiwan No. 587769 "radiation device" patent discloses a method of installing a heat dissipation device on a heating element, and the heat dissipation device includes more than one intake fan and an exhaust fan;

China Taiwan No. 200644780 "Double-Fan Cooling Module" patent discloses a dual-fan cooling module. The dual-fan cooling module is a method of accommodating a first centrifugal fan and a second centrifugal fan side by side in a casing;

China Taiwan No. 545104 "Heat Dissipation Device" patent case discloses a heat dissipation device with a first fan and a second fan, with multiple heat pipes and multiple heat sinks;

China Taiwan No. 577582 "Double Cooling Module Structure" patent case discloses a method of connecting a main cooling device and a secondary cooling device in series through a number of heat pipes. The main cooling device and the auxiliary cooling device include a fan respectively. and a set of fins;

China Taiwan No. 200410626 "Electronic Component Cooling Device" patent case discloses a method of adding a third heat sink between a first fan and a second fan;

China Taiwan No. M245506 "Forced Exhaust Type Computer Mainframe Cooling Device" discloses a method of installing a first fan and a second fan on a heat dissipation component on a first side and a second side respectively ;

The same or similar methods of the Nos. 587769, 200644780, 545104, 577582, 200410626 and 200410626 patents described above are to arrange the two fans horizontally. As for the patent M245506 which discloses a cooling mechanism in which one of the two fans is obliquely arranged, it is still limited to the fact that the two fans are respectively arranged on two opposite sides of the cooling mechanism.

Contents of the invention

The invention provides a new double-fan cooling device, which is used on a circuit board. The dual-fan heat dissipation device includes a heat dissipation module, a wind cover, a first fan, a second fan and a partition. The windshield covers the heat dissipation module, the windshield includes a cover plate and a partition, the lower wall of the cover plate faces the top of the heat dissipation module, and the cover plate has a a first through hole and a second through hole, the spacer is located between the first through hole and the second through hole, the spacer extends from the lower wall of the cover plate toward the heat dissipation module; A fan is obliquely arranged on the windshield and is located in the first through hole; a second fan is obliquely arranged on the windshield and is located in the second throughhole, and the rotation center of the second fan is The imaginary axis of the first fan intersects with the imaginary axis of the rotation center of the first fan outside the upper wall of the cover plate; the partition is arranged in the windshield and is located between the first through hole and the second through hole, The separator blocks the first fan and the second fan.

Preferably, the first fan is inclined at a first angle, which is the angle between the virtual axis of the rotation center of the first fan and the bottom of the cooling module; the second fan is at a second The angle is set obliquely, and the second angle is the included angle between the virtual axis of the rotation center of the second fan and the bottom of the heat dissipation module.

Preferably, the heat dissipation module is formed by a plurality of fins arranged side by side at intervals, each fin includes a first oblique side and a second oblique side, respectively facing the first fan and the second fan, and The first slope follows the first fan, and the second slope follows the second fan.

Compared with the prior art, the present invention provides a dual-fan cooling device, in which two cooling fans are arranged at an inclination facing each other, so as to improve the ineffective air flow generated between the first fan and the second fan, and improve the cooling performance of the cooling device. cooling efficiency. Furthermore, since the partition is provided between the first fan and the second fan, the partition can also block the interfering air flow between the two fans and reduce the noise generated by the interfering air flow.

More content of the invention and its functions will be disclosed in the following description.

Description of drawings

FIG. 1 is a schematic diagram illustrating a dual-fan cooling device according to a preferred embodiment of the present invention.

FIG. 2 is an exploded view showing the windshield shown in FIG. 1 and the first fan and the second fan.

FIG. 3 is a schematic diagram illustrating the heat dissipation module of FIG. 1 .

FIG. 4 is an exploded view illustrating the dual-fan cooling device of FIG. 1 .

FIG. 5 is a schematic diagram illustrating the application of the dual-fan cooling device of the present invention.

Detailed ways

Fig. 1 shows a preferred example of a double-fan cooling device of the present invention, and this double-fan cooling device 1 is used on the circuit board 2, and this double-fan cooling device 1 comprises a windshield 3, a first fan 4, a second The fan 5 , a cooling module 6 and a partition 31 . The circuit board 2 can be a display card or a mainboard, etc. The first fan 4 and the second fan 5 are preferably axial flow fans, but not limited thereto.

FIG. 2 shows a schematic diagram of the windshield 3 of the dual-fan cooling device 1 of the present invention. The windshield 3 covers the heat dissipation module 6, the windshield 3 has a cover plate 30, the lower wall 300 of the cover plate 30 is facing the top of the heat dissipation module 6, and the cover plate 30 has an upper wall running through it. 301 and a first through hole 302 and a second through hole 303 of the lower wall 300 .

The partition 31 is disposed in the windshield 3 between the first through hole 302 and the second through hole 303 , and the partition 31 blocks the first fan 4 and the second fan 5 .

In this embodiment, the partition 31 extends from the lower wall 300 of the cover 30 toward the heat dissipation module 6 , and the partition 31 has two opposite side walls 310 , each side wall 310 is arc-shaped, And the two sidewalls 310 face the first fan 4 and the second fan 5 respectively. When the first fan 4 and the second fan 5 operate at the same time, airflow in at least two directions will be generated to form an interfering airflow, so the partition 31 can be used to prevent the airflow from interfering with each other to reduce the heat dissipation of the dual-fan cooling device 1 Generated noise, and narrow the ineffective area where the airflow interferes with each other. In practical applications, the partition 31 can also use an additional partition board or other methods to block the two fans, so as to reduce the ineffective heat dissipation area on the heat dissipation module 6 .

The first fan 4 is obliquely arranged on the windshield 3 and is located in the first through hole 302 , and the second fan 5 is obliquely arranged on the windshield 3 and is located in the second throughhole 303 The virtual axis of the rotation center of the second fan 5 intersects the virtual axis L1 of the rotation center of the first fan 4 outside the upper wall 301 of the cover plate 30. The arrangement of the two fans 4 and 5 is shown in FIG. 1 .

The first fan 4 is inclined at a first angle θ1 , and the first angle θ1 is the angle between the virtual axis L1 of the rotation center of the first fan 4 and the bottom of the cooling module 6 . The second fan 5 is inclined at a second angle θ2, and the second angle θ2 is the angle between the virtual axis L2 of the rotation center of the second fan 5 and the bottom of the heat dissipation module 6 .

The first fan 4 and the second fan 5 can arbitrarily design the inclination angles of the two fans 4, 5 according to actual design requirements, for example, the first fan 4 and the second fan 5 are designed at different angles, or the two fans 4 and 5 are designed with relatively symmetrical angles, but not limited thereto. Furthermore, since the two fans 4 and 5 of the present invention are arranged on the windshield 3 and are located in the through holes 302 and 303, the first through hole 302 and the second through hole 303 of the cover plate 30 It is also possible to design the edges of the through holes 302, 303 to be inclined facing each other according to the inclination angle of the fans 4, 5.

In practical application, the windshield 3 further includes a first fixing bracket 32 and a second fixing bracket 33, the first fixing bracket 32 is connected inside the windshield 3 following the inclination of the first fan 4, and the The first fixing frame 32 faces the first through hole 302 of the cover plate 30, the first fixing frame 32 is installed with the first fan 4, and the second fixing frame 33 follows the inclination of the second fan 5 Connected to the windshield 3 , and the second fixing frame 33 faces the second through hole 303 of the cover plate 30 , the second fixing frame 33 is installed with the second fan 5 . The two fixing frames 32 , 33 can be directly formed in the windshield 3 , or connected in the windshield 3 by the frames of the fans 4 , 5 themselves.

3 and 4, the heat dissipation module 6 includes a plurality of fins 60, a heat conduction member 61 and a plurality of heat pipes 62, the heat dissipation module is formed by a plurality of fins 60 arranged side by side at intervals, each fin 60 includes a first oblique side 601 and a second oblique side 602, respectively facing the first fan 4 and the second fan 5, and the first oblique side 601 follows the inclination of the first fan 4, and the first oblique side 601 follows the inclination of the first fan 4. The two oblique sides 602 follow the inclination of the second fan 5 . The windshield 3 further includes two opposite side plates 34, the two side plates 34 respectively extend downwards from the cover plate 30, and the spaced apart fins 60 of the heat dissipation module 6 are in the same direction as the two side plates 34. arrangement.

In fact, the inclined surfaces of the first beveled side 601 and the second beveled side 602 of the fin 60 are inclined gradually or step-wise toward the middle and downward, but the fin 60 can also be designed as a plane or other forms. .

The heat conduction element 61 is attached to the bottom of the fins 60 , one end of each heat conduction pipe 62 passes through the fins 60 , and the other end of the heat conduction pipe 62 passes through the heat conduction element 61 . In fact, the heat conduction element 61 is directly attached to the surface of the integrated circuit 20 on the circuit board 2. After the heat conduction element 61 absorbs the heat energy of the integrated circuit 20, the fins 60 and the heat conduction element 61 The heat pipes 62 disperse the heat to the outside to improve the heat dissipation performance.

In this embodiment, the heat dissipation module 6 and the windshield 3 are connected by a support 7 against the bottom of the heat dissipation module 6, and screws 70 are used to lock the support 7 and the corresponding screw holes of the windshield 3 (not shown in the figure), however, the fixing method of the heat dissipation module 6 and the windshield 3 can also be achieved by buckle design, so it is not limited thereto.

5 shows a schematic diagram of a preferred application example of the dual-fan cooling device 1 of the present invention. When the relatively inclined first fan 4 and the second fan 5 are in motion, the first fan 4 generates a wind flow to make the wind flow After the air outside the cover 3 enters the heat dissipation module 6 through the air inlet of the heat dissipation module 6, it is discharged outside the cover plate 30 of the wind cover 3 by the first fan 4, and the second fan also produces another wind flow to lead The gas discharged by the first fan 4 above the cover plate 30 of the windshield 3 mixes with the outside air and enters the cooling module 6 , and then is discharged out of the windshield 3 through the air outlet of the cooling module 6 . However, since the fins 60 of the heat dissipation module 6 are arranged in the same direction as the above-mentioned airflow direction, the dual-fan cooling device 1 of the present invention can make the airflow in the fins circulate quickly and smoothly, so as to reduce the air flow between the two fins. The invalid heat dissipation area between the fans improves the heat dissipation effect of the circuit board 2 .

However, the dual-fan cooling device 1 of the present invention can also use two blowing fans to guide external air from above the first through hole 302 and the second through hole 303 of the cover plate 30 of the windshield 3 to blow to the heat dissipation module 6 , to discharge the hot air in the heat dissipation module 6, so the relative inclined fan design of the present invention can be applied to various heat dissipation mechanisms.

To sum up, the dual-fan cooling device of the present invention adopts a relatively inclined design of the two fans to reduce the interference airflow generated between the two fans, thereby improving the performance of the dual-fan cooling device on the integrated circuit or system of the circuit board. cooling efficiency. In addition, the partition can also block the generation of disturbing air flow between the dual fans and reduce the noise when the dual fans are in operation.

In any case, anyone can obtain sufficient teaching from the description of the above example, and thus understand that the present invention is indeed industrially practical and creative, and the present invention has no identical or similar technical disclosures in the same field It is prior and has sufficient novelty, which means that this invention has clearly met the requirements for an invention patent, and an application is now filed according to law.

Claims (8)

1. A dual-fan cooling device used on a circuit board, said dual-fan cooling device is characterized in that it comprises: a cooling module; A windshield, covering the heat dissipation module, the windshield has a cover plate, the lower wall of the cover plate is facing the top of the heat dissipation module, and the cover plate has a first through its upper and lower walls a through hole and a second through hole; A first fan is obliquely arranged on the windshield and located in the first through hole; A second fan is obliquely arranged on the windshield and is located in the second through hole, the virtual axis of the rotation center of the second fan intersects the virtual axis of the rotation center of the first fan outside the upper wall of the cover; and A partition, arranged in the windshield and between the first through hole and the second through hole, the partition blocks the first fan and the second fan, wherein the When the first fan and the second fan are in operation, at least two directions of airflow will be generated. The partition is used to block the mutual interference of the airflow, so as to reduce the noise generated by the dual-fan cooling device and reduce the invalid area where the airflow interferes with each other. 2. The dual-fan cooling device according to claim 1, wherein the first fan is arranged obliquely at a first angle, and the first angle is the virtual axis of the rotation center of the first fan and the first fan. The included angle at the bottom of the cooling module. 3. The dual-fan cooling device according to claim 1, wherein the second fan is arranged obliquely at a second angle, and the second angle is the relationship between the virtual axis of the rotation center of the second fan and the second fan. The included angle at the bottom of the cooling module. 4. The dual-fan cooling device according to claim 1, wherein the windshield further comprises a first fixing frame and a second fixing frame, and the first fixing frame conforms to the inclination of the first fan connected in the windshield, and the first fixing bracket faces the first through hole of the cover plate, the first fixing bracket is installed with the first fan, and the second fixing bracket The frame is connected to the fan cover in accordance with the inclination of the second fan, and the second fixing frame faces the second through hole of the cover plate, and the second fixing frame is installed with the first Two fans. 5. The dual-fan cooling device according to claim 1, wherein the heat dissipation module is formed by a plurality of fins arranged side by side at intervals, each fin includes a first hypotenuse and a second hypotenuse, respectively facing the first fan and the second fan, and the first oblique side conforms to the inclination of the first fan, and the second oblique side conforms to the inclination of the second fan. 6. The dual-fan cooling device according to claim 5, wherein the wind shield further comprises two opposite side plates, the two side plates respectively extend downward from the cover plate, and the heat dissipation module The spaced and side-by-side fins are arranged in the same direction as the two side plates. 7. The dual-fan cooling device according to claim 5, wherein the heat dissipation module further comprises a heat conduction element and a plurality of heat pipes, the heat conduction element is attached to the bottom of the fins, and each heat conduction pipe One end of the heat pipe runs through the fins, and the other end of the heat pipe runs through the heat conducting element. 8. The dual-fan cooling device according to claim 1, wherein the spacer extends from the lower wall of the cover plate toward the heat dissipation module, and the spacer has two opposite side walls, each One side wall is arc-shaped, and the two side walls respectively face the first fan and the second fan.