CN114286522A - Manufacturing method of printed circuit board and printed circuit board - Google Patents
Manufacturing method of printed circuit board and printed circuit board Download PDFInfo
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Abstract
Description
技术领域technical field
本发明涉及印刷线路板技术领域,尤其涉及一种印刷线路板的制造方法及印刷电路板。The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a printed circuit board and a printed circuit board.
背景技术Background technique
印刷线路板是重要的电子部件,是电子元器件的支撑体,现有印刷线路板中有部分需要在板件上设置盲孔、通孔以及槽孔。其中,盲孔一般采用镭射加工,为镭射盲孔。通孔采用钻刀加工,通常为圆形钻孔。槽孔一般为不规则的钻孔,通常采用铣刀,用来钻槽孔,槽孔可以为贯穿板件的通孔,也可以为未贯穿板件的盲孔。通常情况下,槽孔用于安装电子元器件,盲孔与通孔用于安装引脚。且盲孔、通孔以及槽孔采用分阶段进行加工,并非同时加工出来的。A printed circuit board is an important electronic component and a support body for electronic components. Some of the existing printed circuit boards need to be provided with blind holes, through holes and slot holes on the board. Among them, blind holes are generally processed by laser, which are laser blind holes. Through holes are drilled, usually circular holes. Slot holes are generally irregular drilling holes, and milling cutters are usually used to drill slot holes. Typically, slotted holes are used to mount electronic components, and blind holes and through holes are used to mount pins. And blind holes, through holes and slot holes are processed in stages, not processed at the same time.
在相关技术中,印刷线路板的加工方法为:先在剪裁好的板件上开设定位孔,采用定位孔定位,将板件安装在激光设备内,通过镭射设置盲孔;然后再利用定位孔定位,将板件安装在钻床上,通过钻床开设通孔;接下来,将板件利用定位孔定位安装在铣刀下,铣出槽孔。关于槽孔的检测方式为生产首件产品后量测首件位置,如偏差超过误差范围,则需要再调整参数做首件。In the related art, the processing method of the printed circuit board is as follows: firstly, a positioning hole is opened on the cut board, the positioning hole is used for positioning, the board is installed in the laser equipment, and the blind hole is set by the laser; and then the positioning hole is used. Positioning, the plate is installed on the drilling machine, and the through hole is opened through the drilling machine; next, the plate is positioned and installed under the milling cutter by using the positioning hole, and the slot hole is milled out. The detection method of the slot hole is to measure the position of the first piece after the first piece of product is produced. If the deviation exceeds the error range, it is necessary to adjust the parameters to make the first piece.
但是,采用现有的制造方法,对于槽孔的位置检测需要在加工好首件后对结果进行测量才可以得知,若出现不合格,则首件不良将直接报废点整体板件,造成材料浪费。However, with the existing manufacturing method, the position detection of the slot hole requires the measurement of the result after the first piece is processed. waste.
发明内容SUMMARY OF THE INVENTION
本发明提供一种印刷线路板的制造方法及印刷电路板,可有效地解决上述或者其他潜在技术问题。The present invention provides a method for manufacturing a printed circuit board and a printed circuit board, which can effectively solve the above or other potential technical problems.
本发明的第一个方面是提供一种印刷线路板的制造方法,印刷线路板包括位于中心的有效区域以及环绕有效区域的边框区域,包括:在边框区域上开设至少两个定位孔;通过定位孔将印刷线路板定位;在边框区域内取至少两个第一基准点,在每个第一基准点的周围开设多个第一基准孔,并且每个第一基准点周围的所有第一基准孔关于其对应的第一基准点中心对称;以每个第一基准点为基准,在边框区域内以铣床开设与每个第一基准点一一对应的多个第一槽孔;当第一槽孔与至少一个第一基准孔接触的时候,调整铣床的定位参数或涨缩系数。A first aspect of the present invention is to provide a method for manufacturing a printed circuit board. The printed circuit board includes an effective area at the center and a frame area surrounding the effective area, including: opening at least two positioning holes on the frame area; The hole positions the printed circuit board; at least two first reference points are taken in the frame area, a plurality of first reference holes are opened around each first reference point, and all the first reference points around each first reference point The hole is center-symmetrical about its corresponding first datum point; with each first datum point as the datum, a plurality of first slot holes corresponding to each first datum point one-to-one are opened in the frame area with a milling machine; When the slotted hole is in contact with at least one of the first reference holes, adjust the positioning parameters or expansion and contraction coefficient of the milling machine.
在根据第一方面的可选的实施例中,当第一槽孔与至少一个第一基准孔接触的时候,调整铣床的定位参数或涨缩系数,具体包括:当每个第一槽孔与其对应的第一基准孔均沿着同一方向接触的时候,调整铣床的原点位置;当每个第一槽孔均与其内侧或者外侧的相邻的第一基准孔接触时,调整铣床预配置的涨缩系数。需要说明的是,在本实施例中,当每个第一槽孔与其对应的第一基准孔均沿着同一方向接触的时候,此时表明是铣床的原点定位出现了偏差,则根据出现偏差的具体情况进而调整铣床的原点位置使其回到准确的位置,进而修复上述的定位偏差问题,然后再在有效区域进行加工。当每个第一槽孔均与其内侧或者外侧的相邻的第一基准孔接触时,此时表明是铣床的预配置的涨缩系数出现了问题,则根据具体情况进而调整铣床预配置的涨缩系数使其优化上述的问题,然后再在有效区域进行加工,进而保证加工的准确性。In an optional embodiment according to the first aspect, when the first slotted hole is in contact with the at least one first reference hole, adjusting the positioning parameter or expansion and contraction coefficient of the milling machine specifically includes: when each first slotted hole is in contact with the at least one first reference hole When the corresponding first reference holes are in contact in the same direction, adjust the origin position of the milling machine; when each first slot is in contact with the adjacent first reference hole inside or outside, adjust the pre-configured expansion of the milling machine. reduction factor. It should be noted that, in this embodiment, when each first slotted hole and its corresponding first reference hole are in contact in the same direction, it indicates that there is a deviation in the origin positioning of the milling machine. According to the specific situation, the origin position of the milling machine is adjusted to return to the accurate position, and the above-mentioned positioning deviation problem is repaired, and then processing is carried out in the effective area. When each first slot is in contact with its inner or outer adjacent first reference hole, it indicates that there is a problem with the pre-configured expansion and contraction coefficient of the milling machine, and then adjust the pre-configured expansion and contraction coefficient of the milling machine according to the specific situation. The reduction factor is optimized to optimize the above-mentioned problems, and then the processing is carried out in the effective area to ensure the accuracy of processing.
在根据第一方面的可选的实施例中,第一槽孔与第一基准孔沿着同一方向接触包括:在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔;当每个第一槽孔均与其对应的第一基准点上方的第一基准孔接触时,往下方调整铣床的原点位置;当每个第一槽孔均与其对应的第一基准点下方的第一基准孔接触时,往上方调整铣床的原点位置;当每个第一槽孔均与其对应的第一基准点左侧的第一基准孔接触时,往右侧调整铣床的原点位置;当每个第一槽孔均与其对应的第一基准点右侧的第一基准孔接触时,往左侧调整铣床的原点位置。需要说明的是,在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔,进而可根据第一槽孔接触的第一基准孔的方向,进而更加准确地判断原点的具体问题,例如,当每个第一槽孔均与其对应的第一基准点上方的第一基准孔接触时,则说明此时铣床定位的原点向上方偏移了,可通过往下方调整铣床的原点位置进而修正上述的问题。例如,当每个第一槽孔均与其对应的第一基准点下方的第一基准孔接触时,则说明此时铣床定位的原点向下方偏移了,可通过往上方调整铣床的原点位置进而修正上述的问题。例如,当每个第一槽孔均与其对应的第一基准点左侧的第一基准孔接触时,则说明此时铣床定位的原点向左侧偏移了,可通过往右侧调整铣床的原点位置进而修正上述的问题。例如,当每个第一槽孔均与其对应的第一基准点右侧的第一基准孔接触时,则说明此时铣床定位的原点向右侧偏移了,可通过往左侧调整铣床的原点位置进而修正上述的问题。In an optional embodiment according to the first aspect, contacting the first slot hole with the first reference hole along the same direction includes: opening at least one above, below, left and right side of each first reference point. A first reference hole; when each first slotted hole is in contact with the first reference hole above its corresponding first reference point, adjust the origin position of the milling machine downward; when each first slotted hole is in contact with its corresponding first reference hole When the first reference hole below a reference point is in contact, adjust the origin position of the milling machine upward; when each first slot is in contact with the first reference hole on the left side of the corresponding first reference point, adjust the milling machine to the right When each first slot is in contact with the first reference hole on the right side of its corresponding first reference point, adjust the origin position of the milling machine to the left. It should be noted that at least one first reference hole is provided above, below, on the left and right of each first reference point, and further, according to the direction of the first reference hole contacted by the first slotted hole, more Accurately determine the specific problem of the origin. For example, when each first slot is in contact with the first reference hole above its corresponding first reference point, it means that the origin of the milling machine positioning is shifted upward at this time. Adjust the origin position of the milling machine downward to correct the above problem. For example, when each first slot is in contact with the first reference hole below the corresponding first reference point, it means that the origin of the milling machine positioning is shifted downward at this time, and the origin position of the milling machine can be adjusted upward by adjusting the origin of the milling machine. Fix the above problem. For example, when each first slot is in contact with the first reference hole on the left side of its corresponding first reference point, it means that the origin of the milling machine positioning is shifted to the left, and the milling machine can be adjusted to the right by adjusting the position of the milling machine to the right. The origin position further corrects the above problem. For example, when each first slot is in contact with the first reference hole on the right side of its corresponding first reference point, it means that the origin of the milling machine positioning is shifted to the right, and the milling machine can be adjusted to the left by adjusting the position of the milling machine to the left. The origin position further corrects the above problem.
在根据第一方面的可选的实施例中,在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔;当位于上方的第一槽孔与其对应的第一基准点上方的第一基准孔接触、并且位于下方的第一槽孔与其对应的第一基准点下方的第一基准孔接触时,减小铣床的涨缩系数;当位于上方的第一槽孔与其对应的第一基准点下方的第一基准孔接触、并且位于下方的第一槽孔与其对应的第一基准点上方的第一基准孔接触时,增加铣床的涨缩系数。需要说明的是,在本实施例中,在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔;进而可根据第一槽孔接触的第一基准孔的呈现的状态,进而更加准确地判断铣床的涨缩系数的具体问题。例如,当位于上方的第一槽孔与其对应的第一基准点上方的第一基准孔接触、并且位于下方的第一槽孔与其对应的第一基准点下方的第一基准孔接触时,则表明此时铣床的涨缩系数偏大了,则通过减小铣床的涨缩系数,进而修正铣床涨缩系数偏大的技术问题。例如,当位于上方的第一槽孔与其对应的第一基准点下方的第一基准孔接触、并且位于下方的第一槽孔与其对应的第一基准点上方的第一基准孔接触时,则表明此时铣床的涨缩系数偏小了,则通过增加铣床的涨缩系数,进而修正铣床涨缩系数偏小的技术问题。In an optional embodiment according to the first aspect, at least one first reference hole is provided above, below, on the left and right of each first reference point; when the first slot hole located above corresponds to it When the first reference hole above the first reference point is in contact with and the first slot hole located below is in contact with the first reference hole below the corresponding first reference point, the expansion and contraction coefficient of the milling machine is reduced; When a slotted hole is in contact with the first reference hole below the corresponding first reference point, and the first slotted hole located below is in contact with the first reference hole above the corresponding first reference point, the expansion and contraction coefficient of the milling machine is increased. It should be noted that, in this embodiment, at least one first reference hole is provided above, below, left and right of each first reference point; The state of the hole, and then more accurately determine the specific problem of the expansion and contraction coefficient of the milling machine. For example, when the first slot hole located above is in contact with the first reference hole above the corresponding first reference point, and the first slot hole located below is in contact with the first reference hole below the corresponding first reference point, then It shows that the expansion and contraction coefficient of the milling machine is too large at this time, and the technical problem of the large expansion and contraction coefficient of the milling machine is corrected by reducing the expansion and contraction coefficient of the milling machine. For example, when the first slot hole located above is in contact with the first reference hole below the corresponding first reference point, and the first slot hole located below is in contact with the first reference hole above the corresponding first reference point, then It shows that the expansion and contraction coefficient of the milling machine is too small at this time, and the technical problem of the small expansion and contraction coefficient of the milling machine is corrected by increasing the expansion and contraction coefficient of the milling machine.
在根据第一方面的可选的实施例中,还包括:在有效区域内取多个第二基准点,在每个第二基准点的周围开设多个第二基准孔;当印刷线路板的定位以及涨缩系数均满足预设要求时,以每个第二基准点为基准,在有效区域内开设第二槽孔。需要说明的,具体地,在本实施例中,在边框区域开设第一基准孔时,也在有效区域开设第二基准孔。当开设第一槽孔后,根据第一槽孔的呈现情况判断铣床的定位参数和涨缩系数是否存在问题,若铣床的定位参数和涨缩系数均满足要求,则在有效区域开设第二槽孔。若铣床的定位参数或涨缩系数不满足要求,则根据具体情况进行调整铣床,调整其满足要求,再在有效区域加工第二槽孔,进而保证第二槽孔的准确度。In an optional embodiment according to the first aspect, the method further includes: taking a plurality of second reference points in the effective area, and opening a plurality of second reference holes around each second reference point; When both the positioning and the expansion and contraction coefficient meet the preset requirements, a second slot hole is opened in the effective area based on each second reference point. It should be noted that, specifically, in this embodiment, when the first reference hole is opened in the frame area, the second reference hole is also opened in the effective area. After opening the first slot, determine whether there is a problem with the positioning parameters and expansion and contraction coefficient of the milling machine according to the appearance of the first slot. If the positioning parameters and expansion and contraction coefficient of the milling machine meet the requirements, then open the second slot in the effective area. hole. If the positioning parameters or expansion and contraction coefficient of the milling machine do not meet the requirements, adjust the milling machine according to the specific situation to meet the requirements, and then process the second slot in the effective area to ensure the accuracy of the second slot.
在根据第一方面的可选的实施例中,还包括:将边框区域除去。需要说明的,具体地,在本实施例中,边框区域可以取除去,当在有效区域设置完第二槽孔之后,完成对有效区域的加工,此时可将用于检测的边框区域除去。In an optional embodiment according to the first aspect, the method further includes: removing the frame area. It should be noted that, specifically, in this embodiment, the frame area can be removed. After the second slot hole is set in the effective area, the processing of the effective area is completed, and the frame area used for detection can be removed at this time.
在根据第一方面的可选的实施例中,第一基准孔为第一盲孔或者第一通孔;第二基准孔为第二盲孔或第二通孔。In an optional embodiment according to the first aspect, the first reference hole is a first blind hole or a first through hole; the second reference hole is a second blind hole or a second through hole.
在根据第一方面的可选的实施例中,第一基准孔包括第一盲孔和第一通孔,多个第一盲孔与多个第一通孔交替设置。In an optional embodiment according to the first aspect, the first reference hole includes a first blind hole and a first through hole, and a plurality of first blind holes and a plurality of first through holes are alternately arranged.
在根据第一方面的可选的实施例中,通过定位孔将印刷线路板定位在镭射设备上,通过镭射设备制作第一盲孔以及第二盲孔;通过定位孔将印刷线路板定位在钻床上,通过钻床制作第一通孔以及第二通孔。In an optional embodiment according to the first aspect, the printed circuit board is positioned on the laser device through the positioning hole, the first blind hole and the second blind hole are made through the laser device; the printed circuit board is positioned on the drilling machine through the positioning hole above, the first through hole and the second through hole are made by a drilling machine.
在根据第一方面的可选的实施例中,印刷线路板为矩形板;在边框区域的四条侧边各自取至少一个第一基准点。需要说明的是,将印刷线路板为矩形板;且在边框区域的四条侧边各自取至少一个第一基准点,进而保证测试结果的准确性。In an optional embodiment according to the first aspect, the printed circuit board is a rectangular board; at least one first reference point is taken on each of the four sides of the frame area. It should be noted that the printed circuit board is a rectangular board; and at least one first reference point is taken on each of the four sides of the frame area, so as to ensure the accuracy of the test results.
本发明的第二个方面还提供一种印刷电路板,包括位于中间的有效区域以及环绕有效区域的待去除的边框区域;边框区域设有定位孔以及至少两个检测孔阵列,检测孔阵列包括多个第一基准孔以及第一槽孔,多个第一基准孔以第一基准点中心对称,第一槽孔以第一基准点为基准开设。A second aspect of the present invention also provides a printed circuit board, comprising an effective area in the middle and a frame area to be removed surrounding the effective area; the frame area is provided with positioning holes and at least two detection hole arrays, and the detection hole arrays include A plurality of first reference holes and first slot holes, the plurality of first reference holes are centrally symmetric with the first reference point, and the first slot holes are opened with the first reference point as a reference.
在根据第二方面的可选的实施例中,有效区域包括多个第二基准孔以及第二槽孔,第二槽孔与第二基准孔间隔设置。In an optional embodiment according to the second aspect, the effective area includes a plurality of second reference holes and second slot holes, and the second slot holes and the second reference holes are arranged at intervals.
在根据第二方面的可选的实施例中,第一基准孔包括第一盲孔和第一通孔,第一盲孔与第一通孔交替设置;第二基准孔包括第二盲孔和第二通孔;和/或,第一基准孔与第一槽孔之间的距离为0至0.102mm。In an optional embodiment according to the second aspect, the first reference hole includes a first blind hole and a first through hole, and the first blind hole and the first through hole are alternately arranged; the second reference hole includes a second blind hole and The second through hole; and/or, the distance between the first reference hole and the first slot hole is 0 to 0.102 mm.
在根据第二方面的可选的实施例中,印刷电路板为矩形板,边框区域的每一条侧边均至少设置有一个检测孔阵列。In an optional embodiment according to the second aspect, the printed circuit board is a rectangular board, and each side of the frame area is provided with at least one detection hole array.
本公开实施例提供的印刷线路板的制造方法,印刷线路板包括位于中心的有效区域以及环绕有效区域的边框区域,包括:在边框区域上开设至少两个定位孔;通过定位孔将印刷线路板定位;在边框区域内取至少两个第一基准点,在每个第一基准点的周围开设多个第一基准孔,并且每个第一基准点周围的所有第一基准孔关于其对应的第一基准点中心对称;以每个第一基准点为基准,在边框区域内以铣床开设与每个第一基准点一一对应的多个第一槽孔;当第一槽孔与至少一个第一基准孔接触的时候,调整铣床的定位参数或涨缩系数。本公开提供的印刷线路板的制造方法,首先在边框区域上设置第一基准孔以及第一槽孔,通过观测第一槽孔与第一基准孔是否有接触,进而判定铣床的定位参数或涨缩系数是否存在问题,如果在开设第一槽孔之后,发现铣床的定位参数或涨缩系数存在问题,则根据具体情况调整铣床,规避问题,之后在有效区域加工,进而可避免先在有效区域加工后检测发现问题则报废掉,浪费材料的问题。In the method for manufacturing a printed circuit board provided by an embodiment of the present disclosure, the printed circuit board includes an effective area located in the center and a frame area surrounding the effective area, including: opening at least two positioning holes on the frame area; Positioning; take at least two first reference points in the frame area, open a plurality of first reference holes around each first reference point, and all the first reference holes around each first reference point are about its corresponding The center of the first reference point is symmetrical; with each first reference point as a reference, a plurality of first slot holes corresponding to each first reference point one-to-one are opened in the frame area with a milling machine; when the first slot hole and at least one When the first reference hole is in contact, adjust the positioning parameters or expansion and contraction coefficient of the milling machine. In the manufacturing method of the printed circuit board provided by the present disclosure, firstly, a first reference hole and a first slot hole are arranged on the frame area, and by observing whether the first slot hole and the first reference hole are in contact, the positioning parameters or expansion of the milling machine are determined. Whether there is a problem with the shrinkage coefficient, if after opening the first slot, it is found that there is a problem with the positioning parameters or expansion and shrinkage coefficient of the milling machine, then adjust the milling machine according to the specific situation to avoid the problem, and then process in the effective area, which can avoid the need to work in the effective area first. After processing, if the problem is found, it will be scrapped, and the problem of wasting materials.
本公开提供的印刷电路板,采用上述的制造方法制成,因此也具备有上述的技术效果。The printed circuit board provided by the present disclosure is manufactured by the above-mentioned manufacturing method, so it also has the above-mentioned technical effects.
本发明的附加方面的优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。Advantages of additional aspects of the invention will be set forth in part in the description which follows, in part will become apparent from the description below, or will be learned by practice of the invention.
附图说明Description of drawings
通过参照附图的以下详细描述,本发明实施例的上述和其他目的、特征和优点将变得更容易理解。在附图中,将以示例以及非限制性的方式对本发明的多个实施例进行说明,其中:The above and other objects, features and advantages of embodiments of the present invention will become more readily understood from the following detailed description with reference to the accompanying drawings. In the accompanying drawings, various embodiments of the present invention will be illustrated by way of example and not limitation, wherein:
图1为本公开实施例提供的印刷线路板的制造方法的整体结构呈现的结构示意图;FIG. 1 is a schematic structural diagram showing an overall structure of a method for manufacturing a printed circuit board provided by an embodiment of the present disclosure;
图2为本公开实施例提供的印刷线路板设置有定位孔的结构示意图;FIG. 2 is a schematic structural diagram of a printed circuit board provided with positioning holes according to an embodiment of the present disclosure;
图3为本公开实施例提供的印刷线路板设置有定位孔、第一盲孔以及第二盲孔的结构示意图;3 is a schematic structural diagram of a printed circuit board provided with positioning holes, a first blind hole, and a second blind hole according to an embodiment of the present disclosure;
图4为本公开实施例提供的印刷线路板设置有定位孔、第一基准孔以及第二基准孔的结构示意图;4 is a schematic structural diagram of a printed circuit board provided with a positioning hole, a first reference hole and a second reference hole according to an embodiment of the present disclosure;
图5为本公开实施例提供的印刷线路板设置有定位孔、第一基准孔、第二基准孔以及第一槽孔的结构示意图;5 is a schematic structural diagram of a printed circuit board provided with a positioning hole, a first reference hole, a second reference hole and a first slot hole according to an embodiment of the present disclosure;
图6为本公开实施例提供的印刷线路板除去边框区域之后的结构示意图。FIG. 6 is a schematic structural diagram of the printed circuit board provided by the embodiment of the present disclosure after removing the frame area.
附图标记:Reference number:
11-有效区域;11 - effective area;
111-第二基准孔;111-The second reference hole;
1111-第二盲孔;1113-第二通孔;1111-second blind hole; 1113-second through hole;
112-第二槽孔;112 - the second slot;
13-边框区域;13 - border area;
131-定位孔;132-检测孔阵列;131-positioning hole; 132-detecting hole array;
133-第一基准孔;133 - the first reference hole;
1331-第一盲孔;1333-第一通孔;1331-first blind hole; 1333-first through hole;
135-第一槽孔。135 - The first slot.
具体实施方式Detailed ways
下面详细描述本发明的实施例,实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,旨在用于解释本发明,而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention and should not be construed as limiting the present invention.
应当理解的是,下面的实施例并不限制本发明所保护的方法中各步骤的执行顺序。本发明的方法的各个步骤在不相互矛盾的情况下能够以任意可能的顺序并且能够以循环的方式来执行。It should be understood that the following embodiments do not limit the execution order of each step in the method protected by the present invention. The individual steps of the method of the present invention can be performed in any possible order and can be performed in a cyclic fashion without conflicting each other.
本发明的描述中,需要理解的是,术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. The orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operation, and therefore should not be construed as a limitation of the present invention.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.
在本发明中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection It can be a mechanical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between the two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.
印刷线路板是重要的电子部件,是电子元器件的支撑体,现有印刷线路板中有部分需要在板件上设置盲孔、通孔以及槽孔。其中,盲孔一般采用镭射加工,为镭射盲孔。通孔采用钻刀加工,通常为圆形钻孔。槽孔一般为不规则的钻孔,通常采用铣刀,用来钻槽孔,槽孔可以为贯穿板件的通孔,也可以为未贯穿板件的盲孔。通常情况下,槽孔用于安装电子元器件,盲孔与通孔用于安装引脚。且盲孔、通孔以及槽孔采用分阶段进行加工,并非同时加工出来的。A printed circuit board is an important electronic component and a support body for electronic components. Some of the existing printed circuit boards need to be provided with blind holes, through holes and slot holes on the board. Among them, blind holes are generally processed by laser, which are laser blind holes. Through holes are drilled, usually circular holes. Slot holes are generally irregular drilling holes, and milling cutters are usually used to drill slot holes. Typically, slotted holes are used to mount electronic components, and blind holes and through holes are used to mount pins. And blind holes, through holes and slot holes are processed in stages, not processed at the same time.
在相关技术中,印刷线路板的加工方法为:先在剪裁好的板件上开设定位孔,采用定位孔定位,将板件安装在激光设备内,通过镭射设置盲孔;然后再利用定位孔定位,将板件安装在钻床上,通过钻床开设通孔;接下来,将板件利用定位孔定位安装在铣刀下,铣出槽孔。关于槽孔的检测方式为生产首件产品后量测首件位置,如偏差超过误差范围,则需要再调整参数做首件。但是,采用现有的制造方法,对于槽孔的位置检测需要在加工好首件后对结果进行测量才可以得知,若出现不合格,则首件不良将直接报废点整体板件,造成材料浪费。In the related art, the processing method of the printed circuit board is as follows: firstly, a positioning hole is opened on the cut board, the positioning hole is used for positioning, the board is installed in the laser equipment, and the blind hole is set by the laser; and then the positioning hole is used. Positioning, the plate is installed on the drilling machine, and the through hole is opened through the drilling machine; next, the plate is positioned and installed under the milling cutter by using the positioning hole, and the slot hole is milled out. The detection method of the slot hole is to measure the position of the first piece after the first piece of product is produced. If the deviation exceeds the error range, it is necessary to adjust the parameters to make the first piece. However, with the existing manufacturing method, the position detection of the slot hole requires the measurement of the result after the first piece is processed. waste.
有鉴于此,本申请实施例提供的印刷线路板的制造方法,印刷线路板包括位于中心的有效区域以及环绕有效区域的边框区域,在印刷线路板的有效区域内加工槽孔之前,先在围绕有效区域上设置的边框区域上设置第一基准孔,然后再设置第一槽孔,通过第一槽孔与第一基准孔之间的位置关系,进而判断是否满足槽孔加工的要求,若不满足要求,则先调整开设槽孔的铣床,进而修复存在的问题,直至满足要求,然后再在有效区域加工槽孔,进而规避掉直接在有效区域上加工槽孔出现问题只能报废的技术问题。In view of this, in the method for manufacturing a printed circuit board provided by the embodiment of the present application, the printed circuit board includes an effective area located in the center and a frame area surrounding the effective area. The first reference hole is set on the frame area set on the effective area, and then the first slot hole is set. Based on the positional relationship between the first slot hole and the first reference hole, it is judged whether it meets the requirements of slot hole processing. If the requirements are met, first adjust the milling machine for slotted holes, and then repair the existing problems until the requirements are met, and then process the slotted holes in the effective area, thereby avoiding the technical problem that the problem of directly processing the slotted holes in the effective area can only be scrapped. .
具体而言,本公开实施例提供的印刷线路板的制造方法,印刷线路板包括位于中心的有效区域以及环绕有效区域的边框区域,包括:在边框区域上开设至少两个定位孔;通过定位孔将印刷线路板定位;在边框区域内取至少两个第一基准点,在每个第一基准点的周围开设多个第一基准孔,并且每个第一基准点周围的所有第一基准孔关于其对应的第一基准点中心对称;以每个第一基准点为基准,在边框区域内以铣床开设与每个第一基准点一一对应的多个第一槽孔;当第一槽孔与至少一个第一基准孔接触的时候,调整铣床的定位参数或涨缩系数。本公开提供的印刷线路板的制造方法,首先在边框区域上设置第一基准孔以及第一槽孔,通过观测第一槽孔与第一基准孔是否有接触,进而判定铣床的定位参数或涨缩系数是否存在问题,如果在开设第一槽孔之后,发现铣床的定位参数或涨缩系数存在问题,则根据具体情况调整铣床,规避问题,之后在有效区域加工,进而可避免先在有效区域加工后检测发现问题则报废掉,浪费材料的问题。Specifically, a method for manufacturing a printed circuit board provided by an embodiment of the present disclosure, the printed circuit board includes an effective area located in the center and a frame area surrounding the effective area, including: opening at least two positioning holes on the frame area; Positioning the printed circuit board; taking at least two first reference points in the frame area, opening a plurality of first reference holes around each first reference point, and all the first reference holes around each first reference point The center is symmetrical with respect to its corresponding first reference point; with each first reference point as a reference, a plurality of first slot holes corresponding to each first reference point one-to-one are opened in the frame area with a milling machine; when the first slot When the hole is in contact with at least one first reference hole, adjust the positioning parameter or expansion and contraction coefficient of the milling machine. In the manufacturing method of the printed circuit board provided by the present disclosure, firstly, a first reference hole and a first slot hole are arranged on the frame area, and by observing whether the first slot hole and the first reference hole are in contact, the positioning parameters or expansion of the milling machine are determined. Whether there is a problem with the shrinkage coefficient, if after opening the first slot, it is found that there is a problem with the positioning parameters or expansion and shrinkage coefficient of the milling machine, then adjust the milling machine according to the specific situation to avoid the problem, and then process in the effective area, which can avoid the need to work in the effective area first. After processing, if the problem is found, it will be scrapped, and the problem of wasting materials.
图1为本公开实施例提供的印刷线路板的制造方法的整体结构呈现的结构示意图,请参照图1,本申请实施例提供的印刷线路板的制造方法,印刷线路板包括位于中心的有效区域11以及环绕有效区域11的边框区域13,包括在边框区域13上开设至少两个定位孔131;通过定位孔131将印刷线路板定位;在边框区域13内取至少两个第一基准点,在每个第一基准点的周围开设多个第一基准孔133,并且每个第一基准点周围的所有第一基准孔133关于其对应的第一基准点中心对称;以每个第一基准点为基准,在边框区域13内以铣床开设与每个第一基准点一一对应的多个第一槽孔135;当第一槽孔135与至少一个第一基准孔133接触的时候,调整铣床的定位参数或涨缩系数。FIG. 1 is a schematic structural diagram showing the overall structure of the manufacturing method of the printed circuit board provided by the embodiment of the present disclosure. Please refer to FIG. 1 . In the manufacturing method of the printed circuit board provided by the embodiment of the present application, the printed circuit board includes an effective area located in the center. 11 and the
图2为本公开实施例提供的印刷线路板设置有定位孔的结构示意图,请参照图2,具体地,本申请提供的印刷线路板的制造方法,首先,在边框区域13上开设三个不同线的定位孔131。三个定位孔131可以为圆形,也可以设置为其他形状,在本实施例中,将三个定位孔131设置为圆形,三个定位孔131可以采用X-RAY打靶机生产,孔径为3.175mm。需要说明的是,在本实施例中,设置三个定位孔131可放置印刷线路板装反的现象,也即起到了防呆的作用。示例性地,在本实施例中,三个定位孔131呈直角三角形排列分布。FIG. 2 is a schematic structural diagram of a printed circuit board provided with positioning holes according to an embodiment of the present disclosure. Please refer to FIG. 2 . Specifically, in the manufacturing method of the printed circuit board provided by the present application, first, three different The
图3为本公开实施例提供的印刷线路板设置有定位孔、第一盲孔以及第二盲孔的结构示意图,请参照图3,紧接着,通过定位孔131将印刷线路板定位在镭射设备上,通过镭射设备在边框区域13上开设第一盲孔1331以及在有效区域11上开设第二盲孔1111;具体地,在边框区域13的四个边角上各取一个第一基准点,围绕每个第一基准点开设八个第一盲孔1331,两两为一组,每组都关于第一基准点对称设置,也就是将八个第一盲孔1331对称设置在四个象限内。第一盲孔1331的孔径可以为0.075mm至0.2mm,示例性地,第一盲孔1331的孔径为0.1mm。3 is a schematic structural diagram of a printed circuit board provided with positioning holes, a first blind hole and a second blind hole according to an embodiment of the present disclosure. Please refer to FIG. 3 . Next, the printed circuit board is positioned on the laser device through the positioning holes 131 . First, a first
同时,第二盲孔1111的根据用户对有效区域11内的具体设计进行开设。在有效区域11内取多个第二基准点,在每个第二基准点周围开设多个第二盲孔1111,第二盲孔1111的孔径可以为0.075mm至0.2mm,示例性地,第二盲孔1111的孔径为0.1mm。可以理解的是,这里并不对第一盲孔1331、第二盲孔1111的具体开设方式进行限定,在其他具体实施例中,可以根据用户的需求进行适应性地调整。At the same time, the second
图4为本公开实施例提供的印刷线路板设置有定位孔、第一基准孔以及第二基准孔的结构示意图,请参照图4,接着,通过定位孔131将印刷线路板定位在钻床上,通过钻床制作第一通孔1333以及第二通孔1113。具体地,在边框区域13的四个第一基准点周边设置第一通孔1333,每个第一基准点周围开设四个第一通孔1333,四个第一通孔1333以第一基准点为中心,两两对称设置,也即分别开设在第一基准点的上方、下方、左侧以及右侧。相邻两个第一通孔1333之间设置有两个第一盲孔1331,四个第一通孔1333设置在四个坐标轴上。同时,在有效区域的第二基准点周围设置有多个第二通孔1113。示例性地,第一通孔1333以及第二通孔1113的孔径为0.2mm至3mm,示例性性地,第一通孔1333以及第二通孔1113的孔径为0.2mm。可以理解的是,这里并不对第一通孔1333以及第二通孔1113的开设方式进行限定,在其他具体实施例中,可以根据用户的需求进行适应性地调整。4 is a schematic structural diagram of a printed circuit board provided with positioning holes, a first reference hole and a second reference hole according to an embodiment of the present disclosure. Please refer to FIG. 4 . Next, the printed circuit board is positioned on the drilling machine through the positioning holes 131 , The first through
图5为本公开实施例提供的印刷线路板设置有定位孔、第一基准孔、第二基准孔以及第一槽孔的结构示意图,请参照图5,其次,通过定位孔131将印刷线路板定位在铣床上,通过铣床在边框区域13上设置第一槽孔135。具体地,以边框区域13的四个第一基准点为基准,开设四个第一槽孔135,按照理论,将使得每个第一槽孔135与其周边的八个第一盲孔1331的距离均相同,均为0.102mm。且使得每个第一槽孔135与其周边的四个第一通孔1333的距离均相同,均为0.127mm。FIG. 5 is a schematic structural diagram of a printed circuit board provided with positioning holes, a first reference hole, a second reference hole, and a first slot hole according to an embodiment of the present disclosure, please refer to FIG. Positioned on the milling machine, the
四个第一槽孔135开设完之后,检测第一槽孔135的位置是否符合要求。若第一槽孔135与第一盲孔1331以及第一通孔1333均不接触,则符合要求。若第一槽孔135与第一盲孔1331或第一通孔1333其中一个接触,则调整铣床的定位参数或涨缩系数直至符合要求。After the opening of the four first slot holes 135 is completed, it is checked whether the positions of the first slot holes 135 meet the requirements. If the
请继续参照图1,然后,当印刷线路板的定位以及涨缩系数均满足预设要求时,以每个第二基准点为基准,在有效区域11内开设第二槽孔112。示例性地,第一槽孔135以及第二槽孔112的形状为有一个相对侧为弧形,一个相对侧为平行且对应的线段,也即将一个矩形其中一个相对侧设置为半圆弧,矩形的尺寸为6mm×6mm,半圆弧的直径为6mm。Please continue to refer to FIG. 1 . Then, when the positioning and expansion and contraction coefficient of the printed circuit board meet the preset requirements, the second slot holes 112 are opened in the
图6为本公开实施例提供的印刷线路板除去边框区域之后的结构示意图,请参照图6,随后,将边框区域13除去。FIG. 6 is a schematic structural diagram of the printed circuit board provided by the embodiment of the present disclosure after the frame area is removed. Please refer to FIG. 6 , and then, the
最后,可对有效区域11内第二槽孔112与第二盲孔1111以及第二通孔1113之间的距离进行测量,进一步确保第二槽孔112设置的位置的准确性。Finally, the distance between the
请参照图1至图6,在可选地示例性实施例中,当第一槽孔135与至少一个第一基准孔133接触的时候,调整铣床的定位参数或涨缩系数,具体包括:当每个第一槽孔135与其对应的第一基准孔133均沿着同一方向接触的时候,调整铣床的原点位置;当每个第一槽孔135均与其内侧或者外侧的相邻的第一基准孔133接触时,调整铣床预配置的涨缩系数。需要说明的是,在本实施例中,当每个第一槽孔135与其对应的第一基准孔133均沿着同一方向接触的时候,此时表明是铣床的原点定位出现了偏差,则根据出现偏差的具体情况进而调整铣床的原点位置使其回到准确的位置,进而修复上述的定位偏差问题,然后再在有效区域11进行加工。当每个第一槽孔135均与其内侧或者外侧的相邻的第一基准孔133接触时,此时表明是铣床的预配置的涨缩系数出现了问题,则根据具体情况进而调整铣床预配置的涨缩系数使其优化上述的问题,然后再在有效区域11进行加工,进而保证加工的准确性。Referring to FIGS. 1 to 6 , in an optional exemplary embodiment, when the
具体地,在本实施例中,第一槽孔135与第一基准孔133沿着同一方向接触包括:在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔133;当每个第一槽孔135均与其对应的第一基准点上方的第一基准孔133接触时,往下方调整铣床的原点位置;当每个第一槽孔135均与其对应的第一基准点下方的第一基准孔133接触时,往上方调整铣床的原点位置;当每个第一槽孔135均与其对应的第一基准点左侧的第一基准孔133接触时,往右侧调整铣床的原点位置;当每个第一槽孔135均与其对应的第一基准点右侧的第一基准孔133接触时,往左侧调整铣床的原点位置。Specifically, in this embodiment, contacting the
需要说明的是,在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔133,进而可根据第一槽孔135接触的第一基准孔133的方向,进而更加准确地判断原点的具体问题。It should be noted that at least one
例如,当每个第一槽孔135均与其对应的第一基准点上方的第一基准孔133接触时,则说明此时铣床定位的原点向上方偏移了,可通过往下方调整铣床的原点位置进而修正上述的问题。For example, when each
例如,当每个第一槽孔135均与其对应的第一基准点下方的第一基准孔133接触时,则说明此时铣床定位的原点向下方偏移了,可通过往上方调整铣床的原点位置进而修正上述的问题。For example, when each
例如,当每个第一槽孔135均与其对应的第一基准点左侧的第一基准孔133接触时,则说明此时铣床定位的原点向左侧偏移了,可通过往右侧调整铣床的原点位置进而修正上述的问题。For example, when each
例如,当每个第一槽孔135均与其对应的第一基准点右侧的第一基准孔133接触时,则说明此时铣床定位的原点向右侧偏移了,可通过往左侧调整铣床的原点位置进而修正上述的问题。For example, when each
在可选地示例性实施例中,在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔133;当位于上方的第一槽孔135与其对应的第一基准点上方的第一基准孔133接触、并且位于下方的第一槽孔135与其对应的第一基准点下方的第一基准孔133接触时,减小铣床的涨缩系数;当位于上方的第一槽孔135与其对应的第一基准点下方的第一基准孔133接触、并且位于下方的第一槽孔135与其对应的第一基准点上方的第一基准孔133接触时,增加铣床的涨缩系数。In an optional exemplary embodiment, at least one
需要说明的是,在本实施例中,在每个第一基准点的上方、下方、左侧和右侧各开设有至少一个第一基准孔133;进而可根据第一槽孔135接触的第一基准孔133的呈现的状态,进而更加准确地判断铣床的涨缩系数的具体问题。It should be noted that, in this embodiment, at least one
例如,当位于上方的第一槽孔135与其对应的第一基准点上方的第一基准孔133接触、并且位于下方的第一槽孔135与其对应的第一基准点下方的第一基准孔133接触时,则表明此时铣床的涨缩系数偏大了,则通过减小铣床的涨缩系数,进而修正铣床涨缩系数偏大的技术问题。For example, when the
例如,当位于上方的第一槽孔135与其对应的第一基准点下方的第一基准孔133接触、并且位于下方的第一槽孔135与其对应的第一基准点上方的第一基准孔133接触时,则表明此时铣床的涨缩系数偏小了,则通过增加铣床的涨缩系数,进而修正铣床涨缩系数偏小的技术问题。For example, when the
在可选地示例性实施例中,在有效区域11内取多个第二基准点,在每个第二基准点的周围开设多个第二基准孔111;当印刷线路板的定位以及涨缩系数均满足预设要求时,以每个第二基准点为基准,在有效区域11内开设第二槽孔112。需要说明的,具体地,在本实施例中,在边框区域13开设第一基准孔133时,也在有效区域11开设第二基准孔111。当开设第一槽孔135后,根据第一槽孔135的呈现情况判断铣床的定位参数和涨缩系数是否存在问题,若铣床的定位参数和涨缩系数均满足要求,则在有效区域11开设第二槽孔112。若铣床的定位参数或涨缩系数不满足要求,则根据具体情况进行调整铣床,调整其满足要求,再在有效区域11加工第二槽孔112,进而保证第二槽孔112的准确度。In an optional exemplary embodiment, a plurality of second reference points are taken in the
具体地,在本实施例中,在边框区域13上开设的第一基准孔133与第一槽孔135两者的边缘之间的距离可设置为有效区域11的第二槽孔112与第二基准孔111之间的误差允许的数值,例如,若第二槽孔112与第二基准孔111之间的距离设置为2.54mm则允许的误差值为±0.102mm,则此时将第一槽孔135周边的每一个第一基准孔133与其之间的距离均设置为0.102mm,则在加工第一槽孔135过程中,若出现第一槽孔135与其周边的至少一个第一基准孔133接触,则判定铣床的偏差大于误差范围,则此时对铣床进行调整,使其修正上述的问题。同时,第一槽孔135与第一基准孔133是否接触可明显观测到,无需采用量尺进行测量,就可得知是否存在偏差超过预设范围的问题,进而可进一步提高检测过程的工作效率。Specifically, in this embodiment, the distance between the edges of the
在可选地示例性实施例中,还包括:将边框区域13除去。需要说明的,具体地,在本实施例中,边框区域13可以取除去,当在有效区域11设置完第二槽孔112之后,完成对有效区域11的加工,此时可将用于检测的边框区域13除去。In an optional exemplary embodiment, it also includes: removing the
示例性地,将用于检测的边框区域13除去后,可对有效区域11内第二槽孔112与第二基准孔111之间的距离进行测量,进一步确保第二槽孔112设置的位置的准确性。Exemplarily, after removing the
在可选地示例性实施例中,第一基准孔133为第一盲孔1331或者第一通孔1333;第二基准孔111为第二盲孔1111或第二通孔1113。需要说明的是,在本实施例中,第一基准孔133可以为第一盲孔1331或者第一通孔1333,也就是说,可根据用户的具体需求,将第一基准孔133设置为其所需要的孔的类型,可以为盲孔,也可以为通孔。同理,第二基准孔111为第二盲孔1111或第二通孔1113。可根据用户的具体需求,将第二基准孔111设置为其所需要的孔的类型,可以为盲孔,也可以为通孔。In an optional exemplary embodiment, the
在可选地示例性实施例中,第一基准孔133包括第一盲孔1331和第一通孔1333,多个第一盲孔1331与多个第一通孔1333交替设置;第二基准孔111包括第二盲孔1111和第二通孔1113。需要说明的是,在本实施例中,第一基准孔133包括第一盲孔1331和第一通孔1333,多个第一盲孔1331与多个第一通孔1333交替设置。可以理解的,这里并不对第一基准孔133以及第二基准孔111的具体包括种类进行限定,可根据用户的具体需求,进行适应性地调整。In an optional exemplary embodiment, the
示例性性地,还可以设置两个第一基准孔133,且在第一槽孔135的相对侧各设置一个第一基准孔133,且每个第一基准孔133包括一个第一盲孔1331以及一个第一通孔1333。示例性地,将第一盲孔1331与第一槽孔的135之间的距离设置为0.102mm。将第一通孔1333与第一槽孔的135之间的距离设置为0.127mm。Exemplarily, two first reference holes 133 may also be provided, and one
可以理解的是,这里并不对第一基准孔133的具体个数进行限定,在其他具体实施例中,也可以根据用户的需求,将第一基准孔133包括两个第一盲孔1331以及一个第一通孔1333。在本实施例第一槽孔135周边设置有四个第一基准孔133,具体地,在第一槽孔135的上方、下方、左侧以及右侧均设置有一个第一通孔1333,且相邻两个第一通孔1333之间设置有两个第一盲孔1331。It can be understood that the specific number of the first reference holes 133 is not limited here. In other specific embodiments, the first reference holes 133 can also include two first
示例性地,印刷线路板为矩形板;在边框区域13的四条侧边各自取至少一个第一基准点。需要说明的是,将印刷线路板为矩形板;且在边框区域13的四条侧边各自取至少一个第一基准点,进而保证测试结果的准确性。可以理解的是,这里并不对印刷线路板的具体形状进行限定,在其他具体实施例中,可以根据用户的具体需求,将其设置为其他形状,例如五边形、圆形、或者椭圆形等。同时,在本申请中也不对边框区域13的第一基准点的个数进行限定,在本实施例中,可将第一基准点设置为四个以上,也可以根据用户的实际需求,设置两个、三个等。Exemplarily, the printed circuit board is a rectangular board; at least one first reference point is taken on each of the four sides of the
本公开还提供了一种印刷电路板,包括位于中间的有效区域11以及环绕有效区域11的待去除的边框区域13;边框区域13设有定位孔131以及至少两个检测孔阵列132,检测孔阵列132包括多个第一基准孔133以及第一槽孔135,多个第一基准孔133以第一基准点中心对称,第一槽孔135以第一基准点为基准开设。需要说明的是,本公开提供的印刷电路板采用前述的制造方法制得,因此也具备有上述的技术效果。The present disclosure also provides a printed circuit board, including an
在可选地示例性实施例中,有效区域11包括多个第二基准孔111以及第二槽孔112,第二基准孔111与第二槽孔112间隔设置。In an optional exemplary embodiment, the
在可选地示例性实施例中,第一基准孔133包括第一盲孔1331和第一通孔1333,第一盲孔1331与第一通孔1333交替设置;第二基准孔111包括第二盲孔1111和第二通孔1113;和/或,第一基准孔133与第一槽孔135之间的距离为0至0.102mm。需要说明的是,这里并不对第一基准孔133与第一槽孔135之间的具体距离进行限定,在其他具体实施例中,可根据用户的需求,将其设置为其他数值,该距离的设置可小于或等于有效区域11内第二槽孔112的边缘与第二基准孔111的边缘之间的距离的允许的误差值。In an optional exemplary embodiment, the
示例性地,印刷电路板为矩形板,边框区域13的每一条侧边均至少设置有一个检测孔阵列132。Exemplarily, the printed circuit board is a rectangular board, and each side of the
最后应说明的是:以上实施方式仅用以说明本发明的技术方案,而非对其进行限制;尽管参照前述实施方式对本发明已经进行了详细的说明,但本领域的普通技术人员应当理解:其依然可以对前述实施方式所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明实施方式技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: It is still possible to modify the technical solutions recorded in the foregoing embodiments, or to perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. .
另外需要说明的是,在上述具体实施方式中所描述的各个具体技术特征,在不矛盾的情况下,可以通过任何合适的方式进行组合。为了避免不必要的重复,本发明对各种可能的组合方式不再另行说明。In addition, it should be noted that each specific technical feature described in the above-mentioned specific implementation manner may be combined in any suitable manner under the circumstance that there is no contradiction. In order to avoid unnecessary repetition, the present invention will not describe various possible combinations.
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JPS62208807A (en) * | 1986-03-07 | 1987-09-14 | Hitachi Chem Co Ltd | Manufacture of multi-layer printing circuit board |
CN2587131Y (en) * | 2002-10-25 | 2003-11-19 | 楠梓电子股份有限公司 | Measuring structure for alignment and shrinkage of multilayer printed circuit boards |
CN103185733A (en) * | 2011-12-30 | 2013-07-03 | 北大方正集团有限公司 | Quality detection method of boring on printed circuit board |
CN104526758A (en) * | 2014-11-06 | 2015-04-22 | 深圳崇达多层线路板有限公司 | Method for controlling positioning precision of PCB drill holes |
CN205946329U (en) * | 2016-08-15 | 2017-02-08 | 梅州市志浩电子科技有限公司 | Printed circuit board |
CN106793474A (en) * | 2017-01-19 | 2017-05-31 | 广州美维电子有限公司 | A kind of printed circuit board (PCB) and its processing method |
CN109526156A (en) * | 2018-11-05 | 2019-03-26 | 深圳崇达多层线路板有限公司 | It is a kind of for detecting the detection module and detection method of deflection of borehole degree |
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