CN2765244Y - Fanless industrial computer structure device with aluminum fin cooling case - Google Patents

Abstract

A no fan industrial computer structure device of aluminum fin heat dissipation shell comprises a heat conduction block, a plurality of heat conduction pipes, a motherboard and a heat dissipation shell, and is characterized in that: the surface of the heat dissipation shell extends outwards to form a plurality of fins, and the inner side of the heat dissipation shell is provided with a plurality of concave grooves in a hollow mode, so that the heat conduction pipes can be embedded into the inner side of the shell in a clamping or attaching mode; one end of the heat conducting block is contacted with the inside of the heat radiating shell, the other end of the heat conducting block is contacted with the electronic component on the mainboard, a plurality of round holes are arranged in the heat conducting block in a hollow mode for containing the heat conducting pipes, and the heat conducting pipes can be arranged in a better mode which is beneficial to heat transfer. The utility model discloses can be quicker, even conduction to this aluminium system fin heat dissipation shell with each electronic component's of system inside heat energy, the rethread is outside to the system, replaces the tradition at the way of system internally mounted fan, can effectively reduce noise at work and save the system inner space, becomes a silence micro industrial computer.

Description

Fanless industrial computer structure device with aluminum fin cooling case

technical field

The utility model relates to a fanless industrial computer structure device of an aluminum fin heat dissipation shell.

Background technique

With the demand for electronic products to be light, thin, fast, high-functional, and high-frequency, the calorific value is getting higher and higher. With the development and use of microprocessors above 3GHz, the calorific value is more than 80W, making the computer's Heat dissipation has become a thorny problem. Due to the needs of the working environment, the size of the industrial computer is thinner, lighter and shorter than that of office or home computers, so the heat dissipation environment is more stringent.

At present, the heat sink is mostly made of aluminum and copper. Although the thermal conductivity of copper is better than that of aluminum, copper has a large proportion, high hardness and melting point, is expensive and difficult to mass-produce, so the market share is only 5%. The heat dissipation rate of the aluminum heat sink cannot keep up with the increasing heat, and the main reasons are as follows.

During the operation of electronic components or devices, it is inevitable to generate heat, and the removal of heat requires conduction, convection and radiation to discharge the heat to the surrounding environment, reduce the operating temperature of electronic products, and maintain the stability of the system operation The heat dissipation method commonly used by electronic components is the heat sink. The heat sink is a thermally conductive material fixed on the surface of the electronic component, so as to conduct the heat generated by the electronic component to the surrounding environment. Its structure is mostly formed by the base plate and fins Composition, the base plate part is directly in contact with the electronic components, the main function is heat uniformity, so that the heat is quickly conducted and diffused, the role of the fin part is heat dissipation, the heat diffused through the base plate is transferred by the increase of the surface area, and the heat is dissipated by air convection Dissipate from the surface of the fins to the surrounding environment. The larger the surface area of the fins, the better the heat dissipation effect, the better the electronic components can achieve the proper performance, and the more energy-saving effect.

In view of the above reasons, the heat dissipation problem of industrial computers is an urgent subject that needs to be improved. Therefore, the creators of this work continue to experiment, and eventually a more perfect creation will be produced.

Utility model content

The main purpose of the utility model is to provide a fanless industrial computer structural device with a simple structure and a good heat dissipation aluminum fin heat dissipation shell.

In order to achieve the above-mentioned purpose, the computer casing itself is a heat sink, and the fanless industrial computer structural device of the aluminum fin heat dissipation shell includes a heat conduction block, a plurality of heat conduction pipes, a main board, and a heat dissipation shell. The shell is made of aluminum material after preheating, and is made of an extrusion mold. The surface extends outwards to form a plurality of fins, and the inner side is embedded with a plurality of heat pipes, which are in contact with the heat conduction block. The other part of the heat conduction block One end is in contact with heat-generating electronic components on the motherboard, such as microprocessors.

The function of the heat conduction block is to equalize the heat, so that the heat energy generated by the electronic components is quickly transferred to the heat dissipation shell, and the fins extending outward from the heat dissipation shell dissipate the heat energy to the outside.

The utility model has the advantages that: the utility model can conduct the heat energy of each electronic component inside the system to the aluminum fin heat dissipation shell more quickly and evenly, and then conduct it to the outside of the system, replacing the traditional method of installing a fan inside the system, It can effectively reduce the working noise and save the internal space of the system, becoming a silent miniature industrial computer. This creation fully utilizes the advantages of the large heat dissipation shell, greatly improves the heat dissipation efficiency of the aluminum fin heat dissipation shell, and eliminates the lack of the conventional heat dissipation shell where heat energy is mostly concentrated on the contact surface of the heat conduction block. The utility model can be used for light, thin and short industrial use computer.

Description of drawings

Fig. 1 is the embodiment figure of the utility model.

Figure 2 is a sectional view of the utility model.

Fig. 3 is a combined perspective view of the utility model.

Fig. 4 is a schematic view of the utility model in use.

Fig. 5 is a bottom view of the heat dissipation housing of the present invention.

(1) Heat conduction block

(2) heat pipe

(3) Motherboard

(31) Microprocessor

(32)North bridge chip

(4) Heat dissipation shell

(41) a fin

(42)Section

(43) screw hole

(44)Front cover

(441)Switch

(442) connection port

(443)Memory card extraction area

(45) rear cover

(46) Groove

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is described further.

Please refer to Fig. 1, Fig. 2 and Fig. 3, the fanless industrial computer structure device of the aluminum fin cooling case, comprising a heat conduction block 1, a plurality of heat conduction pipes 2, a main board 3, and a heat dissipation case 4, which dissipates heat The shell 4 is made of an extrusion mold after preheating the aluminum material. The surface extends outwards to form a plurality of fins 41. The direction of the fins 41 can be arranged vertically or horizontally. The purpose is to increase the heat dissipation of the shell 4. The area in contact with the outside air is provided with a plurality of screw holes 43 on the front and rear cut surfaces 42 of the heat dissipation shell, which can be used for fixing the front cover 44 and the rear cover 45 with screws. On the front cover 44 and the rear cover 45 A switch 441, a connection port 442, a memory card extraction area 443, etc. are provided. The inner side of the heat dissipation shell 4 is hollowed out with a plurality of recessed grooves 46, which can be used for the heat pipe 2 to be clamped or pasted. Embedded in the inner side of the heat dissipation shell 4; the heat pipe 2 is a vacuum tube made of a material with good heat conduction characteristics, and its interior contains a material with better heat conduction characteristics. The heat pipe 2 can be arranged in any way, and its purpose is to make The heat energy is more evenly and quickly conducted to the various parts of the heat dissipation shell 4; the heat conduction block 1 is made of a material with good thermal conductivity, one end of which is in contact with the heat dissipation shell 4, and the other end is in contact with the heat-generating electronic components on the motherboard 3 Contact, such as microprocessor 31 and north bridge chip 32 etc., the shape of heat conduction block 1 can be the combination of the shape of several electronic components that need to conduct heat, in addition, its inside is provided with a plurality of circular holes in a hollowed out manner, with To accommodate the heat pipe 2.

The heat generated by electronic components such as the microprocessor 31 and the north bridge chip 32 is then conducted through the heat conduction block 1 to the heat dissipation shell 4, and through the heat conduction pipe 2 buried inside it, the heat is conducted more quickly and evenly To each part of the heat dissipation shell 4, the heat is dissipated to the outside through the fins 41 on the outside of the heat dissipation shell 4, so there is no need to set an electric fan inside.

Claims (2)

1. A fanless industrial computer structural device of an aluminum fin heat dissipation shell, comprising a heat conduction block, a plurality of heat pipes, a mainboard, and a heat dissipation shell, characterized in that: the surface of the heat dissipation shell extends outwards into A plurality of fins, the inner side of which is hollowed out, is provided with a plurality of concave grooves, which can be used for the heat pipe to be inserted into the inner side of the shell by clamping or pasting, and the heat pipe can be arranged in a better pattern for heat transfer; The heat pipe is a vacuum tube made of a material with good heat conduction properties, and contains a substance with better heat conduction properties inside; The heat conduction block is made of a material with good thermal conductivity. One end of the heat conduction block is in contact with the inside of the heat dissipation shell, and the other end is in contact with the electronic components on the motherboard. A plurality of circular holes are hollowed out inside the heat conduction block to accommodate Heat pipes are placed, which can be arranged in a better mode for heat transfer. 2. The structural device of the fanless industrial computer with aluminum fin heat dissipation housing according to claim 1, characterized in that the shape of the heat conduction block can be a combination of the shapes of several electronic components that need to conduct heat. 3. The fanless industrial computer structural device of the aluminum fin heat dissipation housing according to claim 1, wherein the electronic component can be a microprocessor, a north bridge chip or any electronic component that generates heat.

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