CN2587131Y - Measuring structure for alignment and shrinkage of multilayer printed circuit boards - Google Patents
Measuring structure for alignment and shrinkage of multilayer printed circuit boards Download PDFInfo
- Publication number
- CN2587131Y CN2587131Y CN 02282419 CN02282419U CN2587131Y CN 2587131 Y CN2587131 Y CN 2587131Y CN 02282419 CN02282419 CN 02282419 CN 02282419 U CN02282419 U CN 02282419U CN 2587131 Y CN2587131 Y CN 2587131Y
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- expansion
- printed circuit
- multilayer printed
- alignment
- shrinkage
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- 239000010410 layer Substances 0.000 claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims abstract description 3
- 239000002356 single layer Substances 0.000 claims abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 description 24
- 238000007731 hot pressing Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 241000761557 Lamina Species 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a measuring structure of the alignment degree and the expansion and contraction degree of a multilayer printed circuit board, which mainly comprises four light transmission areas which are respectively arranged on four directions horizontally extending outwards from the center of each single layer board of the multilayer printed circuit board; and a plurality of position marks which are positioned in each light-transmitting area, have numbers and symbols and are used for respectively representing the sequence of various relative positions. Therefore, the method has the effect of nondestructively and rapidly measuring the actual alignment, the layer sequence and the expansion and contraction degree of the multilayer circuit board.
Description
Technical field
The utility model relates to a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, particularly about on horizontally extending outward four orientation of each layer circuit board a transparent area and lighttight several position marks being set respectively, so that accurately measure the measuring construction of the Aligning degree difference that the large tracts of land multilayer circuit board causes because of the harmomegathus of being heated.
Background technology
Commonly use the measuring construction of multilayer board Aligning degree, can select to utilize concentric circles to aim at method or longitudinal section method and be obtained Aligning degree between each lamina, with as the reference of adjusting processing procedure and raising yield.Wherein, this concentric circles aligning method is to belong to nondestructive aligning method, in the edges of boards of each lamina or a common transmission region of middle position the different lighttight circular concentric of diameter is set respectively, thereby after each lamina is by hot pressing, promptly can obtain several concentrically ringed register images, and compared relativity shift situation between each lamina, and measure whether conformance with standard of its Aligning degree with instrument; In addition, this longitudinal section rule belongs to destructive aligning method, after each lamina is by hot pressing, supplies to analyze its Aligning degree with drilling machine boring and with probe measurement.Yet, this concentric circles is aimed at method when lamina plate number is too much, too much concentric circles will be unfavorable for that computer accurately judges Aligning degree, and this longitudinal section method is except consuming time and cost is higher, and the difference of position, direction and angle in the time of more can be because of boring influences the correctness that computer is judged Aligning degree.Moreover, when being applied in large-area multilayer board, except between each lamina, understand the relativity shift, it also makes the Aligning degree of each position inconsistent because of the expansion-contraction degree that is heated is different, therefore the independent Aligning degree of obtaining with aforementioned concentric circles aligning method or longitudinal section method, and can't represent the actual Aligning degree of each each position of lamina, thereby if wrongly over-evaluate the chance that Aligning degree will be missed instant adjustment processing procedure, and cause the successive process yield of this multilayer circuit board to reduce.
Another commonly uses the amount side structure of multilayer board Aligning degree and expansion-contraction degree, as United States Patent (USP) the 4th, 510, " measuring the test measuring construction of the interlayer coincidence status of multilayer board " patent of invention of No. 446, please refer to shown in Figure 14, it is that the edges of boards that are disclosed in each lamina are provided with array test through hole A to H, each group test through hole A to H then is provided with several through holes 91 to 97 of the different laminas of conducting, this lamina appropriate location then is provided with in addition with reference to through hole 98, therefore by the resistance value between each through hole of probe (not illustrating) comparison, to learn the relativity shift and the harmomegathus situation of each each position of lamina behind the hot pressing, yet, the shortcoming of this measuring construction is still need get out the perforation of different-diameter on each lamina, it still has the consuming time of aforementioned destructive perforation, cost shortcomings such as correctness higher and that measure because of boring influence.
Another commonly uses the measuring construction of multilayer board contraposition, as United States Patent (USP) the 5th, 093, " combination confirms that floor does not reach the printed circuit board (PCB) of order " patent of invention of No. 183, please refer to shown in Figure 15, it is to disclose each lamina is provided with particular sorted order respectively in regular turn in a common transparent area 80 a numeral 81 and one striped 82, behind each lamina hot pressing, then by striped 82 shading values and the luminous intensity of judging each layer, to confirm not in proper order whether mistake of its layer, though should construct the other order of energy identification layer, yet it also can't be in order to measure each position of each lamina and whole relativity shift and expansion-contraction degree.
Another commonly uses the measuring construction of multilayer board contraposition, as United States Patent (USP) the 5th, 010, " method that multilayer board and particular order combination thereof are confirmed " patent of invention of No. 449, please refer to shown in Figure 16, it is to disclose each lamina in a common mark zone 70 gradually long a light tight district 71 and a gradually short transparent area 72 to be set in regular turn respectively, and each transparent area 72 is provided with a numeral 73 in regular turn, thereby, when whether being scalariform in regular turn and being arranged in each light tight district 71 by inspecting each numeral 73 behind each lamina hot-platen, can be for the layer of confirmation form laminate mistake not in proper order whether, yet this structure also can't be in order to measure each position of each lamina and whole relativity shift and expansion-contraction degree.
Summary of the invention
In view of this, the utility model is improved above-mentioned shortcoming, wherein be on horizontally extending outward four orientation, each lamina center, a transparent area to be set respectively, each transparent area is provided with all places mark and represents layer not respectively, about reaching up and down, this mark is to be lighttight Copper Foil, and each lamina can be by intense light sources such as X+ay behind hot pressing, obtain the last apparent weight platform image of each transparent area, to analyze the relativity shift degree of each position mark, thereby, the utility model not only can nondestructively record the actual Aligning degree of each position fast, and more can after the difference that compares its Aligning degree, infer the whole actual expansion-contraction degree of each lamina, for adjusting the hot pressing processing procedure, to reach the purpose that improves the successive process yield.
Main purpose of the present utility model provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, wherein each lamina center outward horizontal-extending four transparent areas and lighttight several position marks are set, it can be by X-ray behind hot pressing, obtain the last apparent weight group photo picture of each transparent area, analyzing each mark relativity shift degree, and make the actual Aligning degree that the utlity model has nondestructive rapid measuring multilayer circuit board, layer not in proper order and the effect of expansion-contraction degree.
Secondary objective of the present utility model provides a kind of Aligning degree of multilayer board and the amount side structure of expansion-contraction degree, wherein the edges of boards of each lamina respectively correspondence be provided with a transparent area have a lighttight circular pattern, layer not numeral and distance values in regular turn at interval suitably distance arrange, for behind hot pressing, inspecting and the Computerized measurement cls analysis, and make the effect of the whole relativity shift degree that the utlity model has the double acknowledge multilayer circuit board by X-ray.
The utility model provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, mainly comprises four transparent areas, and it is arranged at respectively on horizontally extending outward four orientation, center of each lamina of a multilayer board; And several position marks, it is positioned at each transparent area and has numeral, symbol, and for the order of representing various relative positions respectively.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, and above-mentioned each position mark is the light tight Copper Foil in each transparent area.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, and the numeral of above-mentioned each position mark, symbol are for about representing layer to reach not, up and down.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, and the central point of above-mentioned each lamina is provided with a transparent area and has several anchor points.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, and the transparent area of the central point of above-mentioned each lamina is provided with several concentric circless with auxiliary each transparent area and position mark contraposition.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, and this part anchor point is the boring of same size.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, and the position mark of above-mentioned each transparent area has spacing distance and not overlapped.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, and the position mark of above-mentioned lamina one transparent area wherein is a position line.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, the edges of boards of this each lamina in addition respectively correspondence one transparent area is set, have respectively in each transparent area a circular pattern and layer not numeral be spaced in regular turn.
The utility model also provides a kind of Aligning degree of multilayer board and the measuring construction of expansion-contraction degree, has a lighttight distance values in this transparent area in addition, and itself and circular pattern and the other figure blank of layer are arranged.
The actual Aligning degree, layer that the utlity model has nondestructive rapid measuring multilayer circuit board not in proper order and the effect of expansion-contraction degree.
Description of drawings
The relative arrangement position schematic diagram of Fig. 1 the utility model on a multilayer board.
Fig. 2～7 local the top view that amplifies of the present utility model.
The contraposition combination step schematic diagram of Fig. 8～12 the utility model each position mark when carrying out hot pressing.
Figure 13 of the present utility model one auxiliary measurement is configured in the amplification of the part after bit combination top view.
Figure 14 commonly uses the combination top view of No. the 4th, 510,446, U.S..
Figure 15 commonly uses the combination top view of No. the 5th, 093,183, U.S..
Figure 16 commonly uses the U.S. the 5th; 010, No. 449 exploded perspective view.
Embodiment
For above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, preferred embodiment of the present utility model cited below particularly, and cooperate appended graphicly, be described in detail below:
Please refer to shown in Fig. 1～7, the Aligning degree of the utility model multilayer board and the measuring construction of expansion-contraction degree mainly are to comprise four transparent areas 1 to 4 and several position marks (not indicating).This transparent area 1 to 4 is to be arranged at each lamina L2 to L7 respectively and a top layer plate L1[does not illustrate] horizontally extending outward four orientation, center on, and the corresponding transparent area 1 to 4 that is provided with of each lamina L1 to L7 is preferably the rectangle framework with same size, and the central point of each lamina L2 to L7 preferable also be a transparent area (indicate], and select to be provided with several anchor points 6 or concentric circles 5, so that the contraposition of auxiliary aforementioned transparent area 1 to 4 and position mark.Above-mentioned position mark normally is arranged at the light tight Copper Foil in this transparent area 1 to 4, it is preferably the printed circuit (not indicating) with each lamina L2 to L7, several digital frames of Xing Chenging or symbol frame simultaneously, each position mark is suitable distance and not overlapping each other at interval, it represents layer not (L2 to L7) respectively, go up (up), (down) down, a left side [left] and right relative positions such as (right), so that instrument or naked eyes are directly judged its relative position, wherein the position mark of one of this lamina L2 to L7 transparent area is preferably and is designed to a position line [not indicating], with the position benchmark as above-mentioned digital frame or symbol frame.
Shown in Fig. 2～7, the Aligning degree of the utility model multilayer board and the measuring construction of expansion-contraction degree, after each lamina L1 to L7 is by hot pressing, then can be by intense light sources such as X-rays, obtain the register image of looking or looking down on each transparent area 1 to 4 of these many laminas, thereby can utilize the relativity shift degree between each position mark in this register image of Instrumental Analysis, former energy is nondestructive obtain near the actual Aligning degree in each transparent area position fast, and the difference of each Aligning degree of comparison is to push away the whole expansion-contraction degree of each lamina of side.In addition, please refer to shown in Fig. 1～13, the edges of boards of each lamina L2 to L7 also respectively correspondence one transparent area 7 is set, has a lighttight circular pattern in each transparent area 7, layer not numeral (2 to 7) and distance values (18.0) in regular turn at interval suitably distance arrange, this circular pattern, layer is the also Copper Foil for forming simultaneously with printed circuit of numeral and distance values not, it also can be behind hot pressing, obtain the seeing image picture and utilize Instrumental Analysis by X-ray, whether have error with default distance values (18.0) with institute's compartment distance between the circular pattern of comparing the corresponding transparent area 7 of two opposite side.Therefore, the utility model can further be assisted whole relativity shift and the expansion-contraction degree that reaches the double acknowledge multilayer circuit board.
Please refer to shown in Fig. 8～12 Aligning degree of the utility model multilayer board and the measuring construction of expansion-contraction degree, the contraposition combination step schematic diagram of each position mark when carrying out hot pressing.It is to be provided with position line, anchor point 6 and concentric circles 5 in this lamina L3 that the utility model preferred embodiments is executed, thereby this lamina L3 can be as the relative position benchmark of all the other lamina L2 and L4 to L7.The contraposition step of each lamina L2 to L7 is as follows when carrying out hot pressing: (1) this lamina L3 and L4 utilize several overlapping anchor point 6 contraposition pressings, make position line, position mark (and concentric circles 5) combination of this lamina L3 and L4, as shown in Figure 8; (2) this lamina L5 and L6 utilize several overlapping anchor points 6, make position mark (and concentric circles 5) combination of this lamina L5 and L6, as shown in Figure 9; (3) this lamina L3 and L4 and this lamina L5 and L6 utilize several overlapping anchor points 6, make position line, position mark (and concentric circles 5) combination of this lamina L3 to L6, as shown in figure 10; (4) this lamina L2 and this lamina L3 to L6 utilize several overlapping anchor points 6, make position line, position mark (and concentric circles 5) combination of this lamina L2 to L6, as shown in figure 11; Reach (5) this lamina L7 and this lamina L2 to L6 and utilize several overlapping anchor points 6, make position line, position mark (and concentric circles 5) combination of this lamina L2 to L7, as shown in figure 12.Therefore, under the preceding topic of each anchor point 6 really accurate contraposition, can obtain on each transparent area 1 to 4 by intense sources such as X-rays and look a register image, with the difference between the actual Aligning degree of the whole relativity shift degree of analyzing each position mark, each transparent area of comparison, and infer the whole actual expansion-contraction degree of each lamina.Moreover partly anchor point 6 also can be selected to replace with the boring of same size, makes a little 6 location surely for further facilitating each.In addition, because the specific pressing order that each layer lamina L2 to L7 is only applicable to preset, therefore can genetic horizon the not other problem of [L2 to L7] reversed order, and, also can distinguish fast whether the upper and lower, left and right of lamina are placed upside down by the position mark of each photic zone 1 to 4.
Shown in Fig. 8～12 and 14～16, the Aligning degree of the utility model multilayer board and the measuring construction of expansion-contraction degree, be on horizontally extending outward four orientation, center of each lamina L2 to L7 a transparent area 1 to 4 to be set respectively, each transparent area 1 to 4 is provided with all places mark, so that obtain the last apparent weight group photo picture of each transparent area behind the hot pressing by intense light sources such as X-ray, to analyze the whole relativity shift degree of each position mark.The concentric circles of commonly using compared to Figure 14～16 is aimed at the shortcomings such as Aligning degree difference that method or longitudinal section method etc. can't be measured each position of side multilayer board, the Aligning degree of the utility model multilayer board of Fig. 8～12 and the measuring construction of expansion-contraction degree, except the nondestructive actual Aligning degree that records each position fast of energy, and more can be at the actual expansion-contraction degree of each lamina of difference pusher side that compares its Aligning degree, for adjusting the hot pressing processing procedure and reaching the purpose that improves the successive process yield.
Though oneself discloses the utility model with preferred embodiment; yet; it is not in order to limit the utility model; anyly have the knack of this skill person; in not breaking away from spirit and scope of the present utility model; when doing various changes and modification, therefore protection range of the present utility model is as the criterion when looking accompanying the claim person of defining.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02282419 CN2587131Y (en) | 2002-10-25 | 2002-10-25 | Measuring structure for alignment and shrinkage of multilayer printed circuit boards |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02282419 CN2587131Y (en) | 2002-10-25 | 2002-10-25 | Measuring structure for alignment and shrinkage of multilayer printed circuit boards |
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| Publication Number | Publication Date |
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| CN2587131Y true CN2587131Y (en) | 2003-11-19 |
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| CN 02282419 Expired - Fee Related CN2587131Y (en) | 2002-10-25 | 2002-10-25 | Measuring structure for alignment and shrinkage of multilayer printed circuit boards |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101907454A (en) * | 2010-07-06 | 2010-12-08 | 竞华电子(深圳)有限公司 | Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board |
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN102223751A (en) * | 2010-04-15 | 2011-10-19 | 华通电脑股份有限公司 | Multilayer circuit board and assembly thereof |
| CN102291950A (en) * | 2010-06-15 | 2011-12-21 | 卡姆特有限公司 | System and method for aligning a plurality of layers of device |
| CN102301837A (en) * | 2011-05-27 | 2011-12-28 | 华为技术有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN102573303A (en) * | 2010-12-31 | 2012-07-11 | 北大方正集团有限公司 | Circuit board forming method and circuit board |
| CN103068162A (en) * | 2011-10-19 | 2013-04-24 | 上海嘉捷通信息科技有限公司 | Printed board drilling band drawing coefficient data processing method |
| CN104968142A (en) * | 2015-06-30 | 2015-10-07 | 开平依利安达电子第三有限公司 | Circuit board with interlayer alignment modules and detection method thereof |
| CN105376964A (en) * | 2015-12-03 | 2016-03-02 | 中山市惠亚线路版有限公司 | Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board |
| CN108141969A (en) * | 2015-08-28 | 2018-06-08 | 甲骨文国际公司 | For layer-layer registration sample of printed circuit board |
| CN108811336A (en) * | 2018-06-29 | 2018-11-13 | 广州兴森快捷电路科技有限公司 | Two sided pcb processing method |
| CN109922602A (en) * | 2019-04-02 | 2019-06-21 | 博敏电子股份有限公司 | A kind of Anylayer plate Multifunction target mark mistake proofing design method |
| CN112985320A (en) * | 2019-12-16 | 2021-06-18 | 颀邦科技股份有限公司 | Circuit board |
| CN114286522A (en) * | 2022-01-10 | 2022-04-05 | 珠海方正科技多层电路板有限公司 | Manufacturing method of printed circuit board and printed circuit board |
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2002
- 2002-10-25 CN CN 02282419 patent/CN2587131Y/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102223751A (en) * | 2010-04-15 | 2011-10-19 | 华通电脑股份有限公司 | Multilayer circuit board and assembly thereof |
| CN102223751B (en) * | 2010-04-15 | 2012-10-10 | 华通电脑股份有限公司 | Multilayer circuit board and assembly thereof |
| CN102291950A (en) * | 2010-06-15 | 2011-12-21 | 卡姆特有限公司 | System and method for aligning a plurality of layers of device |
| CN102291950B (en) * | 2010-06-15 | 2015-11-18 | 卡姆特有限公司 | For the system and method for multiple layers of alignment feature |
| CN101907454A (en) * | 2010-07-06 | 2010-12-08 | 竞华电子(深圳)有限公司 | Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board |
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN102098884B (en) * | 2010-12-29 | 2014-07-23 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN102573303A (en) * | 2010-12-31 | 2012-07-11 | 北大方正集团有限公司 | Circuit board forming method and circuit board |
| CN102301837A (en) * | 2011-05-27 | 2011-12-28 | 华为技术有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN102301837B (en) * | 2011-05-27 | 2013-03-20 | 华为技术有限公司 | Multi-layer circuit board and manufacturing method thereof |
| US9018531B2 (en) | 2011-05-27 | 2015-04-28 | Huawei Technologies Co., Ltd. | Multilayer circuit board and manufacturing method thereof |
| CN103068162A (en) * | 2011-10-19 | 2013-04-24 | 上海嘉捷通信息科技有限公司 | Printed board drilling band drawing coefficient data processing method |
| CN103068162B (en) * | 2011-10-19 | 2015-08-12 | 上海嘉捷通信息科技有限公司 | A kind of printed board drilling drawing coefficient data processing method |
| CN104968142A (en) * | 2015-06-30 | 2015-10-07 | 开平依利安达电子第三有限公司 | Circuit board with interlayer alignment modules and detection method thereof |
| CN108141969A (en) * | 2015-08-28 | 2018-06-08 | 甲骨文国际公司 | For layer-layer registration sample of printed circuit board |
| CN108141969B (en) * | 2015-08-28 | 2020-07-17 | 甲骨文国际公司 | Layer-to-layer registration coupon for printed circuit boards |
| CN105376964A (en) * | 2015-12-03 | 2016-03-02 | 中山市惠亚线路版有限公司 | Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board |
| CN105376964B (en) * | 2015-12-03 | 2018-09-07 | 皆利士多层线路版(中山)有限公司 | A kind of production method of multilayer circuit board harmomegathus coefficient acquisition methods, multilayer circuit board |
| CN108811336A (en) * | 2018-06-29 | 2018-11-13 | 广州兴森快捷电路科技有限公司 | Two sided pcb processing method |
| CN108811336B (en) * | 2018-06-29 | 2021-01-05 | 广州兴森快捷电路科技有限公司 | Double-sided printed circuit board processing method |
| CN109922602A (en) * | 2019-04-02 | 2019-06-21 | 博敏电子股份有限公司 | A kind of Anylayer plate Multifunction target mark mistake proofing design method |
| CN109922602B (en) * | 2019-04-02 | 2021-09-14 | 博敏电子股份有限公司 | Multi-functional target error-proofing design method for Analyyer plate |
| CN112985320A (en) * | 2019-12-16 | 2021-06-18 | 颀邦科技股份有限公司 | Circuit board |
| CN112985320B (en) * | 2019-12-16 | 2024-04-16 | 颀邦科技股份有限公司 | Circuit board |
| CN114286522A (en) * | 2022-01-10 | 2022-04-05 | 珠海方正科技多层电路板有限公司 | Manufacturing method of printed circuit board and printed circuit board |
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