CN201206919Y - Refrigeration and heat-production device - Google Patents

Abstract

A refrigeration and heat production device relates to the refrigeration and heat production equipment field and comprises a semiconductor refrigeration chip, a radiator, a heat absorption water tank, a cooler and a cold storage water tank; both sides of the semiconductor refrigeration chip are respectively connected with the radiator and the cooler; the radiator is connected with the heat absorption water tank; and the cooler is connected with the cold storage water tank. The utility model has simple structure and is easy to use, which does not produce noise in the refrigeration and heat production process and replaces the freon in a cooling compressor by refrigerating fluid to reduces pollution and damage to the atmosphere; besides, the utility model has good cooling effect and enhances heat utilization so as to save energy sources and achieve a good energy-saving effect.

Description

A cooling and heating device

technical field

The utility model relates to the field of refrigeration and heating equipment, in particular to a device that can utilize semiconductors for refrigeration and heating.

Background technique

As we all know, in traditional refrigeration equipment, cooling compressors are used for refrigeration, which makes a lot of noise when used, and the Freon used will destroy the atmosphere and cause environmental pollution. And the conversion of cooling and heating cannot be realized. There have also been semiconductor refrigeration heaters on the market. Although it overcomes the shortcomings of the previous refrigeration heaters for single cooling and heating, and solves the use of heat release and heat absorption on the other side of the semiconductor components in the cooling and heating process, the heat exchange parts It is not in complete contact with the substance that needs cooling and heating, the heat exchange efficiency is low, and its structure is relatively complicated, which affects its wide use.

Contents of the invention

The object of the present invention is to provide a cooling and heating device, which can overcome the disadvantages of complex structure and low heat exchange efficiency of the cooling and heating device in the prior art, and has a simple structure and high efficiency.

In order to achieve the above object, the inventor has designed a new cooling and heating device, which is achieved through the following technical solutions:

A refrigeration and heating device, which includes a semiconductor refrigeration sheet and a radiator, and is characterized in that it also includes a heat absorption tank, a radiator, and a cold water storage tank, and the two sides of the semiconductor refrigeration sheet are respectively connected with a radiator and a radiator. The radiator is connected with the heat absorbing water tank, and the radiator is connected with the cold water storage tank.

The radiator and radiator are aluminum radiators or copper radiators, or radiators made of other materials.

The heat-absorbing tank is provided with a water inlet at one end, a water outlet at one end, a water pump at one end of the water outlet, and a cold-heat exchanger between the water inlet and the water-outlet pump, and the water inlet, the cold-heat exchanger and the water pump connected by conduits.

Added in the cold water storage tank is freezing liquid, and what can also be added is water.

The cold water storage tank is provided with a water inlet at one end, a water outlet at one end, a water pump at one end of the water outlet, and a cold and heat exchanger between the water inlet and the water pump at the water outlet, and the water inlet, the cold and heat exchanger and the water pump connected by conduits.

When cooling is required, the semiconductor refrigeration chip is powered on, and the cooling surface exchanges energy through the radiator and the refrigerant in the cold water storage tank, which can quickly reduce the temperature of the refrigerant, reaching 16°C to minus 25°C, and it will also develop to minus 25°C For spaces below 25°C, the temperature can be adjusted according to different requirements. When heating is required, the semiconductor refrigerating sheet is energized, and the heating surface exchanges energy with the water in the heat-absorbing tank for heating through the cooling fin. The heated water works in a closed cycle in the water tank, effectively utilizing the heat energy, and can be used for heating or other purposes. use.

The wires of the semiconductor refrigerating sheet are connected to the positive and negative switching switches of the power supply. Through the switching of the switch, it is easy to realize the exchange of hot and cold.

The beneficial effect of this product is that the utility model uses a semiconductor refrigeration chip to replace the compressor, and no noise is generated in the working state, and the refrigerated liquid is used to replace the Freon in the cooling compressor, which can reduce pollution and reduce damage to the atmosphere. It is in direct contact with substances that need cooling and heating, the cooling effect is good, and the utilization of heat energy is increased, energy is saved, and there is a very good energy-saving effect.

Description of drawings

Fig. 1 is the assembly drawing of the present utility model.

Fig. 2 is a structural schematic diagram of the utility model.

Detailed ways

In order to describe the structure of the utility model in more detail, now in conjunction with the accompanying drawings of the product, describe in detail.

With reference to Fig. 1, the assembly of the present utility model comprises semi-conductor refrigerating sheet 1, absorbing water tank 2, radiator 3, radiator 4, storage cold water tank 5, and semiconductor refrigerating sheet 1 is arranged in the middle of radiator 3 and radiator 4, It is convenient to realize the adjustment of cooling and heating. A heat absorbing tank 2 is provided above the radiator 3, and a cold storage tank 5 is provided below the radiator 4, which realizes the contact between the heat exchanging element and the substance requiring cooling and heating, and improves the efficiency of energy conversion. The radiator 3 and the radiator 4 are aluminum radiators, copper radiators, or radiators made of other materials, and are not particularly limited.

Referring to Fig. 2, the heat absorbing tank 2 has a water inlet 6 at one end, a water outlet 7 at one end, a water pump 8 at one end of the water outlet, and a heat and cold exchanger between the water inlet 6 and the water pump 8 at the water outlet 9. The water inlet 6, the cold heat exchanger 9 and the water pump 8 are connected with conduits. During work, under the action of the water pump, the liquid flows in closed circulation in the water tank, and the energy conversion is performed through the cold and heat exchanger 9 . The structure of the cold water storage tank 5 is the same as that of the heat absorption tank 2 .

When refrigeration is required, after the semiconductor refrigeration sheet 1 is powered on, the cooling surface performs energy exchange through the cooling liquid in the radiator 4 and the cold storage tank 5, which can quickly reduce the temperature of the cooling liquid, reaching 16°C to minus 25°C. Adjust the temperature according to different requirements. When heating is required, after the semiconductor refrigerating sheet 1 is energized, the heating surface performs energy exchange heating with the water in the heat-absorbing tank 2 through the cooling fin 3, and the heated water works in a closed cycle in the water tank to effectively utilize the heat energy.

The utility model can be applied to electronic water-cooled air conditioners, electronic water-cooled refrigerators, electronic water-cooled fans, industrial equipment coolers, water coolers, water heaters, hot and cold water dispensers and other equipment, but not limited to these equipment.

Claims (4)

1. refrigerating and heating combined equipment, it comprises semiconductor chilling plate, radiator, it is characterized in that: it also comprises endothermic water tank, cooler, storage cold water storage cistern, the both sides of described semiconductor chilling plate are connected with radiator and cooler respectively, radiator links to each other with the endothermic water tank, and cooler links to each other with the storage cold water storage cistern.

2. refrigerating and heating combined equipment according to claim 1, it is characterized in that, described endothermic water tank, one end is provided with water inlet, one end is provided with delivery port, delivery port one end is provided with water pump, is provided with cool-heat-exchanger between the water pump of water inlet and delivery port, connects with conduit between water inlet, cool-heat-exchanger and the water pump.

3. refrigerating and heating combined equipment according to claim 1 is characterized in that, what add in the described storage cold water storage cistern is freezing liquid.

4. according to claim 1,2 or 3 described refrigerating and heating combined equipments, it is characterized in that: described storage cold water storage cistern, one end is provided with water inlet, one end is provided with delivery port, delivery port one end is provided with water pump, be provided with cool-heat-exchanger between the water pump of water inlet and delivery port, connect with conduit between water inlet, cool-heat-exchanger and the water pump.

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