CN204905286U - COB light source - Google Patents

Abstract

The utility model discloses a COB light source, which comprises a substrate, LED chips and fluorescent glue, wherein the substrate is provided with a solid crystal region, a silica gel dam is arranged on the substrate and positioned at the periphery of the solid crystal region, the LED chips are arranged on the solid crystal region, and the fluorescent glue is packaged on the LED chips positioned in the silica gel dam; more than two through holes extending transversely are arranged in the base plate, the axes of the through holes are parallel to each other, and radiating pipes are inserted into the through holes; the radiating pipe comprises a pipe body and more than two radiating ring pieces arranged on the inner wall of the pipe body, the radiating ring pieces incline towards one direction, and the centers of the radiating ring pieces are provided with ventilation holes. The utility model discloses a structure can improve the radiating efficiency.

Description

A COB light source

technical field

The utility model relates to a COB light source.

Background technique

COB light sources are generally high-power light sources. When high-power COB light sources are working, they will generate a lot of heat. Since the LED chip is encapsulated by fluorescent glue, most of the heat generated by the LED chip needs to be dissipated through the substrate. Currently used in COB The substrates on the light source mainly include aluminum substrates and ceramic substrates, but their heat dissipation performance needs to be improved.

Contents of the invention

In order to improve the heat dissipation efficiency of the COB light source, the utility model provides a COB light source.

In order to achieve the above purpose, a COB light source includes a substrate, an LED chip and a fluorescent glue. The glue is packaged on the LED chip located in the silica gel dam; there are more than two through holes extending transversely in the substrate, the axes of the through holes are parallel to each other, and a heat dissipation pipe is inserted in the through hole; the heat dissipation pipe includes a tube Body and more than two heat dissipation ring fins arranged on the inner wall of the pipe, the heat dissipation ring fins are inclined towards one direction, and the center of the heat dissipation ring fins has a ventilation hole.

In the above structure, since a through hole is opened in the substrate, and a heat dissipation pipe is arranged in the through hole, the distance between the LED chip and the heat dissipation pipe will be reduced, the heat transfer distance of the LED chip will be reduced, and the heat can be transferred quickly. to the heat dissipation pipe; since the heat dissipation pipe is composed of a pipe body and a heat dissipation ring, and the center of the heat dissipation ring has a vent hole, so that when the heat is transferred to the heat dissipation pipe, the area of the heat dissipation pipe is large, and it will form in the heat dissipation pipe. Wind flow is more conducive to taking heat out of the substrate, thereby improving heat dissipation efficiency. Since the heat dissipation rings are inclined in one direction, the air flow resistance in the heat dissipation pipe is small, and heat can be taken away faster, thereby further improving heat dissipation efficiency.

Further, the heat radiating pipes are connected sequentially by more than two pipe joints, each pipe joint includes a pipe joint body and the heat dissipation ring, the heat dissipation ring extends from one end of the pipe joint body to the inside, and the pipe joint The other end of the body has a connector, the inner diameter of the connector is equal to the outer diameter of one end of the pipe joint body, and the end of the pipe joint with the heat dissipation ring is inserted on the connector of the adjacent pipe joint. This structure is convenient for processing the heat dissipation pipe.

Further, grooves extending transversely are provided on the cooling ring. This structure, on the one hand, can increase the heat dissipation area, and on the other hand, can reduce the resistance of the heat dissipation ring to the air flow, thereby further improving the heat dissipation efficiency.

Further, an annular groove is arranged on the periphery of the crystal-bonding area on the substrate, and the lower end of the silica gel dam is arranged in the annular groove. With this structure, when the silicone dam is formed, the upper edge of the annular groove forms a boundary. Therefore, the silicone is not easy to flow out of the annular groove, and it is not easy for the silicone to stay. In addition, the annular groove can also play a role in positioning the silicone dam. The effect makes the position accuracy of the silicone dam higher, and when the silicone dam is formed and solidified, under the action of the side wall of the annular groove, the silicone dam is not easy to shift, so the connection is firm.

Further, the bottom of the annular groove is zigzag, and the bottom of the silicone dam is zigzag matched with the bottom of the annular groove. When molding the silicone dam, since the silicone is fluid before solidification, when the bottom of the annular groove is zigzag, the bottom of the silicone dam will naturally form a zigzag shape, so that the connection area between the bottom of the silicone dam and the bottom of the annular groove increase, the mutual restraining force increases, making the connection between the silicone dam and the substrate more firm and reliable.

Further, the sidewall of the annular groove is zigzag, and the sidewall of the silicone dam corresponding to the sidewall of the annular groove is zigzag. In this structure, the side wall of the zigzag annular groove has a restrictive force on the silicone dam, so the connection between the silicone dam and the base plate is more firm and reliable.

Description of drawings

Figure 1 is a schematic diagram of a COB light source.

Figure 2 is a top view of the COB light source.

Figure 3 is a cross-sectional view of the pipe joint.

Figure 4 is a schematic diagram of the connection of two pipe joints.

Fig. 5 is an enlarged view of A in Fig. 1 .

Detailed ways

The utility model will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

As shown in Figure 1 and Figure 2, the COB light source includes a substrate 1, an LED chip 2, a fluorescent glue 3, a silicone dam 4 and a heat dissipation pipe 5.

In this embodiment, the substrate 1 is an aluminum substrate. The substrate 1 is provided with more than two through holes 11 extending transversely. In the present invention, as shown in FIG. 1 , the transverse direction is the direction of the X axis, and the axes of the through holes 11 are parallel to each other. The substrate 1 has a crystal-bonding region 12 . An annular groove 13 is disposed on the periphery of the crystal-bonding area 12 on the substrate 1 , and the bottom and sidewalls of the annular groove 13 are zigzag-shaped.

As shown in FIG. 1 , the heat dissipation pipe 5 is inserted in the through hole 11 . As shown in Fig. 3 and Fig. 4, the radiating pipe 5 is connected successively by more than two pipe joints 51, and each pipe joint 51 includes a pipe joint body 511 and the described heat dissipation ring sheet 512, and the heat dissipation ring sheet 512 is formed from the pipe joint. One end of the body 511 extends obliquely inwardly, and the other end of the pipe joint body 511 has a connector 513. The inner diameter of the connector 513 is equal to the outer diameter of one end of the pipe joint body 511, and one end of the pipe joint with a cooling ring is inserted in the corresponding On the connecting head adjacent to the pipe section, this structure makes it easy to form the heat dissipation ring piece 512 , and adopts the plug-in structure to facilitate the connection of each pipe section 51 . The outer wall of the middle part of the pipe joint body 511 is provided with a step. In this way, when the pipe joints are plugged and connected, it can be ensured that the outer walls of each pipe joint are on the same circumference. 11 can be in close contact with the inner wall of the through hole to improve the heat transfer efficiency. After all pipe joints 51 are plugged in, all pipe joint bodies form a pipe body, and on the inner wall of the pipe, all heat dissipation rings are inclined in one direction, and the center of heat dissipation rings 512 has a ventilation hole 514, so that a Through air duct. In order to increase the heat dissipation area, a transversely extending groove is arranged on the heat dissipation ring sheet.

In this embodiment, since the through hole 11 is provided in the substrate 1, and the heat dissipation pipe 5 is arranged in the through hole 11, the distance between the LED chip 2 and the heat dissipation pipe 5 will be reduced, and the heat transfer of the LED chip 2 will be reduced. The distance decreases, and its heat can be quickly transferred to the heat dissipation pipe 5; because the heat dissipation pipe 5 is composed of a pipe body and a heat dissipation ring sheet 512, and the center of the heat dissipation ring sheet 512 has a ventilation hole 514, and the heat dissipation ring sheet 512 is provided with a In this way, when the heat is transferred to the heat dissipation pipe 5, the area of the heat dissipation pipe is large, and an airflow will be formed in the heat dissipation pipe 5, which is more conducive to taking the heat out of the substrate 1, thereby improving the heat dissipation efficiency. Since the heat dissipation ring 512 is inclined in one direction and has grooves, the airflow resistance in the heat dissipation pipe 5 is small, and heat can be taken away faster, thereby further improving the heat dissipation efficiency.

Said LED chips 2 are installed in the die-bonding area 12 . The silica gel dam 4 is formed on the annular groove 13. When molding the silica gel dam 4, since the silica gel is fluid before solidification, as shown in Figure 5, when the bottom and side walls of the annular groove 13 are zigzag, the silica gel The bottom of the dam and the side corresponding to the side wall of the annular groove naturally form a zigzag shape, so that the connection area between the silicone dam and the annular groove increases, and a greater restraining force will be generated each other, so that the silicone dam 4 and the substrate 1 connection is more firm and reliable.

The fluorescent glue 3 is packaged in a silicone dam.

Claims (6)

1. a COB light source, comprises substrate, LED chip and fluorescent glue, substrate has crystal bonding area, and substrate is positioned at outside crystal bonding area and is arranged with silica gel box dam, LED chip is located on crystal bonding area, fluorescent glue be encapsulated in be positioned at silica gel box dam LED chip on; It is characterized in that: the through hole being provided with more than two horizontal expansions in substrate, the axis of through hole is parallel to each other, in through hole, be inserted with radiating tube; Described radiating tube comprises body and is located at the heat dissipating ring-blades of more than two on inboard wall of tube body, and heat dissipating ring-blades tilts facing one direction, and the center of heat dissipating ring-blades has ventilation hole.

2. COB light source according to claim 1, it is characterized in that: described radiating tube is connected successively by the above tube coupling of two joints, each tube coupling comprises tube coupling body and described heat dissipating ring-blades, heat dissipating ring-blades extends to the inside from one end of tube coupling body, the other end of tube coupling body has connector, the internal diameter of connector is equal with the external diameter of tube coupling body one end, and the tube coupling one end with heat dissipating ring-blades is plugged on the connector of adjacent tube coupling.

3. COB light source according to claim 1 and 2, is characterized in that: the groove being provided with horizontal expansion on heat dissipating ring-blades.

4. COB light source according to claim 1, is characterized in that: on substrate, be positioned at the outer of crystal bonding area be arranged with cannelure, the lower end of silica gel box dam is arranged in cannelure.

5. COB light source according to claim 4, is characterized in that: the bottom of cannelure is zigzag, and the bottom of silica gel box dam is the zigzag coordinated with annular groove bottom.

6. COB light source according to claim 5, is characterized in that: the sidewall of cannelure is zigzag, and the sidewall that silica gel box dam is corresponding with cannelure sidewall is zigzag.