CN2533575Y - Heatsink assembly - Google Patents
Heatsink assembly Download PDFInfo
- Publication number
- CN2533575Y CN2533575Y CN 02225894 CN02225894U CN2533575Y CN 2533575 Y CN2533575 Y CN 2533575Y CN 02225894 CN02225894 CN 02225894 CN 02225894 U CN02225894 U CN 02225894U CN 2533575 Y CN2533575 Y CN 2533575Y
- Authority
- CN
- China
- Prior art keywords
- pipe
- fan
- radiator
- heat
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model which relates to a heat dissipating device comprises a heat radiator, a wind guiding pipe and a fan, and the heat radiator comprises a heat conducting base plate, and one surface of the base plate is jointed with a central processor in order to absorb the produced heat; the top surface center of the base plate is fixedly connected with a round pipe which is provided with a plurality of round ventilation holes in order to increase heat dissipating effect; the external wall of the round pipe is jointed with a heat dissipating fin body which is a ring-shaped structure and is as high as the round pipe, and the fin body is provided with a plurality of fins which are arranged radially, and each fin is provided with a cut which is corresponding to the ventilation holes of the round pipe and is communicated to the external surface of the fins, of which is beneficial to air flows and wind resistance reduction, and the round pipe is connected with the wind guiding pipe, and the other end of the wind guiding pipe is connected with the fan; the fan can be fixed directly on the computer chassis, and the utility model can inhale the cold air out of the chassis and send the cold air to the surface of the heat radiator which is corresponding to the central processor through the wind guiding pipe, therefore, good heat dissipating effect can be reached.
Description
[technical field]
The utility model is about a kind of heat abstractor combination, refers to the heat abstractor combination that a kind of radiating effect is good especially.
[background technology]
Along with developing rapidly of computerized information industry, the arithmetic speed of computer cpu is more and more fast, and the heat that it produced is also more and more many, and too much heat is if can't in time discharge, the stability when having a strong impact on the central processing unit operation.For this reason, industry is installed the combination of a traditional aluminium extruded type radiator and fan usually in the central processing unit end face, and this fan is placed the radiating fin top of this radiator or is built in radiating fin central authorities, to assist to discharge heat.Common radiator combination is because the restriction of fan structure, cold air can't directly dispel the heat to the radiator surface corresponding with central processing unit, and heat is taken away can only treat that heat conducts to fin surface, the radiator outside time, and the rotation of fan also can cause the hot blast that overflows around the radiator to form backflow in computer housing, hinder replenishing of cold air, thereby influence radiating effect.And, because being the square formation shape mostly, arranges the radiating fin of traditional aluminium extruded type radiator, be unfavorable for air flows and easily produce big windage, and then influence radiating effect.
[summary of the invention]
The purpose of the utility model heat abstractor combination is to provide the good heat radiation dress of a kind of radiating effect to make up.
The purpose of the utility model heat abstractor combination realizes by following technical proposal: the utility model comprises a radiator, a guide duct and a fan.This radiator is made up of a heat-conducting substrate, a pipe and a fin, and wherein this pipe is the end face central authorities that are fixed in this substrate, offers some round vents on this pipe wall, to increase radiating effect; Also be fitted with a radiating fin on this circular tube external wall, this radiating fin is structure in the form of a ring, air vent hole at corresponding pipe is provided with the opening that connects to the fin outer surface, be beneficial to air flows and reduce windage, one end of this guide duct is connected with the pipe of radiator, and the other end then is connected with fan; And this fan can be directly fixed on the computer housing.Owing to adopted said structure, the combination of the utility model heat abstractor can suck the cold air of cabinet outside and rely on guide duct that cold air is delivered to the radiator surface corresponding with central processing unit, thereby reaches better radiating effect.
[description of drawings]
Fig. 1 is the three-dimensional combination figure of the utility model heat abstractor combination.
Fig. 2 is the three-dimensional exploded view of the utility model heat abstractor combination.
Fig. 3 is the radiator three-dimensional combination figure of the utility model heat abstractor combination.
Fig. 4 is the radiator three-dimensional exploded view of the utility model heat abstractor combination.
Fig. 5 is the fan of the utility model heat abstractor combination and the three-dimensional combination figure of guide duct.
[embodiment]
See also Fig. 1 and Fig. 2, the combination of the utility model heat abstractor comprises that a radiator 10, a fan 30 and connect the plastics guide duct 20 of this radiator 10 and fan 30.
As shown in Figures 3 and 4, this radiator 10 comprises a heat-conducting substrate 40, a pipe 60 and a circular radiating fin 50.Wherein, these substrate 10 bottom surfaces can be attached on the central processing unit (figure does not show), its central authorities slightly are the arcuation evagination, to cooperate this radiating fin 50, its end face two ends then are respectively equipped with a microscler conduit 42, embed and firmly are installed in radiator 10 on the central processing unit for relevant fastener (figure do not show); This pipe 60 is fixed in this pedestal 40 end face central authorities, and it is a hollow column, offers some round vents 62 on the tube wall of this pipe 60, for circulation of air.This radiating fin 50 is bent continuously by sheet metal and forms, it has some fins 54 that are radial arrangement, the air vent hole 62 of these fin 54 corresponding pipes 60 is provided with the opening 52 of perforation to its outer surface, so that pipe 60 forms the gas channel that communicates with fin 54 outsides.This pipe 60 and circular radiating fin 50 are contour, and the two also can be fitted and be integral.
Other sees also Fig. 2 and Fig. 5, and these guide duct 20 1 terminations are located at pipe 60 tops of radiator 10, and its other end then forms a bigger air intake vent (figure does not show), and outwards protrudes out four grabs 22 in the periphery of this air intake vent, in order to fan attachment 30.
This fan 30 is the air intake vent place that buckle is connected in guide duct 20, and offers a perforation 32 respectively in the Qi Sijiao end, for some screw 34 correspondences it is locked on the computer housing.
Because the combination of the utility model heat abstractor relies on fan 30 that cool ambient air is sucked, and make cold air blow in the pipe 60 of radiator 10 via guide duct 20, join with hot-air, via air vent hole 62 and fin 54 surfaces heat is taken away again, to reach the effect of abundant heat radiation, and the air that can keep from heat forms backflow phenomenon and influences replenishing of cold air around radiator 10, thereby further promotes heat dissipation.
Claims (5)
1. heat abstractor combination, comprise a radiator, a guide duct and a fan, and this radiator is by a substrate, a pipe and radiating fin combination, it is characterized in that: this pipe is fixedly arranged on substrate top surface, its tube wall offers some air vent holes, this radiating fin and circular tube external wall are fitted, and the corresponding air vent hole of its radiating fin is provided with the opening that connects to outer surface; This guide duct one end links to each other with the pipe of radiator; And the other end is connected with fan.
2. heat abstractor combination as claimed in claim 1, it is characterized in that: these substrate top surface two ends are respectively equipped with a microscler conduit.
3. heat abstractor combination as claimed in claim 1, it is characterized in that: some fins of this radiating fin are bent to form continuously by sheet metal, and are radial arrangement.
4. heat abstractor combination as claimed in claim 1, it is characterized in that: this this guide duct one end forms an air intake vent, and this air intake vent periphery is offered a grab respectively.
5. heat abstractor combination as claimed in claim 1, it is characterized in that: this fan sucks cool ambient air, blows to guide duct.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02225894 CN2533575Y (en) | 2002-02-20 | 2002-02-20 | Heatsink assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02225894 CN2533575Y (en) | 2002-02-20 | 2002-02-20 | Heatsink assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2533575Y true CN2533575Y (en) | 2003-01-29 |
Family
ID=33703011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02225894 Expired - Fee Related CN2533575Y (en) | 2002-02-20 | 2002-02-20 | Heatsink assembly |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2533575Y (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100358131C (en) * | 2004-11-12 | 2007-12-26 | 华硕电脑股份有限公司 | heat sink |
CN100401505C (en) * | 2004-11-19 | 2008-07-09 | 中华映管股份有限公司 | Heat radiation module |
WO2009089730A1 (en) * | 2008-01-09 | 2009-07-23 | Huawei Technologies Co., Ltd. | Radiating system and method for communication equipment |
CN100545783C (en) * | 2006-01-13 | 2009-09-30 | 綵威实业有限公司 | Radiator with air holes |
CN100584175C (en) * | 2006-11-17 | 2010-01-20 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN1545000B (en) * | 2003-11-25 | 2010-05-12 | 刘权余 | Processing method of computer CPU heat sink and product thereof |
CN101231547B (en) * | 2008-02-21 | 2010-06-09 | 四川大学 | Split positioning air supply computer case |
CN104214747A (en) * | 2013-05-29 | 2014-12-17 | 深圳市海洋王照明工程有限公司 | Heat dissipation device |
CN113921482A (en) * | 2020-07-07 | 2022-01-11 | 上海交通大学 | Improved microchannel cooling system |
-
2002
- 2002-02-20 CN CN 02225894 patent/CN2533575Y/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1545000B (en) * | 2003-11-25 | 2010-05-12 | 刘权余 | Processing method of computer CPU heat sink and product thereof |
CN100358131C (en) * | 2004-11-12 | 2007-12-26 | 华硕电脑股份有限公司 | heat sink |
CN100401505C (en) * | 2004-11-19 | 2008-07-09 | 中华映管股份有限公司 | Heat radiation module |
CN100545783C (en) * | 2006-01-13 | 2009-09-30 | 綵威实业有限公司 | Radiator with air holes |
CN100584175C (en) * | 2006-11-17 | 2010-01-20 | 富准精密工业(深圳)有限公司 | Heat radiator |
WO2009089730A1 (en) * | 2008-01-09 | 2009-07-23 | Huawei Technologies Co., Ltd. | Radiating system and method for communication equipment |
CN101231547B (en) * | 2008-02-21 | 2010-06-09 | 四川大学 | Split positioning air supply computer case |
CN104214747A (en) * | 2013-05-29 | 2014-12-17 | 深圳市海洋王照明工程有限公司 | Heat dissipation device |
CN104214747B (en) * | 2013-05-29 | 2017-06-23 | 深圳市海洋王照明工程有限公司 | Radiator |
CN113921482A (en) * | 2020-07-07 | 2022-01-11 | 上海交通大学 | Improved microchannel cooling system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030129 Termination date: 20100220 |