CN2857221Y - Heat radiator with air guide sleeve - Google Patents

Abstract

A heat dissipating double-fuselage with air deflector, including a heat sink and a fan, the heat sink includes a base and several heat-dissipating fins, the fan is installed on one side of the heat sink, the airstream crosses from the air current channel among the heat-dissipating fin first, blow out from one side of the fan back to the heat sink after flowing through the fan, the heat dissipating double-fuselage with air deflector also includes a air deflector fixed on one side of the fan back to the heat sink, there is a flow deflector on the air deflector, the flow deflector extends downward along the slope of the air current direction, make the airstream blown out of the fan flow downward and blow the peripheral heating electronic component obliquely. The utility model discloses heat abstractor with kuppe not only can be the central processing unit heat dissipation, can also assist simultaneously for the peripheral electronic component heat dissipation that generates heat, has dual efficiency.

Description

Cooling unit with shroud

technical field

The utility model relates to a heat dissipation device with a flow guide cover, in particular to a heat dissipation device with a flow guide cover which can simultaneously help heat-generating electronic components around a central processing unit to dissipate heat.

Background technique

Generally, current electronic devices, such as the central processing unit in a computer and the electronic components on the surrounding motherboard, will emit heat under working conditions. Therefore, it is usually necessary to install a cooling device on the central processing unit to dissipate heat. The cooling device includes a radiator and a fan installed on one side of the radiator, along the airflow direction of the fan, a number of cooling fins are arranged, the airflow passes through the cooling fins and then flows forward in a straight line, and the airflow does not blow through the central processing unit. electronic components around the device. But without airflow over the electronic components surrounding the CPU, the heat generated by these electronic components can build up beyond their normal operating temperature, causing the computer system to malfunction. Therefore, if a kind of cooling device is designed, the flow direction of the airflow blown by the fan can be changed so that it blows over the electronic components around the central processing unit, and assists these electronic components to dissipate heat, which will be required by the industry.

The general air guide design is shown in the "cooling device of the central processing unit" described in Chinese Patent No. 01231572.9. The heat sink is provided with at least one guide plate in the airflow route formed by the cooling fan. There is a curved portion, and an airflow opening is provided under the heat sink, and the airflow opening is opposite to the guide plate, so that the airflow passes through the airflow opening along the curved portion and directly impacts the electronic components to dissipate heat. This design is only applicable to the used radiator of notebook computer, and is not applicable to the used radiator of general desktop computer.

Contents of the invention

The main purpose of the utility model is to provide a heat dissipation device with a shroud, which can simultaneously help the heat-generating electronic components around the central processing unit to dissipate heat.

In order to achieve the above object, the utility model provides a cooling device with a shroud, including a radiator and a fan, the radiator includes a base and a number of cooling fins, the fan is mounted on the radiator On one side of the radiator, the airflow first passes through the airflow channel between the cooling fins, flows through the fan, and then blows out from the side of the fan facing away from the radiator. The cooling device with a shroud also includes a The air deflector on the side of the fan facing away from the radiator is provided with a deflector, and the deflector extends obliquely downward along the airflow direction, so that the airflow blown by the fan flows obliquely downward and blows the surrounding heat. Electronic component.

The utility model has the following beneficial effects: the utility model has a cooling device with a deflector cover that can not only dissipate heat for the central processing unit, but also assist in dissipating heat for surrounding heating electronic components, and has dual functions.

Description of drawings

Fig. 1 is a schematic diagram of the airflow blowing the peripheral heat-generating electronic components of the heat dissipation device with a shroud of the present invention.

Fig. 2 is a three-dimensional exploded view of the heat dissipation device with a shroud of the present invention.

Fig. 3 is a perspective view of the air guide cover of the heat dissipation device with the air guide cover of the present invention.

Fig. 4 is a three-dimensional assembled view of the heat dissipation device with a shroud of the present invention.

Detailed ways

Referring to FIGS. 1 to 4 , a cooling device with a wind deflector includes a heat sink 1 , a fan fixing frame 2 , a fan 3 and a wind deflector 4 .

The heat sink 1 is installed on the top surface of a central processing unit 7 to dissipate heat for it. The central processing unit 7 is mounted on a motherboard 6, and the motherboard 6 is on the side of the fan 3 away from the radiator 1. There are also a plurality of heating electronic components 62 (such as capacitors for powering the central processing unit).

The heat sink 1 includes a base 12 , a plurality of heat dissipation fins 14 protruding upward from the base 12 , and two heat pipes 16 passing between the base 12 and the heat dissipation fins 14 . The bottom surface of the base 12 of the heat sink 1 is in close contact with the top surface of the central processing unit 7, so that the heat generated by the central processing unit 7 is conducted to the cooling fins 14 and dissipated into the air. Both sides of the base 12 are respectively provided with a locking device 18 , and the two locking devices 18 lock the radiator 1 to the motherboard 6 .

The fan fixing frame 2 is fixed on the radiator 1 , and an air slot 22 is arranged in the center of the frame on one side of the radiator 1 , and four corners of the air slot 22 are respectively provided with a screw hole 24 .

The fan 3 is an axial-flow fan, with an impeller 31 arranged in the center, and a through hole 32 corresponding to the screw hole 24 of the fan holder 2 at each of its four corners. One side of the radiator 1 is fixedly attached to the fan fixing frame 2 .

The wind deflector 4 is fixed on the side of the fan 3 facing away from the radiator 1, and mainly includes a deflector 42 extending obliquely downwards and bent toward the fan 3 from both sides of the lower part of the deflector 42. Extended side panels 52 . A top of the deflector 42 is bent toward the fan 3 to extend a top plate 44 . The two sides of the upper part of the deflector 42 are also bent vertically toward the fan 3 to extend a connecting plate 46, and the end of the connecting plate 46 is further bent vertically outwards to extend a fixing plate 48, and a fixed plate 48 is set on the fixing plate 48 There is a perforation 50 . Two screws 34 correspondingly pass through the perforation 50 of the wind deflector 4 and the through hole 32 of the fan 3 and then are screwed into the two screw holes 24 on the upper part of the fan fixing frame 2, thereby locking the wind deflector 4 Fixed to the side of the fan 3 facing away from the radiator 1.

The fan 3 is a suction fan, and the cooling air flow first passes through the air passage between the heat dissipation fins 14 of the radiator 1, and then flows through the fan 3 to accelerate and then from the side of the fan 3 facing away from the radiator 1 Blowing out, because the deflector 42 of the shroud 4 extends obliquely downward along the airflow direction, so that the airflow blown out by the fan 3 flows obliquely downward and blows the surrounding heating electronic components 62, the top plate 44 and both sides The plates 52 respectively surround the upper side and the left and right sides of the airflow direction, preventing the airflow from flowing out from the upper side and the left and right sides, ensuring that the airflow blows downwards to help the heat-generating electronic components 62 dissipate heat, prevent heat accumulation and ensure the normal operation of the heating-generating electronic components 62.

The heat dissipation device with the air deflector of the utility model can not only dissipate heat for the central processing unit 7, but also assist heat dissipation for the surrounding heating electronic components 62, and has dual functions.

Claims (9)

1. A heat dissipation device with a shroud, comprising a radiator and a fan, the radiator includes a base and a plurality of cooling fins, the fan is installed on one side of the radiator, the airflow first flows from The airflow channel between the cooling fins passes through, flows through the fan, and then blows out from the side of the fan facing away from the radiator. It is characterized in that: the heat dissipation device with a shroud also includes a The air deflector on one side of the radiator is provided with a deflector, and the deflector extends obliquely downward along the airflow direction, so that the airflow blown by the fan flows obliquely downward and blows the surrounding heating electronic components. 2 . The heat dissipation device with a deflector according to claim 1 , wherein the top end of the deflector bends toward the fan and extends to form a top plate. 3 . The heat dissipation device with a deflector according to claim 1 , wherein both sides of the lower part of the deflector are also bent toward the fan and extend out a side plate. 4. The heat dissipation device with air deflector according to claim 1, characterized in that: the heat dissipation device with air deflector further comprises a fan fixing frame, and the fan fixing frame is fixed on the radiator, and its An air groove is arranged in the center of the frame body located on one side of the radiator, and a screw hole is arranged in each of its four corners. An impeller is arranged in the center of the fan, and a through hole is arranged in each of the four corners corresponding to the screw holes. 5. The heat dissipation device with a deflector according to claim 4, wherein a fixing plate is provided on both sides of the upper portion of the deflector, and a perforation is opened on the fixing plate, through which two screws pass. The perforations of the wind deflector and the through holes of the fan are screwed into the two screw holes on the upper part of the fan fixing bracket one by one, so that the wind deflector is locked to the side of the fan facing away from the radiator. 6. The heat dissipation device with a deflector according to claim 5, characterized in that: the two sides of the upper part of the deflector first bend a connecting plate vertically toward the fan, and then separate from the two connecting plates The two fixing plates are bent vertically at the ends. 7. The heat dissipation device with a shroud according to claim 1, characterized in that: the heat sink is installed on the top surface of a central processing unit to dissipate heat for it, and the central processing unit is installed on a mainframe On the board, the above-mentioned heating electronic components are arranged on the main board and located on the side of the fan facing away from the radiator. 8. The heat dissipation device with a shroud according to claim 7, wherein a locking device is provided on both sides of the base, and the two locking devices lock the heat sink to the motherboard superior. 9. The heat dissipation device with a shroud according to claim 1, wherein the heat dissipation fins protrude upward from the base.

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