CN106766346A - A kind of circulated water-cooled heat-radiating semiconductor refrigeration system - Google Patents

Abstract

The invention discloses a circulating water-cooled heat dissipation semiconductor refrigeration system, which comprises a power supply, a water storage barrel, a water pump, a refrigeration mechanism and a spraying mechanism. The lower end of the water bucket is connected, the water outlet of the water pump is connected to one end of the refrigeration mechanism through the second water pipe, and the other end of the refrigeration mechanism is connected to the spray mechanism, and the spray mechanism is installed above the water storage bucket. The spray outlet of the spray mechanism communicates with the opening at the upper end of the water storage bucket. The invention utilizes a water flow circuit composed of a water pump, a water pipe, a refrigeration mechanism, a spray mechanism, and a water storage bucket to perform circulating water-cooled heat dissipation on the hot end of the semiconductor refrigeration chip, and the water cooling effect is better, which can effectively reduce the temperature of the hot end and improve the temperature of the refrigeration mechanism. The heat dissipation efficiency, thereby improving the cooling efficiency of the refrigeration mechanism.

Description

A circulating water-cooled heat dissipation semiconductor refrigeration system

technical field

The invention relates to refrigeration technology, in particular to a circulating water-cooled heat dissipation semiconductor refrigeration system.

Background technique

At present, most refrigeration equipment is composed of compressors, condensers and evaporators, and the working fluids pollute and damage the environment, and generate vibration and noise. Semiconductor refrigeration, as a newly developed refrigeration technology, is a promising refrigeration method whose theoretical basis is thermoelectric refrigeration. Its advantages are that no refrigerant is needed, the structure is compact, and it has no pollution to the environment, so it is widely used. However, the currently used semiconductor refrigeration system also has the following defects: 1. It has a large volume and high manufacturing cost; 2. The efficiency of heat dissipation and cooling conduction is low, and the refrigeration efficiency is not ideal. 3. The power of the current semiconductor refrigeration system is constant, which cannot meet the changing environment.

Contents of the invention

The object of the present invention is to overcome the shortcomings of the above prior art, and provide a circulating water-cooled heat dissipation semiconductor refrigeration system with simple structure, compact structure, high efficiency, energy saving and environmental protection.

In order to achieve the above object, the present invention adopts the following technical solutions: a circulating water-cooled heat dissipation semiconductor refrigeration system, including a power supply, a water storage tank, a water pump, a refrigeration mechanism and a spray mechanism, the power supply is connected to the refrigeration mechanism, and the water pump The water inlet is connected to the lower end of the water storage barrel through the first water pipe, the water outlet of the water pump is connected to one end of the refrigeration mechanism through the second water pipe, and the other end of the refrigeration mechanism is connected to the spray mechanism, and the spray mechanism is installed Above the water storage barrel, the spray outlet of the spray mechanism communicates with the opening at the upper end of the water storage barrel.

The refrigeration mechanism includes a heat dissipation water pipe, a cold air pipe, a heat transfer sleeve, a semiconductor cooling piece and a cooling block, the heat transfer sleeve is connected to the heat dissipation water pipe, and the hot end of the semiconductor cooling piece is fixed on the heat transfer sleeve tube, the cold end of the semiconductor cooling sheet is connected to the cold guide block; the cold air duct includes a round cake part and two round tube parts, and the round cake part wraps the heat transfer sleeve, the semiconductor cooling chip and the cold guide block , one end of the two round pipes is respectively connected to the two ends of the round cake, one end of the heat dissipation water pipe passes through one side of the round cake and is connected to the second water pipe, and the other end of the heat dissipation water pipe passes through the round cake The other side of the part is connected with the spraying mechanism; the other ends of the two round pipe parts are equipped with cold air fans, and the semiconductor refrigerating sheet is connected with the power supply.

The outer wall of the heat transfer sleeve is provided with a plurality of fixed planes, and the number of the semiconductor refrigeration chips and the number of the cooling blocks are equal to the number of the fixed planes; the hot ends of each semiconductor refrigeration chip are respectively fixed on the corresponding fixed planes, Each cold conducting block is fixed on the cold end of the corresponding semiconductor refrigeration sheet.

The fixing planes are evenly distributed circumferentially around the axis of the heat transfer sleeve.

The heat transfer sleeve is made of copper or aluminum alloy. The inner diameter of the heat transfer sleeve is equal to the outer diameter of the heat dissipation water pipe.

The spraying mechanism includes a connecting pipe and a spraying head, the spraying head is connected with the cooling water pipe through the connecting pipe, and the spraying outlet of the spraying head is facing the opening at the upper end of the water storage barrel.

The heat dissipation water pipe and the cold air duct are arranged vertically.

The first water pipe is provided with a first valve, and the second water pipe is provided with a second valve.

The second water pipe is provided with at least two corners.

Compared with the prior art, the present invention has the following advantages:

1. This circulating water-cooled heat dissipation semiconductor refrigeration system mainly consists of a DC power supply, a water storage tank, a water pump, a refrigeration mechanism and a spraying mechanism. Circulating water-cooled heat dissipation is performed on the hot end of the semiconductor refrigeration sheet, and the water cooling effect is better, which can effectively reduce the temperature of the hot end and improve the heat dissipation efficiency of the refrigeration mechanism, thereby improving the refrigeration efficiency of the refrigeration mechanism.

2. The refrigeration mechanism in this circulating water-cooled heat dissipation semiconductor refrigeration system is mainly composed of heat dissipation water pipes, cold air pipes, heat transfer sleeves, semiconductor refrigeration sheets and cooling blocks. The structure is simple and compact, and the heat transfer sleeves can be combined with multiple A semiconductor cooling chip is fixedly connected, which maximizes space utilization, compact structure, and reduces the volume of the entire system.

3. This circulating water-cooled heat dissipation semiconductor refrigeration system uses a water flow circuit composed of a water pump, a water pipe, a refrigeration mechanism, a spray mechanism, and a water storage tank, so that the cooling water forms a circulation loop, and there is no need to continuously replenish water sources, saving resources and being convenient to use Effect.

Description of drawings

Fig. 1 is a structural block diagram of the circulating water-cooled heat dissipation semiconductor refrigeration system of the present invention.

Fig. 2 is a schematic structural view of the circulating water-cooled heat dissipation semiconductor refrigeration system of the present invention.

Fig. 3 is a structural schematic diagram of the refrigeration mechanism of the present invention.

Fig. 4 is a schematic diagram of the internal structure of the refrigeration mechanism of the present invention.

Fig. 5 is a schematic structural view of the heat transfer sleeve of the present invention.

detailed description

For the convenience of those skilled in the art to understand, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

As shown in Figures 1 and 2, the circulating water-cooled heat dissipation semiconductor refrigeration system includes a power supply 1, a water storage tank 2, a water pump 3, a refrigeration mechanism 4 and a spray mechanism 5, and the power supply 1 is connected to the refrigeration mechanism 4. The water inlet of the water pump 3 is connected to the lower end of the water storage barrel 2 through the first water pipe 6, the water outlet of the water pump 3 is connected to one end of the refrigeration mechanism 4 through the second water pipe 7, and the other end of the refrigeration mechanism 4 is connected to the sprayer. The shower mechanism 5 is connected, and the spray mechanism 5 is installed above the water storage barrel 2, and the spray outlet of the spray mechanism 5 communicates with the opening at the upper end of the water storage barrel 2.

In actual work, the cooling water flow circuit composed of the water pump 3, water pipes (i.e. the first water pipe 6 and the second water pipe 7), the refrigeration mechanism 4, the spray mechanism 5 and the water storage bucket 2, that is, the water pump 3 self-storage Bucket 2 extracts water and supplies it to refrigeration mechanism 4. When this water enters the heat dissipation water pipe 401 of refrigeration mechanism 4, it absorbs the heat generated by semiconductor cooling chip 404, and then the water that absorbs heat is sprayed on water storage barrel 2 by spraying mechanism 5. During the process of spraying water from the spray mechanism 5 to the water storage tank 2, the temperature of the water drops rapidly and then falls back to the water storage tank 2, and the water returned to the water storage tank 2 can be used as cooling water again , can be pumped again by the water pump 3 and sent to the refrigeration mechanism 4 to absorb heat. The cooling water forms a circulation loop, and there is no need to continuously replenish the water source, which saves resources and is convenient to use. For further improving the cooling effect of water, water storage bucket 2 is equipped with cooling tower, and this cooling tower can directly buy in the market. The refrigeration mechanism 4 dissipates heat through water cooling, which improves the heat dissipation effect of the refrigeration mechanism 4 to ensure that the refrigeration mechanism 4 has a good refrigeration effect.

As shown in Figures 3 and 4, the refrigeration mechanism 4 includes a heat dissipation water pipe 401, a cold air pipe 402, a heat transfer sleeve 403, a semiconductor cooling plate 404 and a cold guide block 405, and the heat transfer sleeve 403 and the heat dissipation water pipe 401 socket, the hot end of the semiconductor cooling sheet 404 is fixed to the heat transfer sleeve 403, the cold end of the semiconductor cooling sheet 404 is connected to the cold guide block 405; the cold air duct 402 includes a round cake part 4021 and two A round tube part 4022, the round cake part 4021 wraps the heat transfer sleeve 403, the semiconductor cooling plate 404 and the cold guide block 405, and one end of the two round tube parts 4022 is respectively connected with the two ends of the round cake part 4021, and the One end of the heat dissipation water pipe 401 passes through one side of the round cake part 4021 and is connected with the second water pipe 7, and the other end of the heat dissipation water pipe 401 passes through the other side of the round cake part 4021 and is connected with the spray mechanism 5; The other ends of the circular tubes 4022 are provided with cooling fans 8 , and the semiconductor cooling chips 404 are connected to the power supply 1 . The refrigeration mechanism 4 has a simple structure and is convenient for installation and maintenance. Wherein, the cold air duct 402 has a circular cake part 4021 and a circular tube part 4022, and the gas blown in by the cold air fan 8 can form a circulation in the circular cake part 4021, so as to further improve the cooling and heat dissipation effect of the refrigeration mechanism 4.

As shown in Figure 5, the outer wall of the heat transfer sleeve 403 is provided with a plurality of fixed planes 9, and the quantity of the semiconducting cooling plate 404 and the quantity of the cold guide block 405 are all equal to the quantity of the fixing planes 9; each semiconducting cooling plate The hot ends of 404 are respectively fixed to the corresponding fixed planes 9 , and each cold guide block 405 is fixed to the cold ends of the corresponding semiconductor cooling fins 404 . The fixed plane 9 can increase the contact area between the heat transfer sleeve 403 and the semiconductor cooling sheet 404, so as to further improve the heat generated by the hot end of the semiconductor cooling sheet 404 and transfer it to the water in the heat dissipation water pipe 401 through the heat transfer sleeve 403, thus improving the The heat dissipation effect of the refrigeration mechanism 4. In this embodiment, the number of fixing planes is 6, and the 6 fixing planes are evenly distributed around the axis of the heat transfer sleeve. The number of fixed planes is not limited to 6, but can also be 5, 8, 12, etc., so as to increase or decrease the number according to the change of the environment, so as to adapt to the load change to the greatest extent.

The heat transfer sleeve 403 is made of copper or aluminum alloy. The material of the heat transfer sleeve 403 is not limited to copper or aluminum alloy, and other metal materials with good thermal conductivity can also be used. A heat transfer sleeve made of a material with good heat transfer effect is used to further improve the heat dissipation effect of the refrigeration mechanism.

The inner diameter of the heat transfer sleeve 403 is equal to the outer diameter of the heat dissipation water pipe 401 . This ensures sufficient contact between the inner wall of the heat transfer sleeve 403 and the outer wall of the heat dissipation water pipe 401 to ensure heat transfer efficiency and further improve the heat dissipation effect of the refrigeration mechanism.

The spraying mechanism 5 includes a connecting pipe 501 and a spraying head 502. The spraying head 502 is connected to the heat dissipation water pipe 401 through the connecting pipe 501. Open your mouth. The structure is simple and the installation is convenient. When the heat-absorbed water is sprayed to the water storage barrel 2 through the shower head 502, it can be cooled by natural air to reduce the temperature of the water, so as to achieve the effect of energy saving and environmental protection.

The heat dissipation water pipe 401 and the cold air pipe 402 are arranged vertically. This design is compact, and ensures that the gas circulation in the round cake portion 4021 of the cold air duct 402 is fully in contact with the cooling block, thereby improving the cooling effect of the refrigeration mechanism 4 .

The first water pipe 6 is provided with a first valve 10 , and the second water pipe 7 is provided with a second valve 11 . The valves (namely the first valve 10 and the second valve 11 ) can effectively control the flow rate of the water flow and ensure the cooling effect of the refrigeration mechanism 4 .

The second water pipe 7 is provided with at least two corners 12 . The bent portion 12 can slow down the flow rate of the water flow, so that the water can fully absorb the heat transferred from the heat transfer sleeve 403 , further improving the effect of water cooling and heat dissipation.

In practice, the number of semiconductor refrigeration chips in the refrigeration device in the circulating water-cooled heat dissipation semiconductor refrigeration system of this embodiment is 6 pieces, and the rated power of a single semiconductor refrigeration sheet is 93W. The planes are attached to each other, and the cold end of the semiconductor refrigeration sheet is attached to the cold guide block. In addition, for better heat conduction and cold conduction, heat conduction glue is provided between the hot end of the semiconductor cooling chip and the joint surface of the heat transfer sleeve, and between the cold end of the semiconductor cooling chip and the joint surface of the cold conduction block; in this embodiment The actual power of the power supply is a 600W DC power supply, which is connected to 6 semiconductor cooling chips. When working, the DC power semiconductor cooling chip provides 9.3V voltage. The hot ends of the six semiconductor cooling fins are attached to the fixed plane of the heat transfer sleeve, and the cooling water flows through the heat dissipation water pipe to absorb the heat transferred from the heat transfer sleeve. The cold end of the semiconductor refrigerating sheet conducts cooling through the cooling block. There are three-dimensional grooves and corrugations on the fins of the cooling block. The airflow blown by the fan sweeps across both sides of the cooling fins, which can increase the turbulence of the airflow.

The specific implementation described above is a preferred embodiment of the present invention, and does not limit the present invention. Any other changes or other equivalent replacement methods that do not deviate from the technical solution of the present invention are included in the scope of protection of the present invention. within.

Claims (10)

1. a kind of circulated water-cooled heat-radiating semiconductor refrigeration system, it is characterised in that：Including power supply, water storage barrel, water pump, refrigeration machine Structure and spraying mechanism, the power supply are connected with refrigeration mechanism, and the water inlet of the water pump is by under the first water pipe and water storage barrel End connection, the delivery port of the water pump is connected by the second water pipe with one end of refrigeration mechanism, the other end of the refrigeration mechanism It is connected with spraying mechanism, the spraying mechanism is installed on the top of water storage barrel, the discharge outlet and water storage barrel of the spraying mechanism The opening of upper end communicates.

2. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 1, it is characterised in that：The refrigeration mechanism Including heat dissipation pipe, cold wind airduct, heat transfer sleeve pipe, semiconductor chilling plate and cool guiding block, the heat transfer sleeve pipe and water of radiation pipe sleeve Connect, heat transfer sleeve pipe is fixed in the hot junction of the semiconductor chilling plate, and the cold end of the semiconductor chilling plate is connected with cool guiding block；Institute Stating cold wind airduct includes cake portion and two pipe portions, and heat transfer sleeve pipe, semiconductor chilling plate and cool guiding block wrap up in the cake portion, The two ends of two one end in pipe portion respectively with cake portion are connected, one end of the heat dissipation pipe through behind the side in cake portion with Second water pipe is connected, and the other end of the heat dissipation pipe with spraying mechanism through being connected after the opposite side in cake portion；Two pipes The other end in portion is equipped with cold wind blower fan, and the semiconductor chilling plate is connected with power supply.

3. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat transfer sleeve pipe Outer wall be provided with multiple fixed pans, and the quantity of the quantity of semiconductor chilling plate and cool guiding block with the quantity phase of fixed pan Deng；The hot junction of each semiconductor chilling plate is individually fixed in corresponding fixed pan, and each cool guiding block is fixed on partly leads accordingly The cold end of body cooling piece.

4. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 3, it is characterised in that：The fixed pan Around the axis uniform circular distribution of heat transfer sleeve pipe.

5. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat transfer sleeve pipe It is made of copper or aluminium alloy.

6. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat transfer sleeve pipe Internal diameter it is equal with the external diameter of heat dissipation pipe.

7. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The spraying mechanism Including connecting tube and spray head, the spray head is connected by connecting tube with heat dissipation pipe, and the discharge outlet of the spray head is just To the opening of water storage barrel upper end.

8. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 2, it is characterised in that：The heat dissipation pipe It is vertically arranged with cold wind airduct.

9. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 1, it is characterised in that：First water pipe The first valve is provided with, second water pipe is provided with the second valve.

10. circulated water-cooled heat-radiating semiconductor refrigeration system according to claim 1, it is characterised in that：Second water Pipe is provided with least two angle sections.