CN203482165U - SAW Filter Integrated Package Structure - Google Patents

Abstract

An integrated packaging structure of a surface acoustic wave filter belongs to the technical field of surface acoustic waves. The integrated packaging structure comprises a surface acoustic wave filter chip, a matching tuning circuit and a packaging shell. The packaging shell is composed of a packaging base, outer pins of the packaging base, and a sealing cap covering the packaging base. The integrated packaging structure is characterized in that a tuning substrate is arranged, the matching tuning circuit is manufactured on the tuning substrate, the surface acoustic wave filter chip is adhered to the tuning substrate and is electrically connected with the matching tuning circuit through a bonding wire, and the tuning substrate is adhered to the packaging base and is electrically connected with the outer pins of the packaging base through bonding wires. According to the integrated packaging structure, the surface acoustic wave filter chip and the matching tuning circuit are integrated and packaged in a same packaging body so that the structure of interconnection of the surface acoustic wave filter chip, the matching tuning circuit and an application circuit is simplified. Consequently, the integrated packaging structure has the advantages of compact structure, small loss, strong anti-jamming capability and the like. The overall performance of a surface acoustic wave filter application system can be improved.

Description

SAW Filter Integrated Package Structure

technical field

The utility model relates to an electronic package structure, in particular to an integrated package structure of a surface acoustic wave filter, belonging to the technical field of surface acoustic waves.

Background technique

When the surface acoustic wave filter is connected to the application circuit, it is often necessary to set a tuning circuit between it and the front and rear circuits to achieve the matching of the electrical parameters between the device and the front and rear circuits, so as to exert the best performance of the surface acoustic wave filter. performance. The surface acoustic wave filter in the prior art generally adopts an independent packaging method, that is, each filter chip is placed in a package shell separately, and the matching tuning circuit is arranged outside the device package. The disadvantages brought about by this are The structure of the interconnection between the SAW filter and the external matching tuning circuit is relatively complex, the loss is large, and the anti-interference ability is poor, which will have a significant adverse effect on the overall performance of the SAW filter application system.

Utility model content

The purpose of this utility model is to solve the above-mentioned deficiencies in the prior art, to overcome the prior art in which the surface acoustic wave filter chip and the matching tuning circuit are placed separately inside and outside the package, the interconnection wire structure is complicated, the loss is large, and the anti-interference ability is poor. Furthermore, the shortcomings that have an obvious adverse effect on the overall performance of the surface acoustic wave filter application system provide an integrated packaging structure for the surface acoustic wave filter.

The purpose of this utility model is achieved through the following technical solutions: the integrated packaging structure of the surface acoustic wave filter, including the surface acoustic wave filter chip, the matching and tuning circuit electrically connected with the surface acoustic wave filter chip and the package shell, the package shell consists of The packaging base, the outer pins of the packaging base, and the sealing cap are formed. The sealing cap is covered on the packaging base. It is characterized in that a tuning substrate is provided, and the tuning substrate is arranged in the packaging shell. The matching tuning circuit is made on the tuning substrate. above; the surface acoustic wave filter chip is bonded on the tuning substrate, and is electrically connected with the matching tuning circuit through the bonding wire; Pins are electrically connected.

The tuning substrate is a high-frequency double-sided printed circuit board, the middle area of the front is a chip bonding area, a matching tuning circuit is arranged in the peripheral area of the front, and a large-area grounded metal film is arranged on the back; the surface acoustic wave filter The chip is bonded in the chip bonding area, and the ground electrode of the chip bonding area and the ground electrode of the matching tuning circuit are respectively electrically connected to the ground metal film through the via holes on the tuning substrate, and the ground metal film is connected to the package base through conductive silver glue Electrical connections.

The bonding wires include signal bonding wires and grounding bonding wires, and the signal bonding wires are sequentially connected to the signal electrodes of the surface acoustic wave filter chip and the signal electrodes of the matching tuning circuit and the signal electrodes of the matching tuning circuit and the outer surface of the package base. pin; the ground bonding wire connects the ground electrode of the surface acoustic wave filter chip and the ground electrode of the chip bonding area.

The utility model integrates the surface acoustic wave filter chip and the matching tuning circuit into the same packaging body, simplifies the interconnection structure between the surface acoustic wave filter chip, the matching tuning circuit and the application circuit, has compact structure, small loss, The advantages of strong anti-interference ability are helpful to improve the overall performance of the surface acoustic wave filter application system. The manufacturing method of the integrated packaging structure involved is compatible with the processing technology of conventional surface acoustic wave filters and their application circuits, and is easy to realize synchronously.

Description of drawings

Fig. 1 is the overall structural representation of the utility model;

Fig. 2 is a schematic structural diagram of the tuning substrate in Fig. 1;

Fig. 3 is a schematic structural view of the utility model for packaging a single surface acoustic wave filter chip;

Fig. 4 is a structural schematic diagram of the utility model for packaging a monolithic integrated surface acoustic wave filter group chip;

In the figure: 1 surface acoustic wave filter chip, 11 single surface acoustic wave filter chip, 12 monolithic integrated surface acoustic wave filter group chip, 101 chip signal electrode, 102 chip ground electrode, 2 tuning substrate, 21 chip bonding area, 22 matching tuning circuit, 23 via hole, 24 grounding metal film, 201 matching tuning circuit signal electrode, 202 matching tuning circuit ground electrode, 203 chip bonding area ground electrode, 3 bonding wire, 31 signal bonding wire, 32 Ground Bond Lead, 4 Package Base, 41 Outer Pins of Package Base, 5 Caps.

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment the utility model is further described:

Example 1

The surface acoustic wave filter integrated packaging structure includes a surface acoustic wave filter chip 1, a matching tuning circuit 22 electrically connected to the surface acoustic wave filter chip, and a package shell, the package shell is composed of a package base 4 and an outer pin 41 of the package base 1. The sealing cap 5 is formed, and the sealing cap is covered on the packaging base.

A tuning substrate 2 is provided, and the tuning substrate is arranged in the package shell. The tuning substrate is a high-frequency double-sided printed circuit board. A large-area grounded metal film 24 is provided on the back.

The matching tuning circuit 22 is fabricated on the tuning substrate, and the surface acoustic wave filter chip is glued on the chip bonding area. The bonding wires include signal bonding wires 31 and grounding bonding wires 32, and the signal bonding wires are sequentially connected to the signal electrodes 101 of the surface acoustic wave filter chip and the signal electrodes 201 of the matching tuning circuit and the signal electrodes 201 of the matching tuning circuit and the package The outer pin 41 of the base.

The ground bonding wire connects the ground electrode 102 of the surface acoustic wave filter chip and the ground electrode 203 of the chip bonding area. The ground electrode 203 of the die bonding area and the ground electrode 202 of the matching tuning circuit are respectively electrically connected to the ground metal film 24 through the via hole 23 on the tuning substrate, and the ground metal film is electrically connected to the package base 4 through conductive silver glue.

Example 2

This embodiment is an integrated package of a single surface acoustic wave filter chip and a matching tuning circuit for a single channel filter.

The surface acoustic wave filter integrated packaging structure includes a single surface acoustic wave filter chip 11, a single channel filter matching and tuning circuit 22 electrically connected to the single surface acoustic wave filter chip, and a packaging shell. The packaging shell is composed of a packaging base 4, outer pins 41 of the packaging base, and a sealing cap 5, and the sealing cap covers the packaging base.

A tuning substrate 2 is provided, the middle area of the front is a chip bonding area 21, a single-channel filter matching tuning circuit 22 is provided in the peripheral area of the front, a large-area grounded metal film 24 is provided on the back, and the tuning substrate 2 is arranged in the packaging shell , the single-channel filter matching tuning circuit 22 is arranged on the tuning substrate.

The mono surface wave filter chip 11 is bonded to the chip bonding area 21 in the middle of the tuning substrate 2 , and the tuning substrate 2 is bonded to the packaging base 4 and covered with a sealing cap 5 .

As shown in Fig. 2 and Fig. 3, the bonding wire 31 is sequentially connected to the chip signal electrode 101 and the matching tuning circuit signal electrode 201 and the matching tuning circuit signal electrode 201 and the outer pin 41 of the package base 4, and the bonding wire 32 is connected to the chip ground The electrode 102 and the electrode 203 of the chip bonding area; the electrode 203 of the chip bonding area and the electrode 202 of the matching tuning circuit are connected to the ground metal film 24 on the back of the tuning substrate through the via hole 23, and the ground metal film 24 on the back of the tuning substrate is passed through the conductive silver glue It is electrically connected with the package base 4 .

In this embodiment, the surface acoustic wave filter chip is a 144.45MHz surface acoustic wave filter made on a 128°Y-X lithium niobate piezoelectric single crystal substrate, and the material of the tuning substrate is high-frequency FR4 epoxy coated with copper on both sides. Glass fiber substrate, chip adhesive is BS-6600K type sticky red adhesive, substrate adhesive is A6/HA6 type conductive silver adhesive, package base and sealing cap are SF-4 full Copper Package Kit.

Example 3

This embodiment is an integrated packaging of a monolithic surface acoustic wave filter group chip and a multi-channel filter matching and tuning circuit.

The surface acoustic wave filter integrated packaging structure includes a monolithic integrated surface acoustic wave filter group chip 12, a multi-channel filter matching and tuning circuit 22 electrically connected to the surface acoustic wave filter chip, and a packaging shell. The packaging shell is composed of a packaging base 4, outer pins 41 of the packaging base, and a sealing cap 5, and the sealing cap covers the packaging base.

A tuning substrate 2 is provided, the middle area of the front is a chip bonding area 21, a multi-channel filter matching tuning circuit 22 is provided in the peripheral area of the front, a large-area grounded metal film 24 is provided on the back, and the tuning substrate 2 is arranged in the packaging shell , the multi-channel filter matching and tuning circuit 22 is arranged on the tuning substrate.

As shown in FIG. 1 , the monolithic integrated surface acoustic wave filter group chip 12 is bonded to the chip bonding area 21 in the middle of the tuning substrate 2 , the tuning substrate 2 is bonded to the packaging base 4 , and finally covered with a sealing cap 5 .

As shown in Figure 2 and Figure 4, the bonding wires 31 are sequentially connected to the signal electrodes 101 of the filters on the chip and the corresponding matching tuning circuit signal electrodes 201, and the matching tuning circuit electrodes 201 of each channel and the corresponding external leads of the package base. The pin 41 and the bonding wire 32 are connected to the ground electrodes 102 of the filters on the chip and the ground electrodes 203 of the chip bonding area, and the ground electrodes 203 of the chip bonding area and the ground electrodes 202 of each matching tuning circuit are grounded to the back of the tuning substrate through the via hole 23 The metal film 24 is connected, and the ground metal film 24 on the back of the tuning substrate is electrically connected to the package base 4 through conductive silver glue.

In this embodiment, the surface acoustic wave filter chip is a monolithically integrated 4-channel surface acoustic wave filter bank made on a ST quartz piezoelectric single crystal substrate, and its center frequencies are 201.00MHz, 201.25MHz, 201.50MHz and 201.75MHz respectively. MHz, the material of the tuning substrate is double-sided copper-coated high-frequency FR4 epoxy glass fiber substrate, the chip adhesive is BS-6600K type sticky red glue, the substrate adhesive is A6/HA6 type conductive silver glue, and the package base The base and cap are an SF-10 all-copper package kit with 10 external leads.

Claims (3)

1. An integrated packaging structure for a surface acoustic wave filter, comprising a surface acoustic wave filter chip (1), a matching tuning circuit (22) electrically connected to the surface acoustic wave filter chip, and a package shell, the package shell is composed of a package base ( 4), the outer pin (41) of the package base and the sealing cap (5), the sealing cap covers the package base, and it is characterized in that a tuning substrate (2) is provided, and the tuning substrate (2) is arranged on the package Inside the shell, the matching tuning circuit (22) is made on the tuning substrate; the surface acoustic wave filter chip is glued on the tuning substrate, and is electrically connected to the matching tuning circuit through the bonding wire (3); the tuning The substrate is glued on the package base and is electrically connected with the outer pins of the package base through bonding wires. 2. The surface acoustic wave filter integrated packaging structure according to claim 1, characterized in that the tuning substrate is a high-frequency double-sided printed circuit board, and the middle area of the front side is a chip bonding area (21), which A matching tuning circuit (22) is provided in the peripheral area of the front, and a large-area grounded metal film (24) is provided on the back; the surface acoustic wave filter chip is bonded to the chip bonding area, and the ground electrode of the chip bonding area ( 203) and the ground electrode (202) of the matching tuning circuit are respectively electrically connected to the ground metal film (24) through the via hole (23) on the tuning substrate, and the ground metal film is electrically connected to the package base (4) through conductive silver glue. 3. The surface acoustic wave filter integrated package structure according to claim 1 or 2, characterized in that the bonding wires include signal bonding wires (31), grounding bonding wires (32), signal bonding wires sequentially connect the signal electrode (101) of the surface acoustic wave filter chip and the signal electrode (201) of the matching tuning circuit and the signal electrode (201) of the matching tuning circuit and the outer pin (41) of the package base; the ground bonding The lead wire is connected to the ground electrode (102) of the surface acoustic wave filter chip and the ground electrode (203) of the chip bonding area.

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