CN213755435U - A Hybrid Microchannel Heat Sink Combining Trapezoid and Waveform - Google Patents
A Hybrid Microchannel Heat Sink Combining Trapezoid and Waveform Download PDFInfo
- Publication number
- CN213755435U CN213755435U CN202022505791.7U CN202022505791U CN213755435U CN 213755435 U CN213755435 U CN 213755435U CN 202022505791 U CN202022505791 U CN 202022505791U CN 213755435 U CN213755435 U CN 213755435U
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- channel
- jet
- metal copper
- trapezoid
- waveform
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 21
- 229910052802 copper Inorganic materials 0.000 abstract description 21
- 239000010949 copper Substances 0.000 abstract description 21
- 239000002184 metal Substances 0.000 abstract description 20
- 229910052751 metal Inorganic materials 0.000 abstract description 20
- 238000001816 cooling Methods 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000002826 coolant Substances 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型公开了一种梯形和波形相结合的混合微通道散热器，包括金属铜质壳体，所述金属铜质壳体两侧设有射流出口，所述金属铜质壳体上部设有射流入口，所述金属铜质壳体下部为电子元件贴合面，所述金属铜质壳体内部设有贯通金属铜质壳体两侧和上部的内部通道，所述内部通道由射流入口通道、射流出口通道组成，所述射流入口通道的位于内部通道中部，所述射流出口通道位于内部通道两侧，本实用新型通过改变微型通道的结构形状，采用梯形和波形结合的混合微通道，结合了微通道流动和射流冲击的优点，提供了非常高的散热能力的同时大大增强对流换热，使冷却表面上保持了高度的温度均匀性。
The utility model discloses a hybrid micro-channel radiator combining trapezoid and waveform, comprising a metal copper shell, two sides of the metal copper shell are provided with jet outlets, and the upper part of the metal copper shell is provided with The jet inlet, the lower part of the metal copper shell is the bonding surface of the electronic components, the inside of the metal copper shell is provided with an internal channel penetrating the two sides and the upper part of the metal copper shell, and the internal channel is formed by the jet inlet channel , the jet outlet channel is composed, the jet inlet channel is located in the middle of the inner channel, and the jet outlet channel is located on both sides of the inner channel, the utility model changes the structure and shape of the micro channel, adopts a mixed micro channel combining trapezoid and waveform, combined with With the advantages of microchannel flow and jet impingement, it provides very high heat dissipation capacity and greatly enhances convective heat transfer, so that a high degree of temperature uniformity is maintained on the cooling surface.
Description
Technical Field
The utility model belongs to microchannel radiator heat dissipation field, concretely relates to mixed microchannel radiator that trapezoidal and wave form combined together.
Background
In the past decades, the high heat production fields such as packaging electronic devices, solar photovoltaic condensers, laser diode arrays and the like have been developed rapidly, and along with the higher integration level and higher power consumption density of the electronic devices, the heat dissipation exceeds 500W/cm2However, heat density is still increasing and there is a strong need for a more efficient thermal management system. Microchannel flow and jet impingement are two conventional heat dissipation strategies. The microchannel radiator only needs less coolant to dissipate very large heat in a small area, and has compact structure. Jet impingement cooling is capable of dissipating very large heat fluxes and smaller pressure drops than microchannel heat sinks. However, they still have deficiencies. The micro-channel has the problems of large pressure drop and poor temperature uniformity. For jet impingement, the heat exchange capacity is high only in the jet region, whereas a large temperature gradient exists on the heated surface. Microchannel radiator with simple structureAnd jet impingement cooling has not been able to meet heat dissipation requirements. Whereas a simple cooling by increasing the flow rate leads to a sharp increase in the pressure loss and thus to a sharp increase in the pump power. Therefore, a new micro-channel heat exchanger is urgently needed to meet the requirement of heat dissipation by changing the shape of the model.
Microchannels in combination with jet impingement are one of the most efficient cooling modules, known as hybrid microchannel heat sinks, which have the advantages of both microchannel flow and jet impingement, not only providing very high heat removal capability, but also maintaining a high degree of temperature uniformity across the cooling surface.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome prior art's is not enough, adapts to reality needs, provides a mixed microchannel radiator that trapezoidal and wave form combined together, makes the temperature homogeneity of cooling surface when improving the heat-sinking capability.
In order to realize the utility model discloses a purpose, the utility model discloses a technical scheme do:
the utility model discloses a trapezoidal mixed microchannel radiator that combines together with the waveform, including metal copper casing, metal copper casing both sides are equipped with the efflux export, metal copper casing upper portion is equipped with the efflux entry, metal copper casing lower part is electronic component binding face, the inside passageway that link up metal copper casing both sides and upper portion that is equipped with of metal copper casing, inside passageway comprises efflux access way, efflux exit channel, efflux access way be located the inside passageway middle part, efflux exit channel is located the inside passageway both sides.
The jet inlet channel comprises a rectangular channel and a trapezoidal channel, the upper portion of the jet inlet channel is the rectangular channel, the lower portion of the jet inlet channel is the trapezoidal channel, the rectangular channel is of a flat cuboid structure, and the trapezoidal channel is of an inverted trapezoidal structure.
The jet flow outlet channel comprises a waveform channel and a trapezoidal channel, the waveform channel is connected with the inflow port channel, and the trapezoidal channel is arranged at the jet flow outlet of the jet flow outlet channel; the wave-shaped channel is of a quadrangular prism structure, and the four surfaces of the wave-shaped channel are uniformly distributed wave-shaped curved surfaces.
The metal copper shell is internally provided with a plurality of internal channels which are uniformly distributed in a arrayed manner, and the internal channels are of an inverted T-shaped structure.
The beneficial effects of the utility model reside in that:
the utility model discloses a change microchannel's structural shape, adopt the mixed microchannel that trapezoidal and wave form combine, combined the advantage that the microchannel flows and the efflux is strikeed, strengthen the convection heat transfer greatly when providing very high heat-sinking capability, make the cooling keep high temperature homogeneity on the surface.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a sectional view of the internal structure of the present invention;
fig. 3 is a schematic view of the internal passage of the present invention.
In the figure: 1 metallic copper casing, 2 internal channels, 201 rectangular channel, 202 wave form passageway, 203 trapezoidal channel, 3 efflux inlet passageways, 301 efflux entry, 4 efflux exit passageways, 401 efflux export, 5 electronic component binding face.
Detailed Description
The invention will be further described with reference to the following figures and examples:
see fig. 1-3.
The utility model discloses a trapezoidal and wave form combined hybrid microchannel radiator, including metal copper casing 1, metal copper casing 1 both sides are equipped with efflux export 401, metal copper casing 1 upper portion is equipped with efflux entry 301, metal copper casing 1 lower part is electronic component binding face 5, metal copper casing 1 is inside to be equipped with inside passageway 2 that link up metal copper casing 1 both sides and upper portion, inside passageway 2 comprises efflux entry passageway 3, efflux exit passageway 4, the position of efflux entry passageway 3 is in the middle part of inside passageway 2, efflux exit passageway 4 is located inside passageway 2 both sides; the fluid injected through the jet flow outlet can impact the bottom wall and form a vortex, the flow is short and the flow boundary layer on the impacted surface is thin due to the fact that the coolant directly impacts the heat exchange surface, the heat exchange effect is good, and the channel is forcedly divided into two branches due to the fact that the channel outlet is arranged on the two sides, and turbulent flow is enhanced; meanwhile, the coolant inlet is positioned in the middle of the internal channel, so that the temperature difference between two sides can be reduced, and the temperature distribution of the heated surface is more uniform.
The jet inlet channel 3 comprises a rectangular channel 201 and a trapezoidal channel 203, the upper part of the jet inlet channel 3 is the rectangular channel 201, the lower part of the jet inlet channel 3 is the trapezoidal channel 203, the rectangular channel 201 is of a flat cuboid structure, the trapezoidal channel 203 is of an inverted trapezoidal structure, when the area of the cross section is fixed, the trapezoidal cross section has a larger circumference compared with the rectangular cross section, so that the contact area of fluid and solid is increased, and due to the barrier effect of the side wall, the impact jet can form a vortex more easily than the rectangular cross section, and the development of the vortex is facilitated.
The jet flow outlet channel 4 comprises a waveform channel 202 and a trapezoid channel 203, the waveform channel 202 is connected with the flow inlet channel 3, and the trapezoid channel 203 is arranged at the jet flow outlet 401 of the jet flow outlet channel 4; the wave-shaped channel 202 is of a quadrangular prism structure, and four surfaces of the wave-shaped channel are uniformly distributed wave-shaped curved surfaces; based on the principle of intensified heat transfer and the flow resistance theory, the heat exchange rate of the impact surface of the wave-shaped channel is higher than that of the flat channel; the wall surface in the middle of the micro-channel adopts a sine-curved-surface type waveform wall, the control equation of the waveform wall is Y = A.sin (2 pi.x/lambda), wherein A is amplitude, lambda is wavelength, and different amplitude and wavelength values can be selected according to actual heat dissipation requirements; due to the adoption of the wave-shaped wall, the disturbance on the fluid can be effectively enhanced, the fluid boundary layer is damaged, and the thermal resistance is reduced; meanwhile, the wave-shaped curved surface conforms to the flow characteristic, and compared with the common needle column matrix-shaped channel, the flow resistance is greatly reduced; the reason for the enhanced heat exchange of the corrugated micro-channel is that a vortex is formed on the cross section of the channel at the bent wall, so that the mixing of the coolant is promoted, and the convective heat exchange between the coolant and the channel wall is enhanced; a small section of straight channel is arranged at the outlet of the internal channel, and the purpose of the straight channel is to inhibit the backflow at the outlet and enable the cooling liquid to flow out of the micro-channel more conveniently.
The metal copper shell 1 is internally provided with a plurality of internal channels 2 which are uniformly distributed in a arrayed manner, and the internal channels 2 are of an inverted T-shaped structure.
The above mentioned is only the embodiment of the present invention, not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings or the direct or indirect application in the related technical field are included in the patent protection scope of the present invention.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022505791.7U CN213755435U (en) | 2020-11-03 | 2020-11-03 | A Hybrid Microchannel Heat Sink Combining Trapezoid and Waveform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022505791.7U CN213755435U (en) | 2020-11-03 | 2020-11-03 | A Hybrid Microchannel Heat Sink Combining Trapezoid and Waveform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213755435U true CN213755435U (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022505791.7U Expired - Fee Related CN213755435U (en) | 2020-11-03 | 2020-11-03 | A Hybrid Microchannel Heat Sink Combining Trapezoid and Waveform |
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| Country | Link |
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| CN (1) | CN213755435U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399779A (en) * | 2020-11-03 | 2021-02-23 | 南昌大学 | Trapezoidal and wave-shaped combined hybrid micro-channel radiator |
-
2020
- 2020-11-03 CN CN202022505791.7U patent/CN213755435U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399779A (en) * | 2020-11-03 | 2021-02-23 | 南昌大学 | Trapezoidal and wave-shaped combined hybrid micro-channel radiator |
| CN112399779B (en) * | 2020-11-03 | 2025-02-14 | 南昌大学 | A hybrid microchannel radiator combining trapezoidal and corrugated shapes |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210720 |
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| CF01 | Termination of patent right due to non-payment of annual fee |