CN204739708U - A structure of semiconductor refrigeration and air conditioning - Google Patents

Abstract

The utility model discloses a semiconductor refrigeration air conditioner structure, arrange and the water pipe including air -blower, copper fin, semiconductor refrigeration piece, water -cooling, the copper fin includes bottom surface and integrated into one piece in the fin of bottom surface one side, and the fin setting is on the air -out route of air -blower, and the bottom surface contacts with the huyashi -chuuka (cold chinese -style noodles) of semiconductor refrigeration piece, and the contact is arranged to the hot side and the water -cooling of semiconductor refrigeration piece, is provided with continuous with the water pipe respectively water inlet and delivery port on the water -cooling is arranged. Compare the cryogenic mode of compressor, the noiseless, pollution -free, equipment is small, and is with low costs, compact structure, can be applied to little space refrigeration or portable equipment on, fault phenomenon is convenient replacement also, the later maintenance of being convenient for.

Description

A structure of semiconductor refrigeration and air conditioning

technical field

The utility model relates to a semiconductor refrigeration structure.

Background technique

Currently widely used air-conditioning systems generally use a compressor refrigeration structure, which has a relatively large volume, complex structure, many moving mechanical parts, high noise, and problems such as refrigerant polluting the environment and destroying the atmosphere. In addition, Compressor refrigeration air conditioners are not suitable for small space refrigeration. In today's world, personalized personal portable devices have become the mainstream. Traditional air conditioners are fixed and installed in units of rooms, which is inconvenient to use and often causes waste.

Utility model content

In order to overcome the deficiencies of the prior art, the utility model provides an air-conditioning structure utilizing semiconductor refrigerating sheets to refrigerate. The structure of the air conditioner is refrigerated by semi-conductor refrigerating sheets, without the use of compressors and refrigerants. The structure is much simpler than that of compressor refrigerated air conditioners, with fewer mechanical parts, low noise, high reliability, no separate installation, and low-voltage DC power supply. Small, low power consumption, suitable for small space and portable use.

The technical scheme that the utility model solves its technical problem adopts is:

A semiconductor refrigeration and air-conditioning structure, including a blower, copper fins, semiconductor cooling fins, water-cooled row and water pipes, the copper fins include a bottom surface and fins integrally formed on one side of the bottom surface, the fins are arranged on the air outlet path of the blower, The bottom surface is in contact with the cold surface of the semiconductor refrigerating sheet, and the hot surface of the semiconductor refrigerating sheet is in contact with the water cooling row, and the water cooling row is provided with a water inlet and a water outlet respectively connected with water pipes.

Further, the fins of the copper fins are arranged in parallel, grooves are formed between the fins, and the wind blown by the blower enters from one side of the grooves and blows out from the other side of the grooves.

Furthermore, the fins of the copper fins have a wave-shaped structure, and grooves extending in a wave shape are formed between the fins.

Further, the other side of the bottom surface is a flat surface, which is in contact with the cold surface of the semiconductor cooling chip.

Further, thermal conductive silicone grease is provided between the bottom surface and the cold surface of the semiconductor cooling chip.

Further, the hot surface of the semiconductor cooling chip is in contact with the water-cooled row, and the contact surface is filled with heat-conducting silicone grease.

The beneficial effects of the utility model are: 1. The rear fan design is used in structure, that is, the blower is arranged behind the copper fins, the air flow is blown out first and then cooled, and the air flow will not absorb the heat emitted by the fan itself, which improves cooling Effect. 2. The use of semiconductor refrigeration chips for refrigeration, compared with compressor refrigeration, has no noise, no pollution, small equipment size, low cost, and compact structure. It can be applied to small space refrigeration or portable equipment, and faulty parts are also easy to replace. post-maintenance.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

Fig. 1 is the schematic diagram of heat dissipation principle of the present utility model;

Fig. 2 is a schematic diagram of the cooperative structure of the blower and the copper fins of the present invention.

Detailed ways

A semiconductor cooler, also called a thermoelectric cooler, is a heat pump. Its advantage is that there are no sliding parts, and it can be used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, which can achieve the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance, is characterized by no moving parts, and is relatively reliable. In this technical solution, the working surface at the cold end is called the cold surface, and the hot end surface is called the hot surface.

Referring to Fig. 1 and Fig. 2, a kind of semiconductor refrigeration air-conditioning structure of the present utility model comprises blower 1, copper fin 2, semiconductor refrigeration sheet 3, water cooling row 4 and water pipe, and copper fin 2 includes bottom surface 21 and integrally formed on the bottom surface The fins 22 on one side of 21, the fins 22 are arranged on the air outlet path of the blower 1, the bottom surface 21 is in contact with the cold surface of the semiconductor refrigeration sheet 3, the hot surface of the semiconductor refrigeration sheet 3 is in contact with the water cooling row 4, and the water cooling row 4 A water inlet 41 and a water outlet 42 respectively connected to water pipes are provided. Use the cold surface of the semiconductor refrigeration sheet 3 to cool the copper fins 2, the temperature of the copper fins 2 drops, and the temperature of the air around the surface of the copper fins 2 drops accordingly, and then the blower 1 blows out the cold air to produce a cooling effect . In addition, the other side of the semiconductor refrigerating sheet 3 is in close contact with the water-cooling row 4, and the water flow enters from one water inlet 41 of the water-cooling row 4, flows through the inner pipe of the water-cooling row 4, and flows out from the other water outlet 42, turning the semiconductor refrigerating The heat generated by the hot surface of the chip 3 is taken away, and the heat is guided to the space behind the air conditioner through the water cooling system, so as to effectively dissipate heat and maintain the temperature difference between the cold surface and the hot surface of the semiconductor refrigeration chip 3 to ensure the cooling effect.

Further, the fins 22 of the copper fins 2 are arranged in parallel, and grooves are formed between the fins 22, and the wind blown by the blower 1 enters from one side of the grooves, and flows along the gap between the fins 22 of the copper fins 2. The groove flows through and blows out from the other side of the groove, quickly bringing out the cold air in the groove of the copper fin 2. Furthermore, as an optional embodiment, the fins 22 of the copper fins 2 are arranged in a wavy structure, and grooves extending in a wavy shape are formed between the fins 22, so that heat exchange can be performed more efficiently, bringing out cold air.

Of course, as an optional other embodiment, the fins 22 can adopt other regular or irregular shapes, such as the fins 22 can be a zigzag structure, or a discontinuous structure, which can be adjusted according to actual conditions. To cool down the air blown out by blower 1 as much as possible.

Further, the other side of the bottom surface 21 is a flat surface, which is in contact with the cold surface of the peltier 3 . Thermally conductive silicone grease is provided between the bottom surface 21 and the cold surface of the semiconductor cooling chip 3 . Similarly, the hot surface of the semiconductor cooling chip 3 is in contact with the water-cooled radiator 4, and the contact surface is filled with heat-conducting silicone grease.

The water-cooled row 4 is in contact with the hot surface of the semiconductor refrigeration sheet 3, and the gap between the contact surfaces is filled with heat-conducting silicone grease, which can increase the efficiency of heat conduction; the cold surface of the semiconductor refrigeration sheet 3 is in close contact with the copper fin 2, and the gap between the contact surfaces The gaps are filled with thermal conductive silicone grease, which can increase the efficiency of heat conduction.

This technical solution cleverly integrates various components into a small space, optimizes the cooling and heat dissipation structure of the product, and adopts an intelligent control system to improve work efficiency. In actual production, the refrigeration function without refrigerant can be realized. During the working process, the refrigeration temperature can be intelligently and accurately controlled, and the refrigeration goal set by the user can be quickly achieved. A finished product of the air conditioning system is applied, a personal portable silent multi-functional micro Semiconductor refrigeration air conditioner, the size is only 27cm×25cm×8.5cm, the weight is 7.5kg, and the power is 120W. Under the conditions of room temperature 29.9 degrees Celsius and humidity 70%, the minimum average temperature of the cooling plate is 1 degree Celsius, and the minimum average temperature of the copper fins is 1 degree Celsius. The temperature is 10 degrees Celsius, the minimum temperature of the air conditioner is 14 degrees Celsius, the air volume is 80CFM, and the cooling response time is 15 seconds, realizing the miniaturization, portability and personalization of the air conditioning system.

Certainly, the present utility model may have other structural deformations besides the above-mentioned embodiments, and these equivalent technical solutions shall also be within the protection scope thereof.

Claims (6)

1. a semiconductor refrigerating air conditioner structure, it is characterized in that: comprise air blast (1), copper fin (2), semiconductor chilling plate (3) and water-cooled row (4), copper fin (2) comprises bottom surface (21) and is shaped in the fin (22) of bottom surface (21) side, fin (22) is arranged on the air-out path of air blast (1), bottom surface (21) contacts with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate (3), the hot side of semiconductor chilling plate (3) is arranged (4) and is contacted with water-cooled, water-cooled row (4) is provided with the water inlet (41) and delivery port (42) that are connected with water pipe respectively.

2. a kind of semiconductor refrigerating air conditioner structure according to claim 1, it is characterized in that: the fin (22) of described copper fin (2) be arranged in parallel, fin is formed with groove between (22), and the wind that air blast (1) blows out enters from the side of groove, blows out from the opposite side of groove.

3. a kind of semiconductor refrigerating air conditioner structure according to claim 2, is characterized in that: the fin (22) of described copper fin (2) is wavy shaped configuration, forms the groove that waveform extends between fin (22).

4. a kind of semiconductor refrigerating air conditioner structure according to claim 1, is characterized in that: the opposite side of described bottom surface (21) is even curface, and fitting with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate (3) contacts.

5. a kind of semiconductor refrigerating air conditioner structure according to claim 1, is characterized in that: be provided with heat-conducting silicone grease between the huyashi-chuuka (cold chinese-style noodles) of described bottom surface (21) and semiconductor chilling plate (3).

6. a kind of semiconductor refrigerating air conditioner structure according to claim 1, is characterized in that: the hot side of described semiconductor chilling plate (3) is arranged (4) and fitted and contact with water-cooled, contact surface place is filled with heat-conducting silicone grease.