CN2581907Y - Semiconductor refrigerating liquid circulation heat radiator - Google Patents
Semiconductor refrigerating liquid circulation heat radiator Download PDFInfo
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- CN2581907Y CN2581907Y CN 02249141 CN02249141U CN2581907Y CN 2581907 Y CN2581907 Y CN 2581907Y CN 02249141 CN02249141 CN 02249141 CN 02249141 U CN02249141 U CN 02249141U CN 2581907 Y CN2581907 Y CN 2581907Y
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- heat exchanger
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Abstract
The utility model discloses a semiconductor refrigerating liquid circulation heat radiator, an electric pump, a heat radiator, and a heat exchanger are used for forming a circulation heat radiating loop by conduit pipes, wherein, the heat exchanger is positioned on the heat radiator and the heat radiating loop is charged with heat radiating liquid and is preserved with a certain space; the heat exchanger and the heat radiator form a heat insulating structure under the work stopping status. The utility model is suitable for refrigeration devices such as a refrigerator, an air conditioner, and a water drinking machine, etc. The utility model has the advantages of good heat radiating effect and long heat insulating time when a power supply is cut off by person's operation or not.
Description
Technical field
The utility model relates to a kind of heat abstractor of semiconductor refrigerating, is specifically related to a kind of liquid circulation heat abstractor.
Technical background
The heat abstractor of the semiconductor refrigerating of known technology has the employing water-cooling, as China Patent No. ZL:95236961.3, a kind of TEC heat exchanger is disclosed, it adopts a heat exchange body, on the one plane, have the liquid circulation passage, it is the liquid inlet and outlet mouth of pipe that the heat exchange body is passed at passage head and the tail two ends, conduit wall between passage and the passage is a radiating ribs, the one side that the heat exchange body is provided with the liquid circulation passage is a composition plane, and this plane and the refrigerating sheet plane that is cooled engages and constitutes closed liquid communication passage.It is direct that this water-cooling heat radiating device has heat exchange, can directly the center high temperature on refrigerating sheet surface be sent rapidly to dispel the heat, and solved the insoluble problem of wind-cooling heat dissipating substantially, and refrigerating capacity is big, efficient height, good heat dissipation effect.Facts have proved that the heat exchanger that metal is made passes to room temperature in the incubator easily, causes energy to leak, and must be in half duty, forms cold barrier, is in the low temperature keeping warm mode to keep refrigerating sheet under shutting down keeping warm mode.But the working time is long very high to the quality requirement of electric pump, and general motor is difficult to be competent at.As the cooling of not infusing, can not ensure that then refrigerating sheet is incubated when half duty, the serious refrigerating sheet that may cause burns.Simultaneously, this sealing structure is poor, leaks easily and damages product, and refrigerating sheet contacts with cooling fluid for a long time, and cooling fluid can be infiltrated and be caused short circuit in the refrigerating sheet and burn product.So the applicant is that the heat abstractor that addresses the aforementioned drawbacks refrigeration plant makes improvements.
As China Patent No. ZL:01257866.5, a kind of heat abstractor of semiconductor refrigerating is disclosed, this device constitutes closed circuit by electric pump, radiator, aluminium section bar, and radiator is close to aerofoil fan.Between heat absorption district on the aluminium section bar and the radiating area heat transfer zone is set, the plane aluminium sheet of aluminium section bar is as the heat absorption district, be attached to the hot junction face of refrigerating sheet, the aluminium sheet place of being close to the heat absorption district is provided with the heat transfer zone that is divided into a plurality of passages by the heat exchange gusset, and radiating area is the some fins that are provided with outside passage.Heat abstractor is sent the high-temp liquid of heat transfer zone to radiator by electric pump by conduit, is dispelled the heat by aerofoil fan.
The heat abstractor of this structure is to carry out heat exchange by the passage that electric pump is sent cooling fluid to heat transfer zone by conduit, bring radiator into after absorbing heat, dispel the heat by aerofoil fan, simultaneously, as the heat absorption district, its inside is divided into a plurality of passages by the heat exchange muscle to aluminium section bar with the plane aluminium sheet, make radiating area with some fins, form water-cooled and heat abstractor air-cooled and that deposit, so the heat absorption efficiency height, radiating rate is fast; It is whole that aerofoil fan, radiator constitute the fixing formation of a whole fin with aluminium section bar, the fastness height; Under keeping warm mode, can stop electric pump transfusion cooling, only aluminium section bar be dispelled the heat, satisfy the heat radiation requirement that is in refrigerating sheet under half duty, solve the sealing and the electric pump problem in service life of water-cooling with aerofoil fan.
The heat abstractor of said structure need provide certain voltage to cooling piece and blower fan work under keeping warm mode, produces a low-temperature receiver, keeps effective holding temperature.But,, just can not keep keeping warm mode when the artificial or non-artificial power supply that causes disconnects.
Summary of the invention
The purpose of this utility model is to solve above-mentioned shortcoming and a kind of good heat dissipation effect is provided, and at liquid circulation heat abstractor artificial or the non-artificial semiconductor refrigerating that temperature retention time is long when causing power supply to disconnect.
The purpose of this utility model is achieved in that a kind of liquid circulation heat abstractor of semiconductor refrigerating, constitute the heat-radiation loop of circulation by conduit by electric pump, radiator and heat exchanger, heat exchanger is positioned on the radiator, be filled with radiator liquid in the heat-radiation loop, and leave certain space, under the state of quitting work, heat exchanger and radiator are disconnected heat structure.Radiator liquid in the above-mentioned heat-radiation loop falls back to when static on the radiator of lower end, and radiator liquid and the radiator liquid on the radiator in the heat exchanger are disconnected.Wherein, heat exchanger comprises heat absorption liquid case and heat-insulated pipe, and heat-insulated pipe is to form with good heat conducting material manufacturing not, and this heat-insulated pipe is located at and is absorbed heat between liquid case and the conduit; Heat absorption liquid case is to form with copper or the manufacturing of aluminium Heat Conduction Material, is fixed on the corresponding thermal source contact end face by clamping frame.
Above-mentioned heat absorption liquid case surface is provided with thermal insulation layer, makes heat absorption liquid case be in the heat-insulation and heat-preservation state.Heat absorption liquid case inside constitutes passage by one or above some conduits.In addition, also be provided with a fluid storage tank in the heat-radiation loop, fluid storage tank communicates with radiator by conduit one end, and the other end communicates with heat exchanger.
Adopt the heat absorption liquid case of the liquid circulation heat abstractor of said structure semiconductor refrigerating to be close on the thermal source end face, utilize electric pump to make liquid quicken to flow, heated liquid in the heat absorption liquid case is sent in the radiator, simultaneously, chilled water in the radiator is sent in the heat absorption liquid case, quickened heat exchange, and also be to be connected between the heat absorption liquid case of this product and radiator and the electric pump by conduit, so, kept that original structure is easy for installation, the advantage of good heat dissipation effect.
In addition, the heat exchanger of this structure heat abstractor is positioned on radiator and the electric pump, be provided with heat-insulated pipe between heat absorption liquid case in the heat exchanger and the conduit, be filled with radiator liquid in the heat-radiation loop, and leave certain space, artificial or non-artificial when causing power supply to disconnect, radiator liquid in the heat-radiation loop falls back to when static on the radiator of lower end, radiator liquid in the heat exchanger and the radiator liquid on the radiator disconnect, make heat exchanger and radiator and electric pump be disconnected heat structure, when having solved refrigeration plant and entering keeping warm mode, when electric pump quits work, the water that has heated in the heat absorption liquid case is failed timely venting, room temperature and waste heat thereof are passed to the semiconductor chilling plate chill surface, and the temperature inside the box is improved, and shorten defectives such as temperature retention time, the heat abstractor of this structure is applied to the refrigerated volume less equipment, and its insulation refrigeration is better.
Above-mentioned heat absorption liquid case surface is provided with thermal insulation layer, makes heat absorption liquid case be in the heat-insulation and heat-preservation state, and the influence of the liquid case place variation of ambient temperature of not absorbed heat effectively improves heat-insulating property, energy savings.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Fig. 2 is the structural representation of the utility model heat exchanger
The specific embodiment
As shown in Figure 1, the liquid circulation heat abstractor of a kind of semiconductor refrigerating of the present utility model, constitute the heat-radiation loop of circulation by conduit 4 by electric pump 1, radiator 2 and heat exchanger 3, heat exchanger 3 is positioned on the radiator 2, be filled with radiator liquid in the heat-radiation loop, and leave certain space, under the state of quitting work, heat exchanger 3 is disconnected heat structure with radiator 2.Radiator liquid in the above-mentioned heat-radiation loop falls back to when static on the radiator 2 of lower end, and radiator liquid and the radiator liquid on the radiator 2 in the heat exchanger 3 are disconnected.Wherein, heat exchanger 3 comprises heat absorption liquid case 5 and heat-insulated pipe 6, and heat-insulated pipe 6 is to form with good heat conducting material manufacturing not, and this heat-insulated pipe 6 is located between heat absorption liquid case 5 and the conduit 4, helps completely cutting off the heat transmission of absorbing heat between liquid case 5 and the conduit 4;
Heat absorption liquid case 5 is to form with copper or the manufacturing of aluminium Heat Conduction Material, is fixed on the corresponding thermal source contact end face 8 by clamping frame 7.
Above-mentioned heat absorption liquid case 5 surfaces are provided with thermal insulation layer 9, make heat absorption liquid case 5 be in the heat-insulation and heat-preservation state, and the influence of the liquid case 5 place variation of ambient temperature of not absorbed heat effectively improves radiating efficiency, energy savings.
Heat absorption liquid case 5 inside constitute passage by one or above some conduits 4, as shown in Figure 2.
In addition, also be provided with a fluid storage tank 10 in the heat-radiation loop, fluid storage tank 10 communicates with radiator 2 by conduit 4, and the other end communicates with heat exchanger 3, and this fluid storage tank 10 is provided with and is beneficial to the circulation of radiator liquid in heat-radiation loop, improves radiating efficiency.
The liquid circulation heat abstractor of the semiconductor refrigerating of said structure, utilize electric pump 1 to make liquid quicken to flow, the heated liquid in the heat absorption liquid case 5 is sent in the radiator 2, simultaneously, chilled water in the radiator 2 is sent in the heat absorption liquid case 5, quickened heat exchange.When refrigeration plant enters keeping warm mode, electric pump 1 quits work, radiator liquid in the heat-radiation loop falls back to when static on the radiator 2 of lower end, and radiator liquid in the heat exchanger 3 and the radiator liquid on the radiator 2 disconnect, and make heat exchanger 3 and radiator 2 and electric pump 1 be disconnected heat structure.Solved because of heated liquid is owing to failing timely venting in the heat absorption liquid case 5, room temperature and waste heat thereof are passed to the semiconductor chilling plate chill surface, influence heat-insulating property.So refrigeration plant also can be kept good heat insulation effect artificial or non-artificial when causing power supply to disconnect.
The heat abstractor of said structure is especially to the refrigerated volume less equipment, and its heat insulation effect is better.
The liquid circulation heat abstractor of a kind of semiconductor refrigerating of the present utility model is applicable to refrigeration plants such as refrigerator, air-conditioning and water dispenser.
So the liquid circulation heat abstractor of the semiconductor refrigerating of said structure has not only kept original advantage easy for installation, stay-in-grade but also has had the long advantage of good heat dissipation effect, temperature retention time.
Claims (8)
1. the liquid circulation heat abstractor of a semiconductor refrigerating, constitute the heat-radiation loop of circulation by conduit by electric pump, radiator and heat exchanger, it is characterized in that: heat exchanger is positioned on the radiator, be filled with radiator liquid in the heat-radiation loop, and leave certain space, under the state of quitting work, heat exchanger and radiator are disconnected heat structure.
2. the liquid circulation heat abstractor of a kind of semiconductor refrigerating according to claim 1, it is characterized in that: the radiator liquid in the above-mentioned heat-radiation loop falls back to when static on the radiator of lower end, and radiator liquid in the heat exchanger and the radiator liquid on the radiator disconnect.
3. the liquid circulation heat abstractor of a kind of semiconductor refrigerating according to claim 1 is characterized in that: above-mentioned heat exchanger comprises heat absorption liquid case and heat-insulated pipe, and heat-insulated pipe is located between heat absorption liquid case and the conduit.
4. the liquid circulation heat abstractor of a kind of semiconductor refrigerating according to claim 3, it is characterized in that: above-mentioned heat absorption liquid case is to form with copper or the manufacturing of aluminium Heat Conduction Material, heat absorption liquid case is fixed on the corresponding thermal source contact end face by clamping frame.
5. the liquid circulation heat abstractor of a kind of semiconductor refrigerating according to claim 3 is characterized in that: above-mentioned heat-insulated pipe is to form with good heat conducting material manufacturing not.
6. the liquid circulation heat abstractor of a kind of semiconductor refrigerating according to claim 3, it is characterized in that: above-mentioned heat absorption liquid case surface is provided with thermal insulation layer, makes heat absorption liquid case be in the heat-insulation and heat-preservation state.
7. the liquid circulation heat abstractor of a kind of semiconductor refrigerating according to claim 1 is characterized in that: above-mentioned heat absorption liquid case inside constitutes passage by one or above some conduits.
8. the liquid circulation heat abstractor of a kind of semiconductor refrigerating according to claim 1, it is characterized in that: also be provided with a fluid storage tank in the above-mentioned heat-radiation loop, fluid storage tank communicates with radiator by conduit one end, and the other end communicates with heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02249141 CN2581907Y (en) | 2002-11-05 | 2002-11-05 | Semiconductor refrigerating liquid circulation heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02249141 CN2581907Y (en) | 2002-11-05 | 2002-11-05 | Semiconductor refrigerating liquid circulation heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2581907Y true CN2581907Y (en) | 2003-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02249141 Expired - Fee Related CN2581907Y (en) | 2002-11-05 | 2002-11-05 | Semiconductor refrigerating liquid circulation heat radiator |
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| CN (1) | CN2581907Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922774A (en) * | 2009-06-13 | 2010-12-22 | 刘万辉 | Open external heat exchanging type semiconductor air conditioner |
| CN103760936A (en) * | 2014-01-28 | 2014-04-30 | 北京泽源惠通科技发展有限公司 | Intelligent condensation-preventing environment regulating and controlling device |
| CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
| CN107249400A (en) * | 2014-12-23 | 2017-10-13 | 火石工程有限公司 | Heat transfer unit (HTU) |
| CN108211395A (en) * | 2018-02-08 | 2018-06-29 | 常州瑞持机械有限公司 | For the intelligent MVR vapo(u)rization systems of fermentation |
-
2002
- 2002-11-05 CN CN 02249141 patent/CN2581907Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922774A (en) * | 2009-06-13 | 2010-12-22 | 刘万辉 | Open external heat exchanging type semiconductor air conditioner |
| CN103760936A (en) * | 2014-01-28 | 2014-04-30 | 北京泽源惠通科技发展有限公司 | Intelligent condensation-preventing environment regulating and controlling device |
| CN107249400A (en) * | 2014-12-23 | 2017-10-13 | 火石工程有限公司 | Heat transfer unit (HTU) |
| CN107249400B (en) * | 2014-12-23 | 2021-12-07 | 火石工程有限公司 | Heat transfer device |
| CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
| CN106766346B (en) * | 2016-12-26 | 2022-09-20 | 华南理工大学 | Circulating water-cooled heat dissipation semiconductor refrigerating system |
| CN108211395A (en) * | 2018-02-08 | 2018-06-29 | 常州瑞持机械有限公司 | For the intelligent MVR vapo(u)rization systems of fermentation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |