CN2609047Y - Combination structure of CPU cooling device and power supply - Google Patents
Combination structure of CPU cooling device and power supply Download PDFInfo
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- CN2609047Y CN2609047Y CNU032418167U CN03241816U CN2609047Y CN 2609047 Y CN2609047 Y CN 2609047Y CN U032418167 U CNU032418167 U CN U032418167U CN 03241816 U CN03241816 U CN 03241816U CN 2609047 Y CN2609047 Y CN 2609047Y
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- 238000001816 cooling Methods 0.000 title description 36
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- 239000004411 aluminium Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 230000000007 visual effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
本实用新型是一种CPU散热装置与电源供应器的结合结构,其包括:散热装置,其具有一散热本体、一风扇套及一风扇,风扇可套置且锁固于风扇套中,而风扇套则具有第一窗口及第二窗口;以及电源供应器,其具有一壳体且于壳体上开设第三窗口及至少一第四窗口,散热装置可贴置于第三窗口并锁固于电源供应器的壳体上,以便电脑运转时风扇可将CPU及电源供应器所产生的热源借由第四窗口排出,借以节省电源供应器的风扇并可降低电脑运转时的噪音。
The utility model is a combination structure of a CPU heat sink and a power supply, which comprises: a heat sink having a heat sink body, a fan sleeve and a fan, the fan can be sleeved and locked in the fan sleeve, and the fan sleeve has a first window and a second window; and a power supply having a shell and a third window and at least a fourth window opened on the shell, the heat sink can be attached to the third window and locked on the shell of the power supply, so that when the computer is running, the fan can discharge the heat source generated by the CPU and the power supply through the fourth window, thereby saving the fan of the power supply and reducing the noise when the computer is running.
Description
技术领域technical field
本实用新型是有关一种CPU散热装置与电源供应器的结合结构,尤指一种将CPU散热装置与电源供应器结合,使电源供应器可节省散热风扇,借以节省电源供应器的制造成本及降低电脑运作噪音的CPU散热装置与电源供应器的结合结构。The utility model relates to a combination structure of a CPU cooling device and a power supply, especially a combination of a CPU cooling device and a power supply, so that the power supply can save cooling fans, thereby saving the manufacturing cost of the power supply and The combined structure of the CPU cooling device and the power supply to reduce the operating noise of the computer.
背景技术Background technique
请参照图1,其所示为现有电脑的CPU散热装置的示意图。如图所示,现有CPU散热装置A包含:基座A1,具有一扣件A2以便将CPU紧扣于插座(图中未示)上;以及一风扇A3,位于基座A1上方,借由风扇A3的风力,以便将CPU(图中未示)的热排出。Please refer to FIG. 1 , which is a schematic diagram of a CPU cooling device of a conventional computer. As shown in the figure, the existing CPU cooling device A includes: a base A1, which has a fastener A2 so as to fasten the CPU on the socket (not shown in the figure); and a fan A3, located above the base A1, by The wind power of the fan A3 is so that the heat of the CPU (not shown) is discharged.
另请参照图2,其所示为现有电脑的电源供应器的示意图。如图所示,现有的电源供应器B本身亦包括一风扇B1用以将电源供应器B运转时所产生的热源吹出。Please also refer to FIG. 2 , which is a schematic diagram of a conventional power supply for a computer. As shown in the figure, the existing power supply B itself also includes a fan B1 for blowing out the heat source generated when the power supply B is running.
但此种将散热装置A及电源供应器B组合的结构具有下列缺点:1、散热装置A的风扇A3及电源供应器B的风扇B1运转时的噪音甚大;2.CPU及周边晶片所产生的热气在内部空间内循环并无法真正完全排出;3.易将外部灰尘吸入;4.组装时须考虑到风扇A3的高度是否会卡到其他电线或排线。But this kind of structure that combines heat sink A and power supply B has the following disadvantages: 1. The noise of fan A3 of heat sink A and fan B1 of power supply B is very loud when they are running; 2. The noise produced by CPU and peripheral chips The hot air circulates in the internal space and cannot be completely exhausted; 3. It is easy to inhale external dust; 4. When assembling, it must be considered whether the height of the fan A3 will be caught by other wires or cables.
有鉴于此,申请人乃本着长年来从事产品研发与产销的经验,潜心研究,期能克服上述缺失,经再三实验,创作出本实用新型的CPU散热装置与电源供应器的结合结构。In view of this, the applicant, based on years of experience in product development and production and marketing, devoted himself to research in order to overcome the above-mentioned shortcomings. After repeated experiments, he created the combination structure of the CPU cooling device and power supply of the present invention.
实用新型内容Utility model content
本实用新型的目的是提供一种CPU散热装置与电源供应器的结合结构,使电源供应器可节省散热风扇,借以节省电源供应器的制造成本,节省电力及降低电脑运作噪音The purpose of this utility model is to provide a combined structure of a CPU cooling device and a power supply, so that the power supply can save cooling fans, thereby saving the manufacturing cost of the power supply, saving electricity and reducing the operating noise of the computer
为达到上述目的,本实用新型的技术解决方案是提供一种CPU散热装置与电源供应器的结合结构,设于一电脑中,电脑至少具有一CPU,结合结构包括:一散热装置,其具有一散热本体、一风扇套及一风扇,风扇可套置且锁固于风扇套中,而风扇套则具有一第一窗口及一第二窗口;以及一电源供应器,其具有一壳体且于壳体上开设一第三窗口及至少一第四窗口,散热装置可贴置于第三窗口并锁固于电源供应器的壳体上,以便电脑运转时风扇可将CPU及电源供应器所产生的热源借由第四窗口排出,借以节省电源供应器的风扇并可降低电脑运转时的噪音。In order to achieve the above object, the technical solution of the present utility model is to provide a combined structure of a CPU cooling device and a power supply, which is installed in a computer, the computer has at least one CPU, and the combined structure includes: a cooling device, which has a The cooling body, a fan cover and a fan, the fan can be sleeved and locked in the fan cover, and the fan cover has a first window and a second window; and a power supply, which has a housing and A third window and at least one fourth window are provided on the casing, and the cooling device can be pasted on the third window and locked on the casing of the power supply so that the fan can dissipate the heat generated by the CPU and the power supply when the computer is running. The heat source is exhausted through the fourth window, so as to save the fan of the power supply and reduce the noise when the computer is running.
所述的结合结构,其中散热本体进一步包括:The combined structure, wherein the heat dissipation body further includes:
至少一导热管,其内部具有一金属编织网,用以传导热;At least one heat pipe with a metal braided mesh inside for heat conduction;
一基座,基座的底部为中空且至少一导热管穿设于基座的中空底部;以及A base, the bottom of the base is hollow and at least one heat pipe passes through the hollow bottom of the base; and
复数个散热片,每一散热片具有相对应于至少一导热管数量的孔且彼此重叠,以便将至少一导热管穿设于复数个散热片之中。A plurality of cooling fins, each cooling fin has holes corresponding to the number of at least one heat pipe and overlap each other, so that at least one heat pipe is passed through the plurality of cooling fins.
所述的结合结构,其中金属片是为铜片。Said combined structure, wherein the metal sheet is a copper sheet.
所述的结合结构,其中至少一导热管是呈略为弯曲状。In the combined structure, at least one heat pipe is slightly curved.
所述的结合结构,其中所述散热片是为铝挤型散热片。In the combined structure, the heat sink is an extruded aluminum heat sink.
所述的结合结构,其中风扇是为外吹式。Said combination structure, wherein the fan is an external blowing type.
所述的结合结构,其中第二窗口上具有一金属编织网。In the combined structure, there is a metal braided mesh on the second window.
所述的结合结构,其中散热装置的方向可视电源供应器的第三窗口的方向而旋转。In the combined structure, the direction of the cooling device can be rotated according to the direction of the third window of the power supply.
一种电源供应器,是设于一电脑中,用以提供电脑运作时所需的电源,其特征在于:电源供应器的机壳上具有一第一窗口及至少一第二窗口,且第二窗口上具有一保护网,第一窗口可用以贴置并锁固一外接式风扇,以便电脑运转时可借由外接式风扇将CPU及电源供应器所产生的热源借由第二窗口排出,借以节省电源供应器的风扇,节省电力并可降低电脑运转时的噪音。A power supply is installed in a computer to provide the power needed for the operation of the computer. It is characterized in that: the casing of the power supply has a first window and at least one second window, and the second There is a protective net on the window, and the first window can be used to stick and lock an external fan, so that when the computer is running, the heat source generated by the CPU and power supply can be discharged through the second window through the external fan, so that Save the fan of the power supply, save power and reduce the noise when the computer is running.
为能进一步了解本实用新型的结构、特征及其目的,兹附以图式及较佳具体实施例的详细说明如后。In order to further understand the structure, features and purpose of the present utility model, drawings and detailed descriptions of preferred specific embodiments are attached hereafter.
附图说明Description of drawings
图1、所示为现有电脑的CPU散热装置的示意图;Fig. 1 shows the schematic diagram of the CPU cooling device of the existing computer;
图2、所示为现有电脑的电源供应器的示意图;FIG. 2 shows a schematic diagram of a power supply for an existing computer;
图3、所示为本实用新型CPU散热装置与电源供应器的结合结构的分解示意图;Fig. 3 shows an exploded schematic view of the combined structure of the CPU cooling device and the power supply of the present invention;
图4、所示为本实用新型的散热本体的组合立体示意图;Fig. 4 is a combined stereoscopic schematic diagram of the heat dissipation body of the present invention;
图5,其所示为本实用新型电源供应器的示意图。FIG. 5 is a schematic diagram of the power supply of the present invention.
具体实施方式Detailed ways
请参照图3,其所示为本实用新型CPU散热装置与电源供应器的结合结构的分解示意图。如图所示,结合结构包括:Please refer to FIG. 3 , which is an exploded schematic diagram of the combined structure of the CPU cooling device and the power supply of the present invention. As shown, the binding structure includes:
一散热装置1以及一电源供应器2。A
其中,散热装置1至少具有一散热本体10、一风扇套11及一风扇12,且风扇套11具有第一窗口111及第二窗口112;电源供应器2内并不具有风扇,其具有一壳体21且于壳体21上开设一第三窗口210及至少一第四窗口211。于组合时,散热装置1的风扇12可套入风扇套11中且以螺丝(图未示)锁固于风扇套11的螺孔113中。然后,再将风扇套11贴置于电源供应器2的第三窗口210并锁固于其壳体21上。如此,当电脑运转时风扇12可将CPU(图未示)所产生的热先抽至电源供应器2的壳体21内,再结合电源供应器2所产生的热源后由第四窗口211排出,借以节省电源供应器2的风扇并可降低电脑运转时的噪音。Wherein, the
其中,散热装置1的第一窗口111的大小需小于电源供应器2的第三窗口210,以方便风扇12贴置及锁固于壳体21上。此外,本实用新型的散热装置、与电源供应器2的结合方向可视需要而加以改变,例如电源供应器2由电脑机壳(图未示)的右后方换至左后方时,则只需将散热装置1由原来的方向右旋转90度(对照于主机壳体背面板的方向)换成向左旋转90度即可使风扇12再度贴合于电源供应器2的第三窗口210,使本实用新型的散热装置1与电源供应器2的结合更具弹性。Wherein, the size of the
请参照图4,其所示为本实用新型的散热本体10的组合立体示意图。如图所示,本实用新型的散热本体10,进一步包括:至少一导热管101;基座102;以及复数个散热片103。Please refer to FIG. 4 , which is a schematic perspective view showing the assembly of the
其中,导热管101,其内部具有一金属编织网(图未示)用以传导热:基座102的底部1021为中空且至少一导热管101穿设于基座102的中空底部1021;那些散热片103中,每一散热片103具有相对应于导热管101数量且彼此重叠的孔,以便将导热管101穿设于散热片103之中。Wherein, the
本实用新型的CPU散热装置与电源供应器的结合结构的动作原理如下:导热管101的内部具有一金属编织网且具有水滴,当基座102将CPU(图未示)所产生的热传导至导热管101时,利用水滴过热时蒸发成水蒸气且热空气往上升的原理,会将热空气传导至散热片103散热,再经由套式风扇12将热空气往外抽,热空气在散热片103与冷空气进行热交换,因为导热管101中具有金属编织网可以使热空气交换频率更快,如此水蒸气在导热管101中很快就会凝结成水滴,水滴会往下再流回导热管101的较低处以再次与CPU所产生的热进行热交换,如此周而复始以便将CPU所产生的热经由风扇12抽至电源供应器2后再一起将电源供应器2与CPU所产生的热经由第四窗口211散热至电脑机壳的外侧。The operating principle of the combined structure of the CPU cooling device and the power supply of the present invention is as follows: the inside of the
其中,导热管101的数量视CPU所产生的热而定,一般而言,本实用新型的导热管101一根可以吸收40瓦(w)的热量。由于安装时的考虑,导热管101会稍微弯曲以便将导热管101穿设于散热片103之中再锁固于机壳21上,因此导热管101的效率会略为降低至约30瓦左右。Wherein, the number of
而散热片103较佳是为铝挤型散热片所组成,但其他散热材料亦可,每一散热片103具有相对应于导热管101数量且彼此重叠的孔,以便将导热管101穿设于复数个散热片103之中,进行热交换。The
其中,风扇套11可套接至散热片103的外缘以包住风扇12,且具有至少一个螺孔113,以便锁固于电源供应器2的机壳21上。且较佳者风扇套11是为金属制成,以便将热传导至机壳21上,以增进热传导效率。且风扇12为外吹式,只将热空气往外柚,因此并不会将灰尘带至机壳21内。Wherein, the
请参照图5,其所示为本实用新型电源供应器的示意图。如图所示,电源供应器2包括:一机壳21;一第三窗口210以及一第四窗口211。其中第三窗口210是与风扇12耦接,因此其大小需稍大于风扇12以免阻挡气流;而第四窗口211的大小则可视需要而定,且其外部需加上一金属编织网(图未示)以避免异物伸入。Please refer to FIG. 5 , which is a schematic diagram of the power supply of the present invention. As shown in the figure, the
所以,经由本实用新型的实施,除散热装置具有散热佳、静音、组装容易、散热装置整体结构上轻下重使得散热装置的基座能更贴紧CPU且利用套式风扇并将风扇固定于机壳上,使风扇震动不至于影响到散热装置等优点外,电源供应器亦可节省一散热风扇以达到节省电源供应器的制造成本、降低电脑运作噪音及节省电源消耗的目的。Therefore, through the implementation of the utility model, the cooling device has the advantages of good heat dissipation, quietness, easy assembly, the overall structure of the cooling device is light and heavy, so that the base of the cooling device can be more closely attached to the CPU and the sleeve fan is used to fix the fan on the On the casing, the fan vibration will not affect the cooling device. The power supply can also save a cooling fan to save the manufacturing cost of the power supply, reduce the operating noise of the computer and save power consumption.
本实用新型所揭示者,乃较佳实施例,举凡局部的变更或修饰而源于本实用新型的技术思想而为熟习本项技艺的人所易于推知者,俱不脱本实用新型的专利权范畴。What is disclosed in this utility model is a preferred embodiment. For example, all partial changes or modifications derived from the technical idea of this utility model and easily deduced by those who are familiar with the art will not break away from the patent right of this utility model. category.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102156514A (en) * | 2011-04-21 | 2011-08-17 | 高明成 | Mute cooling device for industrial personal computer |
CN105263296A (en) * | 2015-10-26 | 2016-01-20 | 西安电子工程研究所 | High-heat-density high-power solid-state emission module radiating device |
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2003
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102156514A (en) * | 2011-04-21 | 2011-08-17 | 高明成 | Mute cooling device for industrial personal computer |
CN105263296A (en) * | 2015-10-26 | 2016-01-20 | 西安电子工程研究所 | High-heat-density high-power solid-state emission module radiating device |
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