TWI410782B - Notebook computer having heat dissipation device - Google Patents

Abstract

A notebook computer having heat dissipation device includes a base and a cover corresponding to the base. The base and the cover together form a receiving space. An impeller is received in the receiving space. A printed circuit board for a fan is directly attached to the base. The impeller is directly disposed on the printed circuit board.

Description

Notebook computer with heat sink

The present invention relates to a portable electronic device, and more particularly to a notebook computer having a heat sink.

At present, with the advancement of technology and the demand for market development, high-performance and ultra-thin electronic products such as notebook computers have become the goal pursued by people. With the increase in the multi-functional requirements of such products, the heat generated by the heat-generating electronic components in the product is also increasing, and the conventional method is to affix the surface of the heat-generating electronic components in order to effectively dissipate the excess heat. A heat sink is then disposed on the heat sink, and the heat sink generated by the fan is forcibly dissipated by the cooling airflow generated by the fan, thereby dissipating heat generated by the heat-generating electronic component.

The conventional notebook computer generally includes a bottom plate and a cover plate corresponding to the bottom plate. The bottom plate and the cover plate are combined with each other to form a sealed receiving space. A fan is received in the receiving space, and the fan generally includes a frame. And an impeller disposed in the fan frame, the fan frame includes a lower plate, a side wall vertically extending from the lower plate, and an upper plate disposed on the side wall, wherein the upper plate and the lower plate are respectively provided with an upper plate The lower air inlet is provided with a fan circuit board for driving the impeller to rotate. After the fan is assembled to the electronic device, the upper and lower air inlets of the fan and the cover of the notebook computer and the bottom plate need a certain interval. Distance to guarantee The air inlet condition of the fan. However, with the trend of thin and light notebook computers, the height of the system is limited, the distance between the upper and lower air inlets of the fan and the cover and bottom plate of the notebook computer will be reduced and the flow of the fan will be reduced. It will also be greatly reduced.

Therefore, how to ensure that the fan in the notebook computer has a large airflow flow under the condition that the height of the notebook computer is reduced is a technical problem that needs to be solved at present.

In view of this, it is necessary to provide a notebook computer having a lower height without affecting the flow rate of the airflow of the fan.

A notebook computer having a heat dissipating device includes a bottom plate and a cover plate corresponding to the bottom plate, the bottom plate and the cover plate are combined with each other to form a receiving space, and an impeller is received in the receiving space, and the bottom plate is directly attached A fan circuit board is disposed on the fan circuit board.

As a further improvement of the present invention, the position of the cover plate of the notebook computer corresponding to the impeller forms a side wall which is integrally formed from the lower surface of the cover plate toward the bottom plate.

Compared with the prior art, the notebook computer uses the fan circuit board directly attached to the bottom plate to support the impeller, thereby eliminating the lower plate used in the fan frame of the conventional fan; The sidewall is formed, and the upper plate used in the fan frame of the conventional fan is omitted. This arrangement increases the effective height of the impeller and increases the wind sweeping capability of the fan, thereby improving the heat dissipation performance.

10‧‧‧Heat plate

20‧‧‧heat pipe

30‧‧‧Fin group

40‧‧‧ Impeller

42‧‧‧ accommodating slots

420‧‧‧ side wall

422‧‧‧air outlet

424‧‧ ‧Tongue

100‧‧‧floor

104‧‧‧Air inlet

200‧‧‧ boards

202‧‧‧Fan board

204‧‧‧Arc hole

206‧‧‧Base

208‧‧‧arms

210‧‧‧ round tube

300‧‧‧ cover

302‧‧‧ vents

304‧‧‧ inlet

402‧‧·wheels

404‧‧‧ leaves

1000‧‧‧Note Computer

1 is an exploded perspective view of a preferred embodiment of a notebook computer of the present invention.

Figure 2 is a perspective view of another angle of the cover of Figure 1.

3 is a perspective assembled view of FIG. 1.

Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3.

Hereinafter, a notebook computer having a heat sink according to the present invention will be described in detail with reference to the accompanying drawings.

1 to 4 are exploded and assembled views of a notebook computer 1000 according to a preferred embodiment of the present invention. The notebook computer 1000 includes a bottom plate 100, a circuit board 200 attached to the bottom plate 100, and a cover plate 300. The cover plate 300 and the bottom plate 100 are combined with each other to form a receiving space (not shown). 200 is housed in the accommodating space. In the embodiment, the cover 300 is a keyboard frame of the notebook computer 1000.

The circuit board 200 is provided with a heat-generating electronic component (not shown). The heat-generating electronic component is in contact with the lower surface of a heat-absorbing panel 10. The upper surface of the heat-absorbing panel 10 is connected to one end of a heat pipe 20, and the heat pipe is connected. The other end of the 20 is bent and connected to a fin set 30. The fin group 30 is disposed at a position of a lower right corner of the bottom plate 100. An air inlet 104 is disposed on a position of the bottom plate 100 adjacent to the inner side of the fin group 30. The air inlet 104 is circular, in order to make the notebook computer 1000 The appearance is beautiful, and the air inlet 104 is arranged in a mesh shape.

A gap (not shown) is formed on the circuit board 200 corresponding to the position of the air inlet 104. In this embodiment, the notch is square, and the air inlet 104 is disposed in the middle of the notch. A fan circuit board 202 is disposed in the notch. The fan circuit board 202 can be directly embedded in the notch and directly attached to the bottom plate 100. The bottom surface of the fan circuit board 202 embedded in the notch directly faces the bottom surface of the circuit board 200. . Of course, the fan circuit board 202 can be made integral with the circuit board 200, that is, the fan circuit board 202 is a part of the circuit board 200, so that the fan circuit board 202 and the circuit board 200 are integrated, which can reduce the production cost. In order to make more space, the thickness of the fan circuit board 202 is thinner than the circuit board 200, so that the top surface of the fan circuit board 202 forms a recess with respect to the top surface of the circuit board 200, so that the thickness of the fan circuit board 202 can be reduced. The notebook computer 1000 has a larger fan installation space inside.

A through hole is defined in the fan circuit board 202 corresponding to the air inlet 104. The through hole is two arc holes 204, and the outer circumference of the two arc holes 204 is the same size as the air inlet 104. A circular base 206 is disposed between the two arcuate apertures 204. The base 206 is surrounded by the two arcuate apertures 204 and is coupled to the fan circuit board 202 by the two arms 208. A circular hole (not shown) is disposed in the middle of the base 206. A circular tube 210 is embedded in the circular hole and fixed on the fan circuit board 202 or through the circular hole to be fixed to the bottom plate 100.

An impeller 40 is placed on the fan circuit board 202 and rotatably mounted to the circular tube 210. The impeller 40 includes a hub 402 and a plurality of vanes 404 extending radially outward from the periphery of the hub 402. The vanes 404 are inclined in the counterclockwise direction and are evenly distributed on the outer periphery of the hub 402 so that the impeller 40 does not sway when rotated. In practical use, the tube 210 is provided with a shaft The impeller 40 further includes a rotating shaft extending downward from a central portion of the hub 402. The rotating shaft extends into the bearing. In addition, a stator around the coil 210 is disposed around the periphery of the stator, so that the impeller 40 is disposed around the periphery of the stator. And electrically connecting the coil on the stator to the fan circuit board 202 to form a fan.

Referring to FIG. 2 again, a position 420 is formed on the cover 300 corresponding to the outer circumference of the impeller 40, that is, the position of the thinner fan circuit board 202. The side wall 420 and the cover 300 can be integrated by die casting or injection molding. forming. The side wall 420 extends integrally downward from the lower surface of the cover plate 300 toward the bottom plate 100 until it abuts against the fan circuit board 202, and the side wall 420 is disposed substantially along the circumference of the impeller 40. The side wall 420, the cover plate 300 and the fan The circuit board 202 is formed in a receiving groove 42 . The impeller 40 is received in the receiving groove 42 . An air outlet 422 is disposed on the sidewall 420 corresponding to the fin set 30. The fin set 30 is disposed at the position of the air outlet 422. In this embodiment, the side wall 420 has a curved edge and two straight sides. The air outlet 422 is disposed at a position of a straight edge. The side wall 420 is provided with a tongue 424 at a position of the air outlet 422. The side of the cover plate 300 is provided with a vent 302 communicating with the outside of the fin set 30. The size of the vent 302 is equivalent to the size of the fin set 30 for blowing the impeller 40 toward the fin set. The airflow of 30 flows through the fin set 30 and is blown to the outside.

In this embodiment, in order to further enhance the air inlet effect of the impeller 40, another air inlet 304 is disposed on the air inlet 104 of the bottom plate 100 of the cover 300 of the notebook computer 1000, and the other air inlet 304 is also It is mesh-shaped and its size is also the same as the size of the air inlet 104.

The assembled notebook computer 1000 has a bottom end of the side wall 420 on the cover 300 The cover plate 300 and the fan circuit board 202 form a space in which the impeller 40 is mounted, so that the side wall 420 is connected between the cover 300 of the notebook computer 1000 and the fan circuit board 202. Thereby, the air flow rate can be increased by increasing the height dimension of the impeller 40.

In the above arrangement, by directly attaching the fan circuit board 202 to the bottom plate 100 of the notebook computer 1000 and then mounting the impeller 40 to the fan circuit board 202, the lower plate used by the fan frame of the conventional fan can be omitted; In addition, the side wall 420 is directly formed integrally with the cover 300 of the notebook computer 1000, and the upper plate used for the fan frame of the conventional fan can be omitted. That is to say, the lower plate and the upper plate used in the conventional fan can be omitted in the above arrangement, the components are reduced, the cost can be saved, the assembly step can be saved, and the height of the installation space of the impeller 40 is effectively increased, and the wind sweep performance of the fan is improved. Therefore, the fan in the notebook computer has a large airflow flow rate under the condition that the height of the notebook computer is reduced.

During operation, heat emitted from the heat-generating electronic component is transmitted to the heat pipe 20 through the heat absorbing plate 10 and then transmitted to the fin group 30, while the impeller 40 is driven to rotate by the fan circuit board 202, and the external airflow is simultaneously passed through the air inlet 104 and the other. An air inlet 304 flows into the accommodating space of the notebook computer 1000, is blown out from the air outlet 422 through the air guiding action of the side wall 420, and then flows through the fin group 30 to bring the heat of the fin group 30 from the vent 302 to the vent 302. The outside world, thus achieving the purpose of heat dissipation.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧Heat plate

20‧‧‧heat pipe

30‧‧‧Fin group

40‧‧‧ Impeller

100‧‧‧floor

200‧‧‧ boards

202‧‧‧Fan board

204‧‧‧Arc hole

206‧‧‧Base

208‧‧‧arms

210‧‧‧ round tube

300‧‧‧ cover

302‧‧‧ vents

304‧‧‧ inlet

402‧‧·wheels

404‧‧‧ leaves

1000‧‧‧Note Computer

Claims (8)

A notebook computer having a heat dissipating device includes a bottom plate and a cover plate corresponding to the bottom plate, the bottom plate and the cover plate are combined with each other to form a receiving space, and an impeller is received in the receiving space, and the improvement is: the bottom plate Directly affixing a fan circuit board, the impeller is disposed on the fan circuit board, and an air inlet is formed on the bottom plate corresponding to the position of the impeller, and a position of the air inlet corresponding to the air inlet plate forms a through hole, the air inlet and the air inlet The through hole communicates with the fan circuit board forming a base at an intermediate position of the through hole. The base is connected to the fan circuit board through a plurality of arms, and a circular tube is disposed in a middle portion of the base, and the impeller is mounted on the circular tube. A notebook computer having a heat sink according to claim 1, wherein the notebook computer further includes a circuit board, the circuit board is disposed on the bottom board, and the circuit board and the fan circuit board are formed. In one. A notebook computer having a heat sink according to claim 1, wherein the notebook computer further includes a circuit board, the circuit board is disposed on the bottom plate, and the position corresponding to the impeller is formed on the circuit board. A notch, the fan circuit board is embedded in the notch. A notebook computer having a heat sink according to claim 2 or 3, wherein the thickness of the fan circuit board is thinner than the thickness of the circuit board of the notebook computer. A notebook computer having a heat sink according to claim 1, wherein the position of the cover corresponding to the impeller forms another air inlet. A notebook computer having a heat dissipating device according to any one of claims 1 to 3, wherein the position of the corresponding impeller on the cover plate forms a side wall which is integrated from the lower surface of the cover plate toward the bottom plate. Extended formation. A notebook computer having a heat dissipating device according to claim 6, wherein the position of the corresponding impeller on the cover plate forms an air inlet. The notebook computer having a heat dissipating device according to claim 6, wherein the side wall extends to abut against the fan circuit board, and the side wall, the cover plate and the fan circuit board enclose a receiving groove. The impeller is received in the receiving groove.