CN2604550Y - heat sink - Google Patents

Abstract

A heat dissipating double-fuselage, is used for guiding the airstream to a heating assembly to carry on the heat exchange and discharge the heat energy, in order to reduce the operating temperature of the heating assembly; the utility model discloses designed a fan housing, an inlet fan and an exhaust fan on the radiator, the fan housing covers on the radiator, by inlet fan guide external air get into in the radiator and carry out the heat exchange with the radiator, exhaust fan then passes through the fan housing with the hot-air in the radiator and outwards discharges, guides external air entering radiator and discharge effectively, and then promotes the radiating efficiency by a wide margin.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, which is applied in an electronic device, and is used for exchanging heat with a heating component of the electronic device and discharging heat energy, so as to reduce the working temperature of the heating component.

Background technique

The most important heat generation in the computer is the microprocessor with faster and faster operating frequency. In order to maintain the normal operation of the microprocessor, the microprocessor has a corresponding heat dissipation design. Recently, the hard disk with faster and faster speed and the display Graphics cards with high quality requirements also have high operating temperatures due to their high rotational speed and fast operating frequency. Therefore, in addition to the microprocessor, there are also corresponding heat dissipation designs for hard drives and graphics cards.

At present, the heat dissipation design adopted by the heating components in the computer is mainly to combine a fan with a heat sink. The heat sink is usually made of high thermal conductivity metal material and directly attached to the heating components. There are multiple cooling fins on the device, the heat energy generated by the heating components will be transferred to the cooling fins, and the fan is erected above the cooling fins, the fan introduces the outside air into the cooling fins for heat exchange, and then sends the hot air outward Push out; as far as fans are concerned, the fans used can generally be divided into axial flow fans and centrifugal fans. Axial flow fans make air flow in the axial direction, while centrifugal fans use centrifugal force to make air flow in the radius Direction of flow, and the selection of fans is mainly based on different space and heat dissipation requirements.

As mentioned above, due to the faster and faster operation frequency of each heating component, in order to maintain the normal operation of the heating component, the heat dissipation performance of the heat dissipation device is also required to be higher and higher; generally speaking, the design of increasing the heat dissipation performance can be divided into For the radiator part and for the fan part, for the radiator part, such as using a radiator with high thermal conductivity material or increasing the heat dissipation area of the radiator, and for the fan part, the simplest way is to increase the wind pressure of the fan or increase the number of fans, etc.; In terms of increasing the wind pressure, increasing the speed of the fan can increase the wind pressure. However, increasing the speed of the fan will increase the noise level of the fan. The heat dissipation performance and the noise problem cannot be balanced. Although the fan can be controlled by software at different operating temperatures It is expected to reduce the noise of the fan when the operating temperature of the heating element is not high, but this does not really solve the problem of heat dissipation performance and noise.

Another example is the Taiwan patent announcement No. 508063 patent case, which discloses a dual-fan design, which is to increase the number of fans to improve heat dissipation performance, but this is only to make the two fans blow differently. The location of a fan corresponds to a heating component to dissipate heat for multiple heating components, which does not really improve the cooling performance.

In addition, such as the Taiwan Patent Publication No. 510524 patent case, the No. 510524 patent case discloses a heat dissipation device with double air inlets, which mainly uses the setting of heat dissipation fins on the radiator and the design of the wind direction of the centrifugal fan , so that two air inlets are formed on the radiator, and the two air inlets are used to guide the outside air into the radiator for heat exchange. However, the centrifugal fan produces radially outward flow airflow, and the design of the fan blade angle can make The air enters the cooling fins axially from top to bottom, but the outside air cannot enter the air inlets radially. This design still cannot effectively improve the heat dissipation performance.

Contents of the invention

In the heat dissipation design adopted by the heat-generating components of the known electronic devices, the design aimed at improving the heat dissipation performance of the fan is to increase the fan speed to increase the wind pressure or increase the number of fans. However, increasing the wind pressure will generate more noise and increase the fan The number is only to use multiple fans to dissipate heat from multiple heating components, not to improve the heat dissipation efficiency; there is also a known design with double air inlets, which cannot effectively guide the outside air into the heat dissipation fins for heat exchange, so this practical The new type is based on the problems existing in the previous technology, and proposes a heat dissipation device that effectively improves heat dissipation performance and can meet the requirements of low noise at the same time.

According to the heat dissipation device disclosed in the utility model, it includes a radiator, a windshield, at least one intake fan and an exhaust fan, wherein the radiator is directly attached to a heating component, and there are multiple pieces of radiator erected on the radiator The heat dissipation fins are formed with guide fins and main fins. The wind cover is directly covered on the radiator and is formed with an air guide corresponding to the guide fins, an air exhaust part, and an air intake fan. It is installed on the air guide part to guide the outside air to enter the main fin part from the guide fins. The exhaust fan is installed in the exhaust chamber and is at the position corresponding to the main fin part. The outside air enters the main fin part and After heat exchange, the hot air after heat exchange can be exhausted by the exhaust fan through the exhaust part, effectively reducing the working temperature of the heating components.

According to the heat dissipation device disclosed in the utility model, through the design of the intake fan and the exhaust fan, the intake fan guides the outside air into the radiator and exchanges heat with the radiator, and the exhaust fan transfers the air in the radiator The hot air is discharged outward through the wind cover, so that the utility model can effectively guide the outside air into the radiator without changing the wind pressure of the exhaust fan, and effectively discharge the hot air after heat exchange to the outside, thereby greatly The heat dissipation efficiency is improved, and the noise value of the intake fan and exhaust fan can still be controlled within the allowable range.

Description of drawings

Fig. 1 is the structural composition decomposition schematic diagram of the present utility model;

Fig. 2 is the combined schematic diagram of structural composition of the present utility model;

Fig. 3A is the top view of radiator in the utility model;

Fig. 3B is the bottom view of radiator in the utility model;

Fig. 4 is a schematic side view of the structural composition of the present utility model; and

Fig. 5 is a schematic diagram of the cooling air direction of the utility model. in the picture

10 Heat sink

11 Radiator

111 Main overlay plane

112 Substrate Overlay

113 Heat sink fins

114 main fin part

115, 116 Guide fin part

117 Placement table

12 Wind Hood

121 Air intake

122, 123 Air guide part

1221, 1231 Air guide surface

124 Exhaust Department

1241 wind pressure chamber

1242 exhaust pipe

1243 Wind guiding surface

13 intake fan

14 exhaust fan

Detailed ways

According to the heat dissipation device disclosed in the utility model, it is applied in an electronic device to exchange heat for the heating components of the electronic device, wherein the electronic device refers to personal computers, notebook computers and other similar products, and the heating component refers to Similar electronic components such as microprocessors, chips or hard disks, according to the heat dissipation device disclosed in the utility model, discharge the heat energy generated by the heating components in the working state, so as to reduce the working temperature of the heating components, thereby maintaining the heat dissipation of the heating components. For normal operation, the following embodiments describe in detail that the heat-generating component will take a display card as an example, but it is not limited to use on a display card, such as a microprocessor or other electronic components that generate heat under working conditions can be applied.

As shown in FIGS. 1 and 2 , the heat dissipation device 10 according to the present invention includes a heat sink 11 , a windshield 12 , an intake fan 13 and an exhaust fan 14 .

The heat sink 11 is made of a metal material with high thermal conductivity, such as copper or aluminum. According to different heat dissipation requirements or corresponding heat dissipation positions, the heat sink 11 can also be manufactured in one piece. Die-casting or extrusion molding, or divided into multiple components, die-casting or extrusion molding and then combined; the current high-end display card has at least one display chip for performing main calculations and multiple memories (not shown in the figure) Out), the heat sink 11 can be directly pasted on the display chip and the memory, so the bottom surface of the heat sink 11 has at least one main paste plane 111 corresponding to the display chip and a plurality of secondary paste planes 112 corresponding to the memory (such as As shown in FIG. 3A ), the main sticking plane 111 and the secondary sticking plane 112 should be true planes in theory, so as to be in contact with the display chip and the memory surface, so that the heat energy of the display chip and the memory can be effectively transferred to the heat sink 11, However, in reality, due to limitations of materials or manufacturing conditions, the requirements of a true plane cannot be achieved. Generally speaking, a thermally conductive adhesive (not shown in the figure) will be applied between the main surface 111 and the secondary surface 112 and the display chip and memory. .

As shown in FIG. 3B , there are a plurality of cooling fins 113 erected on the radiator 11, and the plurality of cooling fins 113 are arranged on the radiator 11 to form a main fin part 114 corresponding to the main sticking plane 111, and two A guide fin portion 115, 116 corresponding to the auxiliary surface 112, and according to different heat dissipation requirements, the heat dissipation fins 113 have different arrangement and erection methods, according to the heat dissipation air flow design of the utility model, the main fin portion 114 The cooling fins 113 are arc-shaped and arranged radially outward from the central point. Generally speaking, the larger the cooling area, the higher the cooling efficiency. The display chip on the display card is the main heat source, and the operating temperature is higher. Therefore, the main fin part The heat dissipation fins 113 of 114 are arranged densely, so as to increase the number of heat dissipation fins 113 per unit area and increase the heat dissipation area; while the guide fins 115, 116 also accept the heat energy from the memory although they correspond to the positions of the memory, However, according to the heat dissipation air flow design of the present invention, the guide fins 115, 116 are mainly designed to guide the outside air into the main fins 114, so the heat dissipation fins 113 of the main fins 114 are also arc-shaped but arranged at a distance Wider to guide the airflow smoothly. In addition, a placement platform 117 higher than the heat dissipation fins 113 is provided between the guide fins 115 and 116 on the heat sink 11 .

The wind cover 12 is made of plastic material, which matches the shape of the radiator 11, and covers the radiator 11. According to the design of the heat dissipation air flow of the present invention, the wind cover 12 covers the heat dissipation fins 113, and the wind The cover 12 is provided with an air inlet 121 at the position corresponding to the placement table 117 of the radiator 11, and is provided with air guides 122, 123 at the positions corresponding to the guide fins 115, 116 (as shown in FIG. 4 ), And at the position corresponding to the main fin part 114, an air discharge part 124 is provided, wherein, the other end of the air guide part 122, 123 relative to the air inlet 121 forms a downwardly curved air guide surface 1221, 1231, so that After the outside air enters the windshield 12 from the air inlet 121, it can be guided by the air guide surfaces 1221, 1231, enter the guide fins 115, 116, and then be introduced into the main fins 114 by the guide fins 115, 116. The exhaust part 124 also includes a wind pressure chamber 1241 and an exhaust pipe 1242, the wind pressure chamber 1241 is corresponding to the main fin part 114, the exhaust pipe 1242 is connected with the wind pressure chamber 1241, and the exhaust pipe 1242 is connected to the outside The hot air is discharged, so the exhaust pipe 1242 extends radially outward from the wind pressure chamber 1241 for a certain distance, and gradually expands outward from the junction.

According to the heat dissipation air flow design of the present invention and in order to achieve the purpose of low noise of the present invention, the air intake fan 13 adopts an axial flow fan, and the air intake fan 13 is arranged at the placement table 117 and corresponds to the air inlet 121, and the air intake The fan 13 makes the air flow in the axial direction, so when the intake fan 13 rotates, the outside air will enter the wind cover 12 by the intake fan 13; the exhaust fan 14 then adopts a centrifugal fan, and the exhaust fan 14 is arranged on the fan In the pressure chamber 1241 and deviated from the central position of the wind pressure chamber 1241, a wind guide surface 1243 is formed in the wind pressure chamber 1241, and the exhaust fan 14 makes the air flow in the radial direction, and through the design of the fan blade angle, when When the exhaust fan 14 rotates, it can suck in the air from below, and make the hot air blow out to the exhaust pipe 1242 along the guide surface 1243 . The exhaust fan 14 is mainly responsible for discharging the hot air after the heat exchange of the main fin portion 114, and the intake fan 13 is mainly responsible for guiding the outside air into the guide fin portions 115, 116, so the exhaust fan 14 can adopt a relatively Large-sized fan, the air intake fan 13 can adopt a smaller-sized fan, so, according to the heat dissipation device 10 disclosed in the utility model, without changing the wind pressure of the exhaust fan 14, the increased small-sized air intake The fan 13 will not produce excessive noise.

Please also refer to Figures 2, 4, and 5. The heat sink 11 is directly pasted on the display chip and memory. When the display card performs calculations, the heat generated by the display chip and memory will be conducted to the heat sink 11 and the heat sink. On the cooling fins 113 of 11, the intake fan 13 rotates and guides the outside air to enter the wind cover 12 through the air inlet 121. The outside air first enters the air guide parts 122, 123, and is guided by the air guide surfaces 1221, 1231. Guide the outside air into the guide fins 115, 116, and then enter the main fins 114 from the guide fins 115, 116. After the outside air enters the main fins 114, it exchanges heat with the cooling fins 113 , so that the outside air is converted into hot air. At this time, the exhaust fan 14 rotates, so that the hot air enters the wind pressure chamber 1241, and the rotation of the exhaust fan 14 makes the hot air flow toward the exhaust pipe 1242 along the guide surface 1243. blow out, and the exhaust pipe 1242 extends a certain distance and gradually expands outwards, so the hot air will be discharged from the exhaust pipe 1242 smoothly; The air fan 14 discharges the hot air after the heat exchange to form the heat dissipation airflow direction of the present invention. Without increasing the wind pressure of the exhaust fan 14, the operating temperature of the display chip and memory can be effectively reduced. And because there is no need to increase the wind pressure of the exhaust fan 14, the noise during the operation of the exhaust fan 14 can not be increased, and the air intake fan 13 adopts a fan of a smaller size, which can also control its noise value, so that the utility model When the disclosed cooling device 10 is in operation, the noise level can still be controlled within the allowable range.

According to the heat dissipation device 10 disclosed in the present invention, the number of intake fans 13 can be increased according to the actual heat dissipation requirements, so that the outside air can be guided into the heat sink 11 at different positions; or according to different types of heat dissipation Device 11 intake fan 13 or exhaust fan 14 also can select axial flow fan or centrifugal fan, all can reach the purpose that the utility model announces.

The above-mentioned contents are only preferred embodiments of the present utility model, and are not used to limit the scope of implementation of the present utility model; Covered by the scope of new patents.

Claims (8)

1. A cooling device installed on a heating element for exchanging heat with the heating element to reduce the operating temperature of the heating element, characterized in that it comprises: A heat sink made of high thermal conductivity material, the heat sink is pasted on the heating component, and a plurality of heat dissipation fins are erected on the heat sink, and the plurality of heat dissipation fins constitute a structure corresponding to the heat generation component and one or more leading fin portions adjacent to the main fin portion; A windshield covering the radiator, the windshield includes an air inlet corresponding to the guide fin part, more than one wind guide part corresponding to the guide fin part, and a corresponding the exhaust part of the main fin part; More than one air intake fan is arranged at the air inlet of the windshield to generate airflow to guide the outside air into the guide fin part, and enter the main fin part from the guide fin part; and An exhaust fan is arranged at the exhaust part of the windshield, and is used to generate air flow to discharge the hot air in the main fin part to the outside. 2. The heat dissipation device according to claim 1, wherein the heat sink is made of copper. 3. The heat dissipation device according to claim 1, wherein the heat sink is made of aluminum. 4 . The heat dissipation device according to claim 1 , wherein the exhaust part further comprises a pressure chamber for setting the exhaust fan and an exhaust pipe connected to the pressure chamber. 5 . The heat dissipation device according to claim 4 , wherein the exhaust fan deviates from the center of the air pressure chamber, so as to guide the airflow into the exhaust pipe to be discharged outward. 6 . 6 . The heat dissipation device according to claim 4 , wherein the exhaust pipe gradually expands outward from the joint with the air pressure chamber. 7 . 7. The heat dissipation device according to claim 1, wherein the intake fan is an axial fan. 8. The heat dissipation device according to claim 1, wherein the exhaust fan is a centrifugal fan.

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