CN208273342U - A kind of automatically controlled circuit board graphene cooling fin - Google Patents
A kind of automatically controlled circuit board graphene cooling fin Download PDFInfo
- Publication number
- CN208273342U CN208273342U CN201820696298.8U CN201820696298U CN208273342U CN 208273342 U CN208273342 U CN 208273342U CN 201820696298 U CN201820696298 U CN 201820696298U CN 208273342 U CN208273342 U CN 208273342U
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- China
- Prior art keywords
- radiating
- copper
- sheet
- graphene
- copper pipe
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Abstract
The utility model discloses a kind of automatically controlled circuit board graphene cooling fins, including wiring board ontology, radiating copper sheet, graphene nanometer sheet, copper pipe and radiating fin, assist side ontology bottom side is arranged in radiating copper sheet, heat dissipation baffle is provided on the side of wiring board ontology surrounding, several first heat release holes are provided on heat dissipation baffle, graphene nanometer sheet is provided on the upside of radiating copper sheet and on the inside of heat dissipation baffle, radiating copper sheet upper surface is equipped with multiple copper pipes, it is fixedly connected between copper pipe, graphene nanometer sheet lower surface is equipped with arc groove, copper pipe outer surface is bonded with arc groove inner surface, copper pipe bottom is provided with several second heat release holes, radiating copper sheet bottom side is integrally formed with the radiating fin dissipated outward from the center of circle, the center point of radiating fin forms third heat release hole, second heat release hole and radiating fin mutually stagger setting；This kind of automatically controlled circuit board graphene cooling fin greatly improves the radiating efficiency of wiring board by the setting of graphene nanometer sheet.
Description
Technical field
The utility model relates to a kind of cooling fins to be related to more particularly, to a kind of automatically controlled circuit board graphene cooling fin
Kitchenware manufacturing field.
Background technique
As electronic technology develops towards high speed, multi-functional, large capacity and portable low consumption direction, wiring board wiring density is more next
Higher, signaling rate and data transfer also gradually increase, thus electric signal loss be converted into thermal energy and lead to electronics
The case where product generates heat also is increased therewith, if the heat generated cannot shed from wiring board in time, heat is caused to gather, and is easy
There is wiring board or electronic component temperature is excessively high, influence the performance of wiring board, electronic component or damage wiring board are damaged when serious.
Existing automatically controlled circuit board is usually to pass through the area for increasing metal fin or the quantity for increasing radiating fin with cooling fin
It realizes the heat dissipation of wiring board, both increases weight in this way, be also easy to influence the performance of wiring board.
Utility model content
The technical problems to be solved in the utility model is that overcome existing automatically controlled circuit board with cooling fin be usually to pass through increase
The area of metal fin increases the quantity of radiating fin to realize the heat dissipation of wiring board, both increases weight in this way,
It is easy to influence the defect of the performance of wiring board, a kind of automatically controlled circuit board graphene cooling fin is provided, to solve the above problems.
To achieve the above object, the utility model provides the following technical solutions: a kind of automatically controlled circuit board is radiated with graphene
Piece, including wiring board ontology, radiating copper sheet, graphene nanometer sheet, copper pipe and radiating fin, the radiating copper sheet are arranged in route
Plate ontology bottom side is provided with heat dissipation baffle on the side of the wiring board ontology surrounding, is provided on the heat dissipation baffle several
First heat release hole, is provided with graphene nanometer sheet on the upside of the radiating copper sheet and on the inside of heat dissipation baffle, in the radiating copper sheet
Surface is equipped with multiple copper pipes, and the copper pipe is fixedly connected between the copper pipe between graphene nanometer sheet and radiating copper sheet,
The graphene nanometer sheet lower surface is equipped with arc groove, and the copper pipe outer surface is bonded with arc groove inner surface, the copper
Bottom of the tube is provided with several second heat release holes, and the radiating copper sheet bottom side is integrally formed with the heat radiating fin dissipated outward from the center of circle
The center point of piece, the radiating fin forms third heat release hole, and second heat release hole and radiating fin mutually stagger setting.
As a kind of optimal technical scheme of the utility model, heat dissipation channel is formed between the radiating fin.
Graphene nano on piece setting as a kind of optimal technical scheme of the utility model, on the inside of the heat dissipation baffle
There is the through-hole equal with the first heat release hole internal diameter.
As a kind of optimal technical scheme of the utility model, the center of circle of the copper pipe is on same straight line.
As a kind of optimal technical scheme of the utility model, the copper pipe inner surface is equipped with spiral groove.
Compared with prior art, the utility model has the beneficial effects that this kind of automatically controlled circuit board graphene cooling fin, leads to
The setting for crossing graphene nanometer sheet converts heat energy into infrared ray using the special molecular structure of graphene, and then heat is dissipated
Open, greatly improve the radiating efficiency of wiring board, and its heat dissipation effect far more than carbon nanotube, metal nanoparticle and its
His filler has the advantages of more frivolous, easy processing, cost is lower, and the service life is longer, passes through the radiating fin of divergent structure
Setting forms the air-flow to circulate outward, has so that heat is quickly distributed outward by the thermal pathways formed between radiating fin
The radiating efficiency for improving to effect wiring board, by the setting of copper pipe, copper pipe has bigger surface area, is conducive to radiate,
Simultaneously multiple copper pipes side by side can effectively lift structure intensity, pass through the first heat release hole, the second heat release hole and third heat release hole
Setting, further improves radiating efficiency.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is a kind of automatically controlled circuit board graphene heat sink structure illustration described in the utility model；
Fig. 2 is a kind of automatically controlled circuit board graphene cooling fin bottom view described in the utility model；
In figure: 1, wiring board ontology；2, radiate baffle；3, the first heat release hole；4, radiating copper sheet；5, graphene nanometer sheet；
6, copper pipe；7, spiral groove；8, the second heat release hole；9, radiating fin；10, third heat release hole.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment, based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of automatically controlled circuit board graphene cooling fin,
Including wiring board ontology 1, radiating copper sheet 4, graphene nanometer sheet 5, copper pipe 6 and radiating fin 9, radiating copper sheet 4 is arranged in route
1 bottom side of plate ontology is provided with heat dissipation baffle 2 on the side of 1 surrounding of wiring board ontology, is provided with several first on the baffle 2 that radiates
It is provided with graphene nanometer sheet 5 on the inside of heat release hole 3, the upside of radiating copper sheet 4 and heat dissipation baffle 2, graphene nanometer sheet 5 is by thermal energy
Infrared ray is converted to, and then by heat away, 4 upper surface of radiating copper sheet is equipped with multiple copper pipes 6, copper pipe 6 has bigger table
Area is conducive to radiate, and copper pipe 6 is fixedly connected, graphite between graphene nanometer sheet 5 and radiating copper sheet 4 between copper pipe 6
5 lower surface of alkene nanometer sheet is equipped with arc groove, and 6 outer surface of copper pipe is bonded with arc groove inner surface, increases contact area, thus
Heat radiation ability, 6 bottom of copper pipe are provided with several second heat release holes 8, and 4 bottom side of radiating copper sheet is integrally formed with outside from the center of circle
The radiating fin 9 of diverging is formed outside so that heat is quickly distributed outward by the thermal pathways formed between radiating fin 9
The air-flow of circulation effectively improves the radiating efficiency of wiring board, and the center point of radiating fin 9 forms third heat release hole 10, the
Two heat release holes 8 and radiating fin 9 mutually stagger setting.
Heat dissipation channel is formed between radiating fin 9, is provided with and first on the graphene nanometer sheet 5 of 2 inside of heat dissipation baffle
The equal through-hole of 3 internal diameter of heat release hole, on same straight line, 6 inner surface of copper pipe is equipped with spiral groove 7 in the center of circle of copper pipe 6.
Concrete principle: in use, working as wiring board adstante febre, graphene nanometer sheet 5 converts heat energy into infrared ray, and then will
Heat away, while radiating copper sheet 4 and radiating fin 9 transfer heat in air, realize the heat dissipation of wiring board, in addition,
Heat directly can also carry out heat exchange with air by the first heat release hole 3, the second heat release hole 8 and third heat release hole 10, thus
Achieve the purpose that wiring board radiates.
This kind of automatically controlled circuit board graphene cooling fin, it is special using graphene by the setting of graphene nanometer sheet
Molecular structure converts heat energy into infrared ray, and then by heat away, greatly improves the radiating efficiency of wiring board, and
Its heat dissipation effect has more frivolous far more than carbon nanotube, metal nanoparticle and other fillers, and easy processing, cost is lower, makes
The advantages of with longer life expectancy, by the setting of the radiating fin of divergent structure, so that heat is by forming between radiating fin
Thermal pathways quickly distribute outward, form the air-flow to circulate outward, effectively improve the radiating efficiency of wiring board, pass through copper pipe
Setting, copper pipe have bigger surface area, be conducive to radiate, at the same multiple copper pipes side by side can effectively lift structure it is strong
Degree, by the setting of the first heat release hole, the second heat release hole and third heat release hole, further improves radiating efficiency.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of automatically controlled circuit board graphene cooling fin, including wiring board ontology (1), radiating copper sheet (4), graphene nanometer sheet
(5), copper pipe (6) and radiating fin (9), which is characterized in that assist side ontology (1) bottom side, institute is arranged in the radiating copper sheet (4)
It states and is provided with heat dissipation baffle (2) on the side of wiring board ontology (1) surrounding, be provided with several first on the heat dissipation baffle (2)
Heat release hole (3), radiating copper sheet (4) upside and heat dissipation baffle (2) inside are provided with graphene nanometer sheet (5), described to dissipate
Hot copper sheet (4) upper surface is equipped with multiple copper pipes (6), the copper pipe (6) be located at graphene nanometer sheet (5) and radiating copper sheet (4) it
Between, it is fixedly connected between the copper pipe (6), graphene nanometer sheet (5) lower surface is equipped with arc groove, the copper pipe (6)
Outer surface is bonded with arc groove inner surface, and copper pipe (6) bottom is provided with several second heat release holes (8), the radiating copper
Integrally formed with the radiating fin (9) dissipated outward from the center of circle, the center point of the radiating fin (9) forms for piece (4) bottom side
Three heat release holes (10), second heat release hole (8) and radiating fin (9) mutually stagger setting.
2. a kind of automatically controlled circuit board graphene cooling fin according to claim 1, which is characterized in that the radiating fin
(9) heat dissipation channel is formed between.
3. a kind of automatically controlled circuit board graphene cooling fin according to claim 1, which is characterized in that the heat dissipation baffle
(2) through-hole equal with the first heat release hole (3) internal diameter is provided on the graphene nanometer sheet (5) on the inside of.
4. a kind of automatically controlled circuit board graphene cooling fin according to claim 1, which is characterized in that the copper pipe (6)
The center of circle on same straight line.
5. a kind of automatically controlled circuit board graphene cooling fin according to claim 1, which is characterized in that the copper pipe (6)
Inner surface is equipped with spiral groove (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820696298.8U CN208273342U (en) | 2018-05-10 | 2018-05-10 | A kind of automatically controlled circuit board graphene cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820696298.8U CN208273342U (en) | 2018-05-10 | 2018-05-10 | A kind of automatically controlled circuit board graphene cooling fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208273342U true CN208273342U (en) | 2018-12-21 |
Family
ID=64681108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820696298.8U Expired - Fee Related CN208273342U (en) | 2018-05-10 | 2018-05-10 | A kind of automatically controlled circuit board graphene cooling fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208273342U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513518A (en) * | 2018-06-26 | 2018-09-07 | 江苏亚飞炭素有限公司 | A kind of automatically controlled circuit board graphene cooling fin |
-
2018
- 2018-05-10 CN CN201820696298.8U patent/CN208273342U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513518A (en) * | 2018-06-26 | 2018-09-07 | 江苏亚飞炭素有限公司 | A kind of automatically controlled circuit board graphene cooling fin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181221 Termination date: 20190510 |