CN205945672U - Chip interconnection packaging structure of integrated surface acoustic wave filter subassembly - Google Patents

Abstract

The utility model provides a chip interconnection packaging structure of integrated surface acoustic wave filter subassembly, includes module board, integrated surface acoustic wave filter core assembly piece, the solder post, and the sound absorption is sealed glues. The top surface preparation of module board chip interconnection district and integrated surface acoustic wave filter core assembly piece electrode pair should and the interconnection signal electrode and the interconnection telluric electricity field that link to each other with the subassembly circuit, the module board chip interconnection district back is the metal film ground plane, and is continuous through metal hole and top surface telluric electricity field. Interconnection when encapsulation, each interconnection electrode in module board chip interconnection district is through placing the solder post on it in, aims at and is connected with the counter electrode of integrated surface acoustic wave filter core assembly piece, and sealed glue of sound absorption covers integrated surface acoustic wave filter core assembly piece to seal the space between chip and the module board. The utility model discloses connect the interconnection and adopt the sound absorption to glue the fixed seal surface acoustic wave filter core assembly piece stiff and straight, compact structure, little, the simple process of radio frequency loss, the preparation is convenient.

Description

A Chip Interconnect Packaging Structure for Integrated Surface Acoustic Wave Filter Components

technical field

The utility model relates to the technical field of surface acoustic waves, in particular to an internal connection packaging structure of integrated surface acoustic wave filter component chips.

Background technique

The surface acoustic wave device is composed of multiple interdigital transducers fabricated on a piezoelectric substrate. The input interdigital transducer converts the input electrical signal into an acoustic signal through the inverse piezoelectric effect, and the acoustic signal propagates along the surface of the substrate, and then The output interdigital transducer converts the acoustic signal into an electrical signal output through the piezoelectric effect, and realizes signal processing in two conversions.

In the existing technology and application, each filter chip of the surface acoustic wave filter component is packaged independently, and the internal connection method of the chip in the package is mainly silicon-aluminum wire bonding, that is, the silicon-aluminum wire is connected to the chip electrode and the chip electrode respectively by ultrasonic pressure welding. The electrode bonding on the package base, and the corresponding external connection and packaging method are patch-type plastic packaging or pin-type metal packaging. The resulting shortcomings are that the internal and external connections of radio frequency are long and complex, which is not conducive to the integration of surface acoustic wave devices, and the radio frequency loss is large, and the anti-interference performance is poor. In order to facilitate the integration and miniaturization of the surface acoustic wave filter components, it is required to realize the on-board connection and packaging of the chip.

Utility model content

The purpose of the utility model is to overcome the deficiencies in the prior art, and provide a chip interconnection packaging structure with small radio frequency loss and compact interconnection structure, which is specially used for integrating surface acoustic wave filter components.

The purpose of this utility model is achieved through the following technical solutions, a chip interconnection packaging structure of an integrated surface acoustic wave filter assembly, including:

Fabricate multiple juxtaposed interdigital transducer pairs and alternately arranged signal electrodes and ground electrodes on a single piezoelectric substrate to form an integrated surface acoustic wave filter chip;

The high-frequency double-sided copper-clad organic substrate is used to make the surface acoustic wave filter component substrate, and the chip interconnection area is made on the front of the component substrate. The chip interconnection area is made with interconnection electrodes corresponding to the chip electrodes of the integrated surface acoustic wave filter group, including The internal connection signal electrode and the internal connection ground electrode, the back of the chip internal connection area of the component substrate is a metal film ground plane, the internal connection signal electrode of the chip internal connection area is connected to the component circuit signal line, and the internal connection ground electrode of the chip internal connection area The hole is connected to the ground plane of the metal film on the back;

During interconnection packaging, place a solder column on the interconnection electrode in the chip interconnection area of the component substrate. The chip is turned over on the solder column and the chip electrode is aligned with the corresponding interconnection electrode in the chip interconnection area. Heat the solder column Welding with the upper and lower electrodes;

The sound-absorbing sealant is poured to cover the chip of the integrated surface acoustic wave filter group and seal the gap between the chip and the component substrate.

Compared with the prior art, the utility model has the following beneficial effects:

The utility model directly interconnects and packages the integrated surface acoustic wave filter group chip on the substrate of the surface acoustic wave filter component, adopts the method of overturning the chip with solder column for internal connection of the chip, and uses sound-absorbing glue to fix and seal the chip on the board , at the same time play the role of absorbing surface acoustic wave reflection wave and bulk acoustic wave on the end surface and bottom surface of the chip. The utility model has the advantages of compact interconnection structure, low radio frequency loss, strong anti-interference ability, simple process and convenient manufacture.

Description of drawings

Fig. 1 is the utility model integrated surface acoustic wave filter group chip interdigital transducer, the schematic diagram of chip electrode structure;

Fig. 2 is a schematic diagram of the layout of the chip interconnection area and the assembly circuit area on the top surface of the component substrate of the utility model;

Fig. 3 is a schematic diagram of the electrode structure of the interconnection area of the component substrate chip of the utility model;

Fig. 4 is a sectional view of the overall structure of the utility model along the direction A-A in Fig. 2 .

In the figure: component substrate 1, integrated 4-channel surface acoustic wave filter group chip 2, solder column 3, sound-absorbing sealant 4, chip interconnection area 11, component circuit 12, copper film ground plane 13, interconnection signal electrode 111 , the internal connection ground electrode 112 , the metal hole 113 , the IDT pair 22 , the chip signal electrode 23 , and the chip ground electrode 24 .

detailed description

The utility model will be further described in detail below in conjunction with the accompanying drawings and the specific embodiment of the integrated 4-channel surface acoustic wave filter assembly.

Example:

As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the chip interconnection package structure of the integrated 4-channel surface acoustic wave filter component includes the component substrate 1, the integrated 4-channel surface acoustic wave filter chip 2, and the solder column 3 , sound-absorbing sealant 4;

On the piezoelectric substrate 21, 4 juxtaposed interdigital transducer pairs 22, 4 pairs of alternately arranged chip signal electrodes 23 and chip ground electrodes 24 are formed to form an integrated surface acoustic wave filter group chip 2, and the piezoelectric substrate The sheet material is quartz single crystal or lithium niobate single crystal or lithium tantalate single crystal;

FR-4 double-sided copper-clad organic substrate is used to make component substrate 1, and the front side of component substrate 1 includes component circuit 12 and chip interconnection area 11, and the chip interconnection area 11 is made to correspond to integrated 4-channel surface acoustic wave filter group chip 2 Copper film interconnection electrodes, including 8 interconnection signal electrodes 111 and 8 interconnection ground electrodes 112, a copper film ground plane 13 is made on the back of the chip interconnection area 11 of the component substrate, and the interconnection signal electrodes 111 of the chip interconnection area 11 Correspondingly connected to the signal line of the component circuit 12, the internal connection ground electrode 112 is connected to the copper film ground plane 13 on the back of the chip internal connection area 11 through the metal hole 113;

When the chip is interconnected and packaged, solder columns 3 are placed on the 8 interconnected signal electrodes 111 and 8 interconnected ground electrodes 112 in the chip interconnected area 11 of the component substrate, and the integrated 4-channel surface acoustic wave filter group chip 2 is turned upside down. On the solder column 3, the 8 signal electrodes 23 and the 8 ground electrodes 24 of the chip are respectively connected to the solder columns on the corresponding 8 internal connection signal electrodes 111 and 8 internal connection ground electrodes 112 on the component substrate chip internal connection area 11 3 Alignment and bonding, heating to weld the solder column 3 with the upper and lower electrodes;

The sound-absorbing sealant 4 is poured to cover the chip 2 of the integrated surface acoustic wave filter group, and the gap between the chip 2 and the component substrate 1 is closed.

Those skilled in the art will appreciate that, although specific embodiments have been described herein for purposes of explanation, various changes may be made without departing from the spirit and scope of the invention. Accordingly, nothing should be taken to limit the invention, except as by the appended claims.

Claims (3)

1. connect encapsulating structure in a kind of chip of integrated SAW filter assembly it is characterised in that：Including module board （1）, integrated SAW filter group chip（2）, solder post（3）, sound absorption fluid sealant（4）；

Described module board（1）Including assembly circuit（12）With chip Nei Lian area（11）, module board chip Nei Lian area（11）Just Face makes to be had and integrated SAW filter group chip（2）The corresponding interior even signal electrode of electrode（111）Connect ground electricity with interior Pole（112）, module board chip Nei Lian area（11）The back side is metal film ground plane（13）, chip Nei Lian area（11）Inside connect signal Electrode（111）With module board（1）Assembly circuit（12）Holding wire corresponding be connected, interior connection ground electrode（112）By metal Hole（113）With described metal film ground plane（13）It is connected；

Described integrated SAW filter group chip（2）Including piezoelectric substrate（21）, piezoelectric substrate（21）Upper setting some Individual juxtaposed interdigital transducer pair（22）, the signal electrode that is arranged alternately（23）And ground electrode（24）, integrated surface acoustic wave filter Ripple device group chip（2）Each signal electrode（23）With module board chip Nei Lian area（11）On corresponding interior even signal electrode （111）By solder post（3）It is aligned and be connected, integrated SAW filter group chip（2）Each ground electrode（24） With module board chip Nei Lian area（11）On corresponding interior connection ground electrode（112）By solder post（3）It is aligned and be connected；

Sound absorption fluid sealant（4）Cover integrated SAW filter group chip（2）And close integrated SAW filter group core Piece（2）With module board（1）Between space.

2. connect encapsulating structure in a kind of chip of integrated SAW filter assembly according to claim 1, its feature It is, described piezoelectric substrate（21）Material is single crystal quartz or lithium niobate monocrystal or monocrystalline lithium tantalate.

3. connect encapsulating structure in a kind of chip of integrated SAW filter assembly according to claim 1, its feature It is, described module board（1）Made using double-side copper-applying high frequency organic substrate.