CN212256247U - Novel water pump separation type water-cooling radiator with built-in fan - Google Patents

Abstract

The application provides a novel water pump separation type water-cooling radiator with built-in fans, which is characterized in that a cooling fan unit is further arranged while the most basic water-cooling effect is kept, wherein a plurality of air inlet holes are formed in the outer side wall of the upper end of a cooling shell along the circumferential direction of the cooling shell, and a plurality of air outlet holes are formed in the outer side wall of the lower end of the cooling shell along the circumferential direction of the cooling shell; wherein the heat-dissipating housing is sleeved on the heat-absorbing unit. Then make outside air get into the heat dissipation shell from the fresh air inlet that is located heat dissipation shell upper end to discharge from the exhaust vent that is located heat dissipation shell lower extreme, then can dispel the heat and cool down to each electronic component such as MOS pipe and DRAM around the mainboard CPU by exhaust wind of exhaust vent, then can improve the radiating efficiency greatly and prolong mainboard life. The pump body of this application adopts the mode of external connection, and the erection joint is more convenient, and the performance is more superior, and it is more convenient to maintain, and the built-in fan of water-cooling is then high-efficient practical to the whole heat dispersion of mainboard moreover.

Description

A new type of water-cooled water-cooled radiator with built-in fan

technical field

The utility model relates to the field of water cooling and heat dissipation, in particular to a novel water-cooled water-cooled radiator with a fan inside.

Background technique

At present, with the rapid development of electronic technology and people's needs in life, entertainment and work, computers have become an indispensable daily necessities in people's daily life. Nowadays, people are inseparable from computers most of the time, whether for entertainment or work, and with the rapid development of electronic technology, the performance of computers has also been rapidly improved. The improvement of performance is also accompanied by the increase of heat generation, which has a serious impact on the performance and service life of the computer.

Existing cooling systems mainly include air-cooled cooling systems and water-cooled cooling systems. Among them, water-cooled cooling systems have been widely used in CPU cooling due to their remarkable cooling performance and low noise, and have become an important development in computer cooling systems. one of the trends.

However, since the water cooling system in the prior art has only simple water cooling, it is easy to have poor heat dissipation effect and low heat dissipation efficiency; and now the water cooling radiator sets the pump body inside the equipment, so installation and maintenance are very difficult. inconvenient. In addition, the existing water-cooled radiator can only dissipate heat from the CPU, but cannot dissipate heat and cool the electronic components such as MOS tubes and memory sticks around the CPU.

SUMMARY OF THE INVENTION

In order to solve the above-mentioned problems, the present invention provides a novel radiator with a fan inside the water-cooled water-pump separation type, and the device of the present application can simultaneously radiate and cool down the CPU and the periphery of the mainboard CPU, thereby prolonging the service life of the mainboard; The pump body adopts the external connection method, which makes the installation and connection more convenient, the performance is more superior, and the maintenance is more convenient, and the water-cooled built-in fan is more efficient and practical for the entire heat dissipation performance of the motherboard.

In order to achieve the above-mentioned purpose, the technical scheme adopted by the present invention is: a new type of radiator with a fan inside the water-cooled water pump separation type, including a liquid inlet pipe, a liquid outlet pipe, a pump body, a heat dissipation unit, a heat dissipation fan unit, and a heat dissipation unit with a processor. A heat-absorbing unit with a close contact surface; wherein a heat-absorbing cavity is arranged in the heat-absorbing unit, and the heat-absorbing unit is provided with a liquid inlet pipe communicating with the heat-absorbing cavity and a liquid outlet pipe communicating with the heat-absorbing cavity. The heat dissipation unit is connected with the liquid inlet pipe port of the heat absorption unit through the liquid inlet pipe, and the liquid outlet pipe port of the heat absorption unit is connected with the input end of the liquid outlet pipe through the pump body, and the output end of the liquid outlet pipe is connected with the heat dissipation pipe. The cooling fan unit includes a fan body, a cylindrical heat dissipation shell sleeved on the heat absorbing unit, wherein the outer side wall of the upper end of the heat dissipation shell is provided with a number of air inlet holes along the circumferential direction thereof. The outer side wall of the lower end of the heat dissipation shell is provided with several air outlet holes along its circumferential direction; the heat dissipation shell is sleeved on the heat absorption unit, the fan main body is arranged on the surface of the heat absorption unit, and the fan main body is located at the height of the air inlet hole and the height of the air outlet.

Preferably, the lower end of the heat dissipation shell is provided with a first notch corresponding to the liquid outlet port and a second gap corresponding to the liquid inlet port; wherein the heat dissipation shell is sleeved on the surface of the heat absorbing unit, and the first gap is sleeved on the surface of the heat absorbing unit. At the mouth of the liquid outlet, the second notch is sleeved at the mouth of the liquid inlet.

Preferably, the fan body includes a fan blade, a drive motor, and a cylindrical fan mounting sleeve, the drive motor is drivingly connected to the fan blade, and drives the fan blade to rotate, and the lower end of the fan mounting sleeve is provided with a mounting sleeve. A bracket, wherein the drive motor is fitted on an installation bracket; wherein the surface of the heat absorbing unit is provided with a plurality of connecting columns, and the upper end of the connecting column is provided with a first screw hole, and the installation bracket is provided with a first screw hole. A second screw hole is aligned with the screw hole, wherein the fan mounting sleeve is placed on the surface of the heat absorbing unit and passes through the first screw hole and the second screw hole respectively through screws to achieve assembly with the heat absorbing unit.

Preferably, the surface of the heat absorbing unit is further provided with a plurality of supporting columns, the fan mounting sleeve is placed on the surface of the heat absorbing unit, and the top end of the supporting column abuts against the bottom wall of the mounting bracket.

Preferably, the inner wall of the fan mounting sleeve is provided with an LED light module, wherein the LED light module includes a red light LED light, a blue light LED light, a green light LED light, and a white light LED light.

Preferably, the upper end of the heat dissipation shell is provided with an opening, and the opening is covered with a cover plate made of transparent material.

Preferably, the inner wall of the opening is provided with a ring of bosses, and the cover plate is placed on the top wall of the bosses.

Preferably, it also includes a first adapter, a second adapter, a first pipe sleeve, and a second pipe sleeve; the first adapter is fitted at the outlet of the liquid outlet, and the second adapter is fitted at the inlet At the mouth of the liquid pipe; wherein the first adapter is communicated with the input end of the liquid outlet pipe through the first pipe sleeve, the output end of the liquid outlet pipe is communicated with the water inlet end of the pump body, and the water outlet end of the pump body is communicated with the heat dissipation unit ; wherein the heat dissipation unit is communicated with the input end of the liquid inlet pipe, and the second adapter is communicated with the output end of the liquid inlet pipe through the second pipe sleeve.

Preferably, it also includes a pump body cover, the pump body cover includes an upper cover and a lower cover, the pump body is located in a cavity enclosed by the upper cover and the lower cover, and the liquid inlet pipe passes through the cavity and dissipates heat unit is connected.

The beneficial effects of the present utility model are:

1. While maintaining the most basic water-cooling effect, the present application also provides a cooling fan unit, wherein the outer side wall of the upper end of the cooling shell is provided with a number of air inlet holes along its circumferential direction, and the outer side wall of the lower end of the cooling shell extends There are several air outlet holes in the circumferential direction; the heat dissipation shell is sleeved on the heat absorption unit, the fan body is arranged on the surface of the heat absorption unit, and the fan body is located at the height of the air inlet hole and the height of the air outlet hole. between. Then the outside air enters the heat dissipation case from the air inlet hole located at the upper end of the heat dissipation case, and is discharged from the air outlet hole located at the lower end of the heat dissipation case. The exhausted air can cool down the heat dissipation of various electronic components such as MOS tubes and memory bars around the CPU of the motherboard; using the device of the present invention can simultaneously cool down the heat dissipation of the CPU and various electronic components such as MOS tubes and memory bars around the CPU, which can greatly reduce the heat dissipation. Improve cooling efficiency and extend motherboard life.

2. In this application, a pump body is arranged between the heat dissipation unit and the liquid outlet pipe. Compared with the traditional built-in heat absorption unit, the pump body of this application adopts an external connection method, which is more convenient for installation and connection and has more superior performance. And maintenance is more convenient.

Description of drawings

Figure 1 is an exploded view of the overall equipment of the present utility model.

Figure 2 is an exploded view of the overall equipment of the present invention.

FIG. 3 is a cross-sectional view along the space XZ axis after the heat absorbing unit and the cooling fan unit are assembled in the present invention.

4 is a cross-sectional view of the YZ axis after the heat absorption unit and the cooling fan unit are assembled in the present invention.

5 is a schematic three-dimensional structural diagram of the heat absorbing unit and the cooling fan unit assembled in the present invention.

FIG. 6 is a schematic view of the structure of FIG. 5 after the heat dissipation casing is omitted.

Figure 7 is a schematic structural diagram of the pump body of the present invention.

Description of reference numerals: cover plate 11, heat dissipation shell 12, air inlet hole 121, air outlet hole 122, boss 123, first gap 124, fan blade 125, fan body 13, fan mounting sleeve 131, mounting bracket 1311, Bottom shell 21, support column 210, liquid outlet port 211, liquid inlet port 212, first water chamber 2111, second water chamber 2112, third water chamber 2113, first water hole 2114, second water hole 2115, waterway cover plate 22, sealing ring 23, heat absorbing bottom plate 24, heat sink group 241, first adapter 25, second adapter 26, first sleeve 27, second sleeve 28, connector seal 29 , Cooling water row 31, pump body 32, lower cover 33, upper cover 34, shockproof sleeve 35, liquid outlet pipe 36, liquid inlet pipe 37, drive motor 221, impeller pipe 222, impeller 223, water pump tee pipe 224.

Detailed ways

Please refer to FIGS. 1-7 , the present utility model relates to a novel radiator of a water pump separation type water-cooled built-in fan, including a liquid inlet pipe 37, a liquid outlet pipe 36, a pump body 32, a heat dissipation unit, a heat dissipation fan unit, and a processing unit. A heat-absorbing unit with a heat-dissipating surface close to the heat-absorbing unit; wherein a heat-absorbing cavity is arranged in the heat-absorbing unit, and the heat-absorbing unit is provided with a liquid inlet pipe 212 communicating with the heat-absorbing cavity and a liquid inlet communicating with the heat-absorbing cavity. Liquid outlet pipe port 211; wherein the heat dissipation unit is communicated with the liquid inlet pipe port 212 of the heat absorption unit through the liquid inlet pipe 37, and the liquid outlet pipe port 211 of the heat absorption unit is connected with the input end of the liquid outlet pipe 36 through the pump body 32, so The output end of the liquid outlet pipe 36 is communicated with the heat dissipation unit; the heat dissipation fan unit includes a fan body 13, a cylindrical heat dissipation shell 12 sleeved on the heat absorption unit, wherein the outer side wall of the upper end of the heat dissipation shell 12 extends A number of air inlet holes 121 are opened in the circumferential direction, and a number of air outlet holes 122 are opened on the outer side wall of the lower end of the heat dissipation shell 12 along its circumference; wherein the heat dissipation shell 12 is sleeved on the heat absorbing unit, and the fan The main body 13 is disposed on the surface of the heat absorbing unit, and the fan main body 13 is located between the height of the air inlet hole 121 and the height of the air outlet hole 122 .

The specific structure of the heat absorbing unit in the present application will be discussed below: the heat absorbing unit includes a bottom shell 21, a water channel cover 22, and a heat absorbing bottom plate 24 connected in sequence from top to bottom; wherein the bottom shell 21 is provided with an outlet The liquid pipe port 211 and the liquid inlet pipe port 212; the bottom shell 21 and the waterway cover plate 22 are surrounded by a first water cavity 2111 connected to the liquid inlet pipe port 212 and a second water cavity that communicates with the liquid outlet pipe port 211. The first water cavity 2111 and the second water cavity 2112 are independent of each other; the heat absorption bottom plate 24 and the waterway cover plate 22 enclose a third water cavity 2113, wherein the surface of the heat absorption bottom plate 24 is fixedly provided with a heat dissipation The fin group 241, the cooling fin group 241 is arranged in the third water cavity 2113, and the surface of the water channel cover 22 is provided with a first water passage hole 2114 for connecting the first water cavity 2111 and the third water cavity 2113. The second water passage hole 2115 connecting the second water chamber 2112 and the third water chamber 2113, wherein the first water passage hole 2114 extends along the length direction perpendicular to the heat sink set 241, and the second water passage hole of the water channel cover 22 The water holes 2115 are disposed at positions corresponding to both ends of the heat sink group 241 .

When the cooling liquid enters the first water cavity 2111 from the liquid inlet pipe 212, and then enters the third water cavity 2113 through the first water passage hole 2114, and because the heat sink group 241 is arranged in the third water cavity 2113, And the first water passage hole 2114 extends along the length direction perpendicular to the heat sink set 241, so the cooling liquid will enter the gaps between the plurality of heat sinks in the heat sink set 241 and flow to both ends along the length direction of the heat sink set 241, Then it flows into the second water cavity 2112 from the second water passage hole 2115, and then flows to the heat dissipation unit through the liquid outlet nozzle 211, and realizes the water circuit circulation. Therefore, it is ensured that the cooling liquid can contact with multiple cooling fins in the cooling fin group 241 to the maximum extent, which increases the contact area of the cooling liquid for the cooling fin group 241 and improves the heat dissipation effect; From the third water chamber 2113 to the second water chamber 2112, the entire water path flows in from top to bottom, and then flows out from bottom to top, so the cooling liquid level will definitely be higher than the height of the heat sink group 241 and realize the water circuit circulation, so This can ensure complete contact between the cooling liquid and the heat sink group 241, thereby improving the heat dissipation effect.

While maintaining the most basic water cooling effect, the present application also provides a cooling fan unit, wherein the outer side wall of the upper end of the cooling shell 12 is provided with a number of air inlet holes 121 along its circumferential direction, and the outer side wall of the lower end of the cooling shell 12 is provided with a plurality of air inlet holes 121. A number of air outlet holes 122 are opened along its circumferential direction; wherein the heat dissipation shell 12 is sleeved on the heat absorption unit, the fan body 13 is arranged on the surface of the heat absorption unit, and the fan body 13 is located at the height of the air inlet hole 121 and between the heights where the air outlet holes 122 are located. Then the outside air enters into the heat dissipation case 12 from the air inlet hole 121 at the upper end of the heat dissipation case 12, and is discharged from the air outlet hole 122 at the lower end of the heat dissipation case 12. Since the heat absorbing unit is in close contact with the heat dissipation surface of the CPU during operation, Then the air discharged from the air outlet 122 can cool down the heat dissipation of various electronic components such as MOS tubes and memory bars around the CPU of the motherboard; then the device of the present application can simultaneously cool the CPU and the MOS tubes and memory bars around the CPU and other electronic components. Cooling down the heat can greatly improve the heat dissipation efficiency and prolong the service life of the motherboard.

In this application, a pump body 32 is arranged between the heat dissipation unit and the liquid outlet pipe 36. Compared with the traditional built-in heat absorption unit, the pump body 32 of the present application adopts an external connection method, which is more convenient for installation and connection and has better performance. , and maintenance is more convenient.

Preferably, the lower end of the heat dissipation shell 12 is provided with a first notch 124 corresponding to the liquid outlet port 211 and a second gap corresponding to the liquid inlet port 212; wherein the heat dissipation shell 12 is sleeved on the surface of the heat absorbing unit, and the third A notch 124 is sleeved at the liquid outlet port 211 , and the second notch is sleeved at the liquid inlet port 212 . The first notch 124 and the second notch can be used as a foolproof design, which is convenient for the heat dissipation shell 12 to be sleeved at the heat absorbing unit, and at the same time plays the role of positioning and preventing deviation.

Preferably, the fan body 13 includes a fan blade 125, a driving motor, and a cylindrical fan mounting sleeve 131, the driving motor is drivingly connected to the fan blade 125, and drives the fan blade 125 to rotate, and the fan is installed The lower end of the sleeve 131 is provided with a mounting bracket 1311, wherein the drive motor is fitted on the mounting bracket 1311; wherein the surface of the bottom case 21 is provided with a plurality of connecting posts, and the upper end of the connecting posts is provided with a first screw hole, and The mounting bracket 1311 is provided with a second screw hole aligned with the first screw hole, wherein the fan mounting sleeve 131 is placed on the surface of the bottom case 21 and passes through the first screw hole and the second screw hole respectively through screws to realize the suction Assembly of the thermal unit. The surface of the bottom case 21 is also provided with a plurality of support posts 210 , the fan mounting sleeve 131 is placed on the surface of the bottom case 21 , and the top of the support posts 210 abuts against the bottom wall of the mounting bracket 1311 . In this application, the connecting column and the mounting bracket 1311 are detachably assembled by screws, which is convenient for the installation or disassembly of the fan body 13 and the bottom case 21; at the same time, the connecting column and the supporting column 210 can support the fan body 13. A certain distance is maintained between the main body 13 and the bottom case 21 and a sufficient air outlet space is left to improve the heat dissipation effect.

Preferably, the inner wall of the fan mounting sleeve 131 is provided with an LED light module, wherein the LED light module includes a red light LED light, a blue light LED light, a green light LED light, and a white light LED light. Among them, the user can connect the LED light module with an external control chip, and control the startup or shutdown of each LED light through the control chip, as well as the startup method. For example, the control chip can control the LED light module to achieve different types of light and shadow effects according to different types of music;

Preferably, in order to facilitate the user to watch the light and shadow effects of the LED lamp module, the upper end of the heat dissipation shell 12 is provided with an opening, and the opening is covered with a cover plate 11 made of transparent material, and the cover plate 11 plays a certain role in preventing dust. Therefore, the user can see the phantom lighting effect emitted by the fan through the upper opening of the heat dissipation shell 12 and the side ventilation holes.

Preferably, in order to facilitate the placement of the cover plate 11 , a ring of bosses 123 is provided on the inner wall of the opening, and the cover plate 11 is placed on the top wall of the bosses 123 .

Preferably, it also includes a first adapter 25 , a second adapter 26 , a first pipe sleeve 27 , and a second pipe sleeve 28 ; the first adapter 25 is fitted at the liquid outlet port 211 , and the second adapter The adapter 26 is fitted at the liquid inlet port 212 ; wherein the first adapter 25 is communicated with the input end of the liquid outlet pipe 36 through the first pipe sleeve 27 , and the output end of the liquid outlet pipe 36 is connected with the water inlet end of the pump body 32 The water outlet end of the pump body 32 is communicated with the heat dissipation unit; wherein the heat dissipation unit is communicated with the input end of the liquid inlet pipe 37, and the second adapter 26 is communicated with the output end of the liquid inlet pipe 37 through the second sleeve 28. . Moreover, in this specific embodiment, the connection between the first adapter 2525 and the liquid outlet pipe 36 and the connection between the second adapter 26 and the liquid inlet pipe 37 are provided with a connecting head sealing ring 29, which can strengthen the liquid outlet pipe. 36 and the air tightness of the liquid inlet pipe 37 to avoid leakage.

Please refer to FIGS. 3-6 . Further, a sealing groove is formed at the connection between the bottom shell 21 and the heat-absorbing bottom plate 24 , and a sealing ring 23 is embedded in the sealing groove. The cross-section of the sealing ring 23 is The area of is larger than the area of the cross section of the sealing groove. The area of the cross section of the sealing ring is larger than the area of the cross section of the sealing groove, which increases the sealing performance and reduces the probability of liquid leakage.

Preferably, it also includes a pump body cover, the pump body cover includes an upper cover 34 and a lower cover 33, the pump body 32 is located in the cavity enclosed by the upper cover 34 and the lower cover 33, and the liquid inlet pipe 37 passes through the cavity. It communicates with the cooling water row 31 through the cavity. In addition, the upper cover 34 and the lower cover 33 are fixed by screw-free upper and lower hooks.

Referring to FIG. 7 , in this specific embodiment, the pump body 32 includes an impeller tube 222 , a drive motor 221 , an impeller 223 , and a water pump tee tube 224 , wherein the impeller tube 222 communicates with one end of the water pump tee tube 224 , the drive motor 221 and the impeller 223 are all arranged in the impeller tube 222, the output shaft of the drive motor 221 is connected with the impeller 223, the impeller 223 extends into the water pump tee pipe 224 along its length direction, and the The water inlet end of the water pump tee pipe 224 is communicated with the liquid outlet pipe 36 , and the water outlet end of the water pump tee pipe 224 is communicated with the heat dissipation unit. Moreover, the surface of the impeller tube 222 is sleeved with a shock-proof sleeve 35, which covers the water pump to prevent the operation of the water pump and the vibration of the pump body cover from generating noise.

The above embodiments are only to describe the preferred embodiments of the present invention, and do not limit the scope of the present invention. On the premise of not departing from the design spirit of the present invention, ordinary engineers and technicians in the art make the technical solutions of the present invention. Various deformations and improvements should fall within the protection scope determined by the claims of the present utility model.

Claims (9)

1. The utility model provides a novel radiator of built-in fan of water pump disconnect-type water-cooling which characterized in that: the heat-absorbing device comprises a liquid inlet pipe, a liquid outlet pipe, a pump body, a heat-radiating unit, a heat-radiating fan unit and a heat-absorbing unit connected with a heat-radiating surface of a processor; wherein a heat absorption cavity is arranged in the heat absorption unit, and the heat absorption unit is provided with a liquid inlet pipe orifice communicated with the heat absorption cavity and a liquid outlet pipe orifice communicated with the heat absorption cavity; the heat dissipation unit is communicated with a liquid inlet pipe orifice of the heat absorption unit through a liquid inlet pipe, a liquid outlet pipe orifice of the heat absorption unit is connected with the input end of a liquid outlet pipe through a pump body, and the output end of the liquid outlet pipe is communicated with the heat dissipation unit; the heat dissipation fan unit comprises a fan main body and a cylindrical heat dissipation shell, wherein a plurality of air inlet holes are formed in the outer side wall of the upper end of the heat dissipation shell along the circumferential direction of the heat dissipation shell, and a plurality of air outlet holes are formed in the outer side wall of the lower end of the heat dissipation shell along the circumferential direction of the heat dissipation shell; the heat-absorbing unit is sleeved with the heat-radiating shell, the fan main body is arranged on the surface of the heat-absorbing unit, and the fan main body is located between the air inlet hole and the air outlet hole.

2. The novel water pump separation type water-cooling radiator with built-in fan as claimed in claim 1, wherein: the lower end of the heat dissipation shell is provided with a first notch corresponding to the liquid outlet pipe orifice and a second notch corresponding to the liquid inlet pipe orifice; wherein the heat dissipation shell is sleeved on the heat absorption unit, the first gap is sleeved at the liquid outlet pipe opening, and the second gap is sleeved at the liquid inlet pipe opening.

3. The novel water pump separation type water-cooling radiator with built-in fan as claimed in claim 1, wherein: the fan main body comprises fan blades, a driving motor and a cylindrical fan mounting sleeve, the driving motor is in driving connection with the fan blades and drives the fan blades to rotate, a mounting bracket is arranged at the lower end of the fan mounting sleeve, and the driving motor is assembled on the mounting bracket; wherein the surface of heat absorption unit is provided with a plurality of spliced poles, and the upper end of this spliced pole has seted up first screw hole, and has seted up the second screw hole that aligns with first screw hole on this installing support, and wherein the fan installation cover is placed on the surface of heat absorption unit and passes first screw hole and second screw hole respectively through the screw, realizes the equipment with the heat absorption unit.

4. The novel water pump separation type water-cooling radiator with built-in fan as claimed in claim 3, wherein: the surface is also provided with a plurality of support columns, the fan mounting sleeve is placed on the surface of the heat absorption unit, and the top ends of the support columns abut against the bottom wall of the mounting support.

5. The novel water pump separation type water-cooling radiator with built-in fan as claimed in claim 3, wherein: the inner wall of fan installation cover is provided with LED lamp module, and wherein LED lamp module includes ruddiness LED lamp, blue light LED lamp, green glow LED lamp, white light LED lamp.

6. The novel water pump separation type water-cooling radiator with built-in fan as claimed in claim 1, wherein: an opening is formed in the upper end of the radiating shell, and a cover plate made of transparent materials covers the opening.

7. The novel water pump separation type water-cooling radiator with built-in fan as claimed in claim 6, wherein: the inner wall of the opening is provided with a circle of bosses, and the cover plate is placed on the top wall of each boss.

8. The novel water pump separation type water-cooling radiator with the built-in fan is characterized by further comprising a first connector, a second connector, a first pipe sleeve and a second pipe sleeve; the first connector is assembled at the liquid outlet pipe orifice, and the second connector is assembled at the liquid inlet pipe orifice; the first connecting head is communicated with the input end of the liquid outlet pipe through the first pipe sleeve, the output end of the liquid outlet pipe is communicated with the water inlet end of the pump body, and the water outlet end of the pump body is communicated with the heat dissipation unit; the second connector is communicated with the output end of the liquid inlet pipe through a second pipe sleeve.

9. The heat sink of the novel water pump separated water-cooled internal fan according to claim 8, further comprising a pump cover, wherein the pump cover comprises an upper cover and a lower cover, the pump body is located in a cavity defined by the upper cover and the lower cover, and the liquid inlet pipe passes through the cavity and is communicated with the heat dissipation unit.

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