CN113921482A - Improved microchannel cooling system - Google Patents
Improved microchannel cooling system Download PDFInfo
- Publication number
- CN113921482A CN113921482A CN202010644019.5A CN202010644019A CN113921482A CN 113921482 A CN113921482 A CN 113921482A CN 202010644019 A CN202010644019 A CN 202010644019A CN 113921482 A CN113921482 A CN 113921482A
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- China
- Prior art keywords
- heat sink
- microchannel
- microchannels
- fins
- working medium
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 36
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000005457 optimization Methods 0.000 claims description 6
- 238000002474 experimental method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims 1
- 238000004904 shortening Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000000737 periodic effect Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An improved microchannel high efficiency cooling system comprising: the upper cover plate and discoid chassis that set up relatively, wherein: a plurality of fin groups are circumferentially arranged on the base plate, each fin group comprises a plurality of fins with variable intervals, a main micro-channel and a secondary micro-channel are formed between each two adjacent fins and between each two adjacent fin groups and are arranged on the disc in a divergent mode, a cooling working medium inlet is formed in the center of the cooler, and the cooling working medium flows to the outer edge of the disc along the micro-channels. The invention can effectively improve the heat transfer efficiency of the cooler and ensure the temperature uniformity of the cooled equipment by shortening the length of the channel for the cooling working medium to flow and periodically destroying the wall surface thermal boundary layer.
Description
Technical Field
The invention relates to a technology in the field of semiconductor chip heat dissipation, in particular to an improved micro-channel heat radiator.
Background
In the microchannel radiator, along with forward flowing of a cooling working medium, the temperature gradient between the near-wall fluid and the core fluid is highly developed, a thermal boundary layer at the wall surface is gradually thickened, heat transfer in the thermal boundary layer area is heat conduction and heat transfer of the working medium, and the heat transfer coefficient is obviously smaller than that of convection heat transfer. This phenomenon deteriorates convection heat transfer and lowers the cooling effect of the heat sink.
On the other hand, as the working medium flows in the microchannel, the cooling working medium absorbs heat from the wall surface of the microchannel radiator, so that the temperature of the microchannel radiator is gradually increased, and the heat radiation effect at the working medium outlet of the radiator is obviously weaker than that at the working medium inlet. The heat dissipating capacity of each part of the radiator is inconsistent, so that the surface temperature of the radiated equipment is unequal, and the normal work of the radiated equipment is influenced to a certain extent due to the temperature difference.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an improved micro-channel radiator, which can periodically destroy a wall surface thermal boundary layer by shortening the length of a channel for cooling working medium to flow. The heat transfer efficiency of the radiator can be effectively improved, the temperature uniformity of the radiated equipment is ensured, the pressure drop of the cooling working medium in the radiator can be effectively reduced, and the power consumption is reduced.
The invention is realized by the following technical scheme:
the invention comprises the following steps: the upper cover plate and discoid chassis that set up relatively, wherein: a plurality of fin groups are circumferentially arranged on the base plate, each fin group comprises a plurality of fins with variable intervals, a main micro-channel and a secondary micro-channel are formed between every two adjacent fins and between every two adjacent fin groups and are arranged on the disc in a divergent mode, a cooling working medium inlet is formed in the center of the radiator, and the cooling working medium flows to the outer edge of the disc along the micro-channel.
And main micro-channels are formed between the adjacent fin groups along the radius direction of the base plate, and the width of each main micro-channel is in direct proportion to the radius.
The cross section of the main microchannel is rectangular, the width of the main microchannel is uniformly increased from the center to the outer edge of the microchannel radiator, and the height of the main microchannel is unchanged.
Adjacent fins in each group of fin groups form a secondary microchannel spirally diffused from the center of the base plate, the secondary microchannel is communicated with adjacent main microchannels and has an inclination angle with the axis of the main microchannel on one adjacent side, the width of the secondary microchannel is half of the width of the main microchannel connected at the inlet of the secondary microchannel, the width of each secondary microchannel is constant, the inclination angles of all the secondary microchannels are the same, and the secondary microchannel is determined according to actual needs.
The range of the inclination angle is as follows: the specific inclination angle is optimally selected according to the inlet speed and the heat flow density of the lower surface of the chassis, the optimization target needs to comprehensively consider the heat dissipation efficiency and the pressure drop of the cooling working medium, and the optimization process needs to carry out specific experiments.
The center of the radiator is provided with an opening as a cooling working medium inlet, and after entering the radiator, the radiator is uniformly divided into a plurality of areas along the circumferential direction to be used as micro-channel inlets.
All the fins have the same height.
The ratio of the width of the main micro-channel on the outer edge of the base plate to the width of the fin on the outer edge is 1: 1.
The height of the base plate is half of the height of the fins.
The base plate and the fins are preferably made of the same material.
The fin is preferably made of aluminum or copper, and the microchannel radiator preferably takes water as a cooling working medium.
Technical effects
The secondary microchannels are arranged between two adjacent main microchannels of the radiator, so that a part of main flow can be transferred to the secondary microchannels, secondary flow carrying momentum is injected into the adjacent main microchannels under the driving of pressure difference, a thermal boundary layer of near-wall fluid can be effectively damaged, and the thermal boundary layer is always in the initial stage of development. On the other hand, the secondary flow can also strengthen the mixing between the near-wall fluid and the core fluid, and can generate better heat transfer effect. Compared with the prior art, the radiator takes the center as an inlet and the outer edge of the disc as an outlet, so that the flowing distance of a cooling working medium in the microchannel can be effectively shortened, the temperature rise of the working medium in the radiator is reduced, the heat exchange coefficient of the radiator is obviously improved, and the pressure drop of the cooling working medium in the radiator can be effectively reduced. Thereby ensuring temperature uniformity.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic view of a fin pack of the internal periodic structure of the present invention;
FIG. 4 is a schematic view of an internal periodic structure of a three fin pack assembly of the present invention;
FIG. 5 is a partial enlarged view of the inlet of the three fin group combination with the internal periodic structure according to the present invention
FIG. 6 is a top view of an internal periodic structure of the present invention;
FIG. 7 is a top view of a combination of three fin sets with internal periodic structures according to the present invention
In the figure: 1 fin, 2 chassises, 3 main microchannels, 4 secondary microchannels, 5 radiator inlets, 6 microchannel inlets, 7 outlets and 8 upper cover plates.
Detailed Description
As shown in fig. 2, the present embodiment relates to a microchannel heat sink, which includes: upper cover plate 8 and discoid chassis 2 that set up relatively, wherein: the base plate 2 is provided with the fins 1, the material of the base plate is the same as the fins, the effect of the base plate is mainly that heat is directly transferred to a cooling working medium from the lower part by cooling equipment or indirectly transferred to the cooling working medium through the fins, and the cooling working medium and the cooled equipment are separated to prevent the cooling working medium from polluting or corroding the cooled equipment.
As shown in fig. 1, the center of the heat sink is provided with a heat sink inlet 5, and after entering the heat sink from the heat sink inlet 5, the cooling working medium enters the main microchannel 3 through the microchannel inlet 6.
As shown in fig. 2, each of the primary and secondary microchannels is rectangular in cross-section. Since the main micro-channel is developed along the radius of the disc, the area covered by the main micro-channel is larger when the main micro-channel is closer to the outer edge, and in order to enable all parts of the radiator to have the same radiating effect, the width of the main micro-channel is gradually increased from the center to the outer edge of the disc, and the height of the main micro-channel is unchanged.
The main micro-channel 3 continues to the periphery of the base plate to form an outlet 7, and the width of the outlet 7 is the same as that of the fin 1 on the outer edge of the base plate.
In order to reduce the influence of a thermal boundary layer on a microchannel radiator, a plurality of secondary microchannels are added between two adjacent main microchannels according to a certain rule, so that a part of main flow can be transferred to the secondary microchannels, and secondary flow carrying momentum is injected into the adjacent main microchannels under the driving of pressure difference, so that the thermal boundary layer of near-wall fluid can be effectively damaged, the thermal boundary layer is always in the initial stage of development, is thin and has a good heat conduction effect.
The method comprises the following steps according to a certain rule: the secondary microchannel is added so that the side of each fin (except the fin at the outermost edge of the radiator) close to the inlet and serving as the wall surface of the secondary microchannel has the same length as the right side of the fin serving as the wall surface of the main microchannel.
The height of the secondary micro-channel 4 is the same as that of the main micro-channel 3, the width of the secondary micro-channel is the same as that of the main micro-channel connected with the inlet of the secondary micro-channel, the width of each secondary micro-channel is constant, the inclination angles of all the secondary micro-channels are the same, and the secondary micro-channels are determined according to actual needs. When the inclination angle is smaller, the kinetic energy carried by the secondary flow can be increased, but the influence of the secondary flow on the main flow can be reduced; if the angle of inclination of the secondary microchannel is increased, the secondary flow will have a more direct effect on the primary flow, but the secondary flow will be significantly reduced.
The inclination angle of the secondary microchannel is selected in an optimized mode according to the inlet speed and the heat flow density of the lower surface of the chassis, the heat dissipation efficiency and the pressure drop of the cooling working medium are comprehensively considered in the optimization target, and specific experiments are needed in the optimization process.
The fin material can be selected from aluminum or copper, and the chassis material is consistent with the fin material.
The cooling working medium of the radiator of the embodiment is water or other liquid working medium, and the liquid (such as water) has high heat conductivity and specific heat capacity value and is more effective than air in removing waste heat. Furthermore, the noise generated by the liquid cooling solution is small, which cannot be achieved by active air cooling using a fan. The high heat transfer coefficient that can be achieved by using small-sized channels and high surface-to-volume ratios enables microchannel heat sinks to dissipate large amounts of heat very efficiently from electronic chips, particularly electronic chips with compact footprints.
Through specific experiments, in the experiments, copper is selected as a base plate and a fin material, water is selected as a cooling working medium, and the inclination angle of the secondary microchannel is set to be 30 degrees. The speed at the inlet of the cooling working medium is 1m/s, and the heat flow density of the lower surface of the chassis is 60w/m2In the process, compared with the radiator without the secondary micro-channel, the cooling efficiency is increased by 5%, and the pressure drop in the radiator is reduced by 10%.
In conclusion, the secondary microchannel inclined with the axis of the main microchannel is adopted on the disc-shaped radiator, so that the wall surface thermal boundary layer can be periodically and effectively destroyed, the cooling efficiency of the radiator is obviously improved, the pressure drop of the cooling working medium in the radiator is reduced, and the power consumption is reduced.
The foregoing embodiments may be modified in many different ways by those skilled in the art without departing from the spirit and scope of the invention, which is defined by the appended claims and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (10)
1. An improved microchannel heat sink, comprising: the upper cover plate and discoid chassis that set up relatively, wherein: a plurality of fin groups are circumferentially arranged on the base plate, each fin group comprises a plurality of fins with variable intervals, a main micro-channel and a secondary micro-channel are formed between every two adjacent fins and between every two adjacent fin groups and are arranged on the disc in a divergent mode, a cooling working medium inlet is formed in the center of the radiator, and the cooling working medium flows to the outer edge of the disc along the micro-channel.
2. The improved microchannel heat sink of claim 1, wherein adjacent fin groups define therebetween primary microchannels in the radial direction of the base plate, the primary microchannels having widths proportional to the radius.
3. The improved microchannel heat sink of claim 1, wherein said main microchannel has a rectangular cross-section with a width that increases uniformly from the center to the outer edge of said microchannel heat sink and a constant height.
4. The improved microchannel heat sink as recited in claim 1, wherein adjacent fins in each set of fins define therebetween secondary microchannels extending helically from the center of the base plate, the secondary microchannels communicating with adjacent primary microchannels.
5. The improved microchannel heat sink of claim 1, wherein the secondary microchannels are at an oblique angle to the axis of the primary microchannels on adjacent sides.
6. The improved microchannel heat sink of claim 1, wherein the width of the secondary microchannel is half the width of the primary microchannel connected at its inlet, and wherein the width of each secondary microchannel is constant and the angle of inclination of all secondary microchannels is the same.
7. The improved microchannel heat sink of claim 1, wherein the range of angles of inclination is: the specific inclination angle is optimally selected according to the inlet speed and the heat flow density of the lower surface of the chassis, the optimization target needs to comprehensively consider the heat dissipation efficiency and the pressure drop of the cooling working medium, and the optimization process needs to carry out specific experiments.
8. The improved microchannel heat sink as recited in claim 1 wherein said heat sink has an opening in the center thereof for the inlet of the cooling medium, and after entering the heat sink, the heat sink is divided circumferentially into a plurality of zones uniformly for the inlet of the microchannels.
9. The improved microchannel heat sink of claim 1, wherein all of said fins have the same height and said base has a height of one half of the height of the fins.
10. The improved microchannel heat sink of claim 1, wherein the ratio of the width of the primary microchannel at the outer edge of the base plate to the width of the fins at the outer edge is 1: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010644019.5A CN113921482A (en) | 2020-07-07 | 2020-07-07 | Improved microchannel cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010644019.5A CN113921482A (en) | 2020-07-07 | 2020-07-07 | Improved microchannel cooling system |
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| Publication Number | Publication Date |
|---|---|
| CN113921482A true CN113921482A (en) | 2022-01-11 |
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| CN202010644019.5A Pending CN113921482A (en) | 2020-07-07 | 2020-07-07 | Improved microchannel cooling system |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2533575Y (en) * | 2002-02-20 | 2003-01-29 | 富准精密工业(深圳)有限公司 | Heatsink assembly |
| US20060011325A1 (en) * | 2004-07-13 | 2006-01-19 | Schlitz Daniel J | Micro-channel heat sink |
| CN102798308A (en) * | 2012-08-23 | 2012-11-28 | 南京工业大学 | Micro-channel radiator and micro-channel processing method |
| CN107172859A (en) * | 2017-06-19 | 2017-09-15 | 电子科技大学 | A kind of MCA |
| CN108495540A (en) * | 2018-06-08 | 2018-09-04 | 广东工业大学 | A kind of heat-radiating device of electric component with soaking plate |
| CN110972456A (en) * | 2019-12-30 | 2020-04-07 | 华南理工大学 | A kind of ultra-thin soaking plate with composite liquid-absorbing core structure and its manufacturing method |
-
2020
- 2020-07-07 CN CN202010644019.5A patent/CN113921482A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2533575Y (en) * | 2002-02-20 | 2003-01-29 | 富准精密工业(深圳)有限公司 | Heatsink assembly |
| US20060011325A1 (en) * | 2004-07-13 | 2006-01-19 | Schlitz Daniel J | Micro-channel heat sink |
| CN102798308A (en) * | 2012-08-23 | 2012-11-28 | 南京工业大学 | Micro-channel radiator and micro-channel processing method |
| CN107172859A (en) * | 2017-06-19 | 2017-09-15 | 电子科技大学 | A kind of MCA |
| CN108495540A (en) * | 2018-06-08 | 2018-09-04 | 广东工业大学 | A kind of heat-radiating device of electric component with soaking plate |
| CN110972456A (en) * | 2019-12-30 | 2020-04-07 | 华南理工大学 | A kind of ultra-thin soaking plate with composite liquid-absorbing core structure and its manufacturing method |
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