CN209295062U - electronic radiator - Google Patents

Abstract

The utility model discloses an electronic radiator with strong air convection capability, which comprises a heat dissipation base plate, a heat dissipation pipe is arranged on the heat dissipation base plate, and air holes are arranged on the pipe wall of the heat dissipation pipe; A tapered skirt, one end of the heat dissipation pipe is plugged into the tapered skirt, and riveted on the heat dissipation base plate through the tapered skirt. The heat dissipation pipe with ventilation holes is used as heat dissipation fins, and the inner and outer walls of the pipe participate in heat dissipation, which not only increases the heat dissipation area, but also plays a suction function similar to a chimney. The air convection coefficient inside and outside the pipe is high, without increasing heat dissipation. In the case of fin density, the heat dissipation capacity is greatly improved, and it can be widely used in electronic equipment such as LED street lights.

Description

electronic radiator

technical field

The utility model belongs to the technical field of electronic radiators, in particular to an electronic radiator with strong air convection capability.

Background technique

Electronic devices such as LED lamps need to use radiators to dissipate the heat generated by them. The operating temperature allowed by these electronic devices cannot be too high. Therefore, in actual use, the heat absorbed by the radiator is mainly dissipated to Into the surrounding air, thereby maintaining a lower operating temperature of electronic equipment. Generally speaking, the larger the air convection coefficient, the larger the effective heat dissipation area, and the better the convection heat dissipation performance of the radiator. But for a specific radiator, the heat dissipation area is not only affected by the space, but also blindly increasing the density and height of the fins in order to increase the heat dissipation area will reduce the convection coefficient and affect the convection heat dissipation. It does not serve the purpose of improving heat dissipation. Therefore, for an electronic heat sink, it is preferable to increase its heat dissipation capability: without increasing the density and height of heat dissipation fins, to increase the coefficient of air convection.

Contents of the invention

The technical problem to be solved by the utility model is to provide an electronic radiator with strong air convection capability.

In order to solve the above-mentioned technical problems, the utility model includes a heat dissipation base plate, and its structural feature is that a heat dissipation pipe is provided on the heat dissipation base plate, and air holes are provided on the pipe wall of the heat dissipation pipe.

Preferably, the base of the end of the heat dissipation pipe connected to the heat dissipation substrate is provided with air holes.

Further, the heat dissipation pipe is a circular pipe, and a circular air hole is provided at the base thereof.

Another preferred feature is that the heat dissipation substrate is provided with a conical skirt, and one end of the heat dissipation pipe is plugged into the conical skirt and riveted to the heat dissipation substrate through the conical skirt.

After adopting the above-mentioned structure, since there are heat-dissipating pipes on the heat-dissipating substrate, the pipe walls of the heat-dissipating pipes are provided with vent holes, and the heat-dissipating pipes with vent holes are used as heat-dissipating fins, and the inner and outer walls of the pipe participate in heat dissipation, which not only increases the heat dissipation area , and the pipe body exerts its suction function similar to that of a chimney, the air convection coefficient inside and outside the pipe is high, and the heat dissipation capacity is greatly improved without increasing the density of the heat dissipation fins.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described:

Fig. 1 is the overall schematic diagram of the utility model;

Fig. 2 is the partial connection schematic diagram of the utility model;

Fig. 3 is a side view of a single radiator of the utility model.

Detailed ways

Referring to Fig. 1 to Fig. 3, the embodiment of the present invention includes a heat dissipation substrate 1, which is made of aluminum material with good thermal conductivity, and the shape and size of the heat dissipation substrate 1 are designed and manufactured according to the needs of different electronic devices. A plurality of conical skirts 11 are provided on one side of the heat dissipation substrate 1 , and each conical skirt 11 is inserted with a heat dissipation pipe 2 , and the heat dissipation pipes 2 are fastened and riveted to the heat dissipation substrate 1 through the conical skirts 11 . The pipe wall of the heat dissipation pipe 2 is provided with a vent hole 21 communicating with the lumen. The heat dissipation pipe 2 shown in the figure is a round pipe, and the vent hole 21 is located at the base of the end where the heat dissipation pipe 2 connects with the heat dissipation substrate 1 , and the edge of the vent hole 21 connects with the tapered skirt 11 . When in use, the radiating pipe 2 with the vent hole 21 has a suction effect similar to a chimney, and the gas flows quickly through the nozzle and the vent hole 21, which can improve the air convection coefficient and heat dissipation capacity of the radiator. In order to further improve the air convection coefficient, a circular ventilation hole 21 can be respectively set on both sides of the heat dissipation pipe 2, so as to improve the air convection capacity in different directions and reduce resistance.

The utility model is suitable for the needs of different electronic heat sinks, and is especially suitable for the application of electronic equipment such as LED street lamps where the heat dissipation pipe 2 faces upwards, and the suction effect of the heat dissipation pipe 2 can be fully exerted.

Claims (4)

1. a kind of electronic heat sink, including heat-radiating substrate (1), it is characterized in that heat-radiating substrate (1) is equipped with heat-dissipating pipe (2), it is described The tube wall of heat-dissipating pipe (2) is equipped with air hole (21).

2. electronic heat sink described in accordance with the claim 1, it is characterized in that the heat-dissipating pipe (2) connects one with heat-radiating substrate (1) The base portion at end is equipped with air hole (21).

3. electronic heat sink according to claim 2, it is characterized in that the heat-dissipating pipe (2) is round tube, root is equipped with one Round air hole (21).

4. electronic heat sink according to claim 1 or 2, it is characterized in that the heat-radiating substrate (1) is convex equipped with taper skirt (11), heat-dissipating pipe (2) one end is plugged in taper skirt convex (11), and is riveted on heat-radiating substrate (1) by taper skirt convex (11).