CN206041948U - A Chip Type Packaging Structure for Surface Acoustic Wave Devices - Google Patents

Abstract

The utility model provides a surface acoustic wave device inserted sheet formula packaging structure, is including encapsulation bottom plate, packaging cover plate, surface acoustic wave device chip, shell. Encapsulate bottom plate upper end die bonding bonding region preparation chip bonded electrode, encapsulation bottom plate lower extreme preparation contact pin electrode encapsulates bottom plate middle part preparation metal film input/output wire, and both ends correspond connects chip bonded electrode and contact pin electrode, and packaging cover plate upper portion makes the chip slot of break -over, corresponding to the die bonding bonding region on encapsulation bottom plate upper portion. During the encapsulation, the die bonding is at encapsulation bottom plate die bonding bonding region, and the chip electrode is connected and the chip bonded electrode of the die bonding bonding region that corresponds to the bonded intraconnection track, and the packaging cover plate that adheres installs the shell. The utility model discloses avoid conventional surface acoustic wave device in board welding installation mode, higher soldering temperature is to piezoelectric type device performance's adverse effect, and be convenient for the component test, change debugging, maintenance.

Description

A Chip Type Packaging Structure for Surface Acoustic Wave Devices

technical field

The utility model relates to a packaging structure of a surface acoustic wave device, which belongs to the technical field of electronic device packaging.

Background technique

The interdigital transducer fabricated on the surface of the piezoelectric single chip excites and receives the surface acoustic wave to realize electro-acoustic and acoustic-electric conversion, and the surface acoustic wave device completes the functions of frequency stabilization and filtering of radio frequency signals. The packaging methods of various surface acoustic wave devices in the prior art and applications are mostly surface-mounted plastic packages, pin-type metal packages or plastic packages, and their installation methods in application systems are mainly on-board welding. The resistance is small, but the disadvantage is that because the single chip of the surface acoustic wave device is a temperature-sensitive piezoelectric material, the higher welding temperature will affect the performance of the device, and the device is not easy to replace and test in the application system. It brings difficulties to the debugging and maintenance of the system.

Utility model content

The purpose of the utility model is to overcome the deficiencies in the prior art and provide a pluggable surface acoustic wave device chip packaging structure. High soldering temperature has an adverse effect on the performance of piezoelectric devices, and it is convenient for component testing, replacement, debugging and maintenance.

The purpose of this utility model is achieved through the following technical solutions: a surface acoustic wave device plug-in packaging structure, which is characterized in that it includes a package bottom plate, a package cover plate, a surface acoustic wave device chip, and a shell; the shell is from top to bottom Set the package cover plate and the package bottom plate in turn;

The upper part of the package base plate is the chip bonding area, and chip bonding electrodes are made in the chip bonding area, including input and output signal bonding electrodes and grounding bonding electrodes, and the lower part of the package base plate is made with pin electrodes, including input and output Signal pin electrodes and ground pin electrodes, the metal film input and output wires are made in the middle of the package bottom plate, including input and output signal wires and ground wires, the input and output signal wires are respectively connected to the input and output signal bonding electrodes and signal pin electrodes, and the ground wires are respectively Connect the ground bonding electrode and the ground pin electrode;

A through chip slot is made on the top of the package cover, and the chip slot corresponds to the chip bonding area on the top of the package bottom plate;

The chip of the surface acoustic wave device is bonded above the chip bonding area of the package bottom plate and located in the chip groove of the package cover plate.

Preferably, several inner leads are bonded between the chip of the surface acoustic wave device and the chip bonding area of the packaging substrate, and the chip electrodes are respectively connected to the input and output signal bonding electrodes and the bonding area of the chip bonding area through the inner leads. Ground bonding electrode.

Preferably, the package bottom plate and the package cover plate are adhesively connected.

Preferably, the packaging bottom plate is made of a high-frequency single-sided copper-clad organic substrate or a ceramic substrate or an LTCC substrate.

Preferably, the packaging cover plate is made of a high-frequency single-sided copper-clad organic substrate or a ceramic substrate or an LTCC substrate.

Preferably, the inner lead is made of silicon-aluminum wire or gold wire.

Preferably, the material of the shell is a grounded metal sleeve or a heat-shrinkable plastic tube.

Compared with the prior art, the present invention has the following beneficial effects:

The high-frequency single-sided copper-clad organic substrate is used to make the packaging bottom plate, and the chip-bonding electrode is made on the upper copper-clad surface of the substrate to form the chip bonding bonding area, and the pin electrode, the chip-bonding electrode and the socket are made on the lower part of the substrate copper-clad surface. The needle electrodes include input and output signal electrodes and ground electrodes. The metal film input and output wires are made in the middle of the copper-clad surface of the substrate. The ground electrode of the bonding electrode and the ground electrode of the pin electrode;

Use the same organic material as the package bottom plate to make the package cover plate, and make a through chip slot on the top of the package cover plate, corresponding to the chip bonding area on the top of the package bottom plate;

During packaging, the chip is bonded to the chip bonding area of the package bottom plate, the inner lead is bonded, and the chip bonding electrode corresponding to the chip electrode and the chip bonding area is bonded, and the package cover is bonded so that the chip is located in the chip groove , to install the shell.

The utility model uses one end of the packaging substrate to make pin electrodes, and connects them with the chip electrodes through the metal film input and output wires, chip bonding electrodes, and inner leads to form a pluggable surface acoustic wave device plug-in type The packaging structure avoids the adverse effect of high welding temperature on the performance of piezoelectric devices in the conventional surface acoustic wave device installation method on the board, and is convenient for component testing, replacement, debugging and maintenance.

Description of drawings

Fig. 1 is a schematic structural view of the chip package base plate of the present invention and the chip bonding electrode, the metal film input and output wire, and the pin electrode made on it in the chip bonding area;

Fig. 2 is a structural top view of the utility model when the shell is not installed;

Fig. 3 a is a sectional view along A-A direction in Fig. 2;

(Note: Figures 1, 3a, and 3b have been supplemented and revised.)

Fig. 3b is a sectional view along the B-B direction in Fig. 2;

Figure 4 is a three-dimensional perspective view of the overall structure of the utility model.

In the figure: package base plate 1, chip bonding area 11, input and output signal bonding electrodes 111, ground bonding electrodes 112, signal pin electrodes 121, ground pin electrodes 122, input and output signal wires 131, ground wires 132 , package cover 2 , chip slot 21 , chip 3 , adhesive 4 , shell 5 .

detailed description

Below in conjunction with accompanying drawing and specific embodiment the utility model is described in further detail.

Example:

As shown in Fig. 1, Fig. 2, Fig. 3a, Fig. 3b and Fig. 4, a surface acoustic wave device plug-in package structure is characterized in that it includes a package bottom plate 1, a package cover plate 2, and a surface acoustic wave device chip 3 1. A casing 5; a packaging cover 2 and a packaging bottom 1 are sequentially arranged in the casing 5 from top to bottom.

The upper end of the packaging base 1 is a chip bonding area 11, and chip bonding electrodes are formed in the chip bonding area 11, including input and output signal bonding electrodes 111 and grounding bonding electrodes 112. The lower end of the packaging base 1 is formed with a plug Pin electrodes, including input and output signal pin electrodes 121 and grounding pin electrodes 122, metal film input and output wires are made in the middle of the package bottom plate, including input and output signal wires 131 and ground wires 132, and the input and output signal wires 131 are respectively connected to the input and output signal keys The bonding electrode 111 and the signal pin electrode 121 , and the ground wire 132 are respectively connected to the ground bonding electrode 112 and the ground pin electrode 122 .

A penetrating chip groove 21 is made on the upper part of the package cover plate 2 , and the chip groove 21 corresponds to the chip bonding area 11 on the upper part of the package bottom plate.

The surface acoustic wave device chip 3 is bonded above the chip bonding area 11 of the package bottom plate 1 and located in the chip groove 21 of the package cover plate 2 .

Several inner leads 6 are bonded between the surface acoustic wave device chip 3 and the chip bonding region 11 of the package substrate, and the chip electrodes are respectively connected to the input and output signal bonding electrodes 111 of the chip bonding region 11 through the inner leads 6 and ground bonding electrode 112 .

The package bottom plate 1 and the package cover plate 2 are adhesively connected.

The packaging bottom plate 1 is made of a high-frequency single-sided copper-clad organic substrate or a ceramic substrate or an LTCC substrate.

The packaging cover plate 2 is made of a high-frequency single-sided copper-clad organic substrate or a ceramic substrate or an LTCC substrate.

The inner lead wire 6 is made of silicon-aluminum wire or gold wire.

The shell 5 is made of a grounded metal sleeve or a heat-shrinkable plastic tube.

A chip-type packaging method for a surface acoustic wave device, the specific implementation steps are:

(1) Use FR-4 single-sided copper-clad high-frequency organic substrate to make package base plate 1, and make copper film chip bonding electrodes on the top of the copper-clad surface of the substrate, including input and output signal bonding electrodes 111 and ground bonding electrodes 112, forming chip bonding In the bonding area 11, copper film pin electrodes are made on the lower part of the copper clad surface of the substrate, including signal pin electrodes 121 and ground pin electrodes 122, and copper film input and output wires are made in the middle of the copper clad surface of the substrate, including input and output signal wires 131 and grounding pin electrodes. The wires 132, the input and output signal wires 131 are respectively connected to the input and output signal bonding electrodes 111 and the signal pin electrodes 121, and the ground wires 132 are respectively connected to the ground bonding electrodes 112 and the ground pin electrodes 122;

(2) The package cover plate 2 is made of the same organic dielectric material as the package base plate 1, and there is no copper film structure on the surface of the substrate, and the chip groove 21 is made through on the upper part of the package cover plate, corresponding to the chip bonding bonding area 11 on the upper part of the package base plate;

(3) During packaging, the chip 3 is bonded to the chip bonding area 11 of the package bottom plate with the adhesive 4, and the inner lead 6 of the silicon-aluminum wire is bonded to correspond to the chip bonding electrode connecting the chip electrode and the chip bonding area. Close the package cover plate 2 so that the chip 3 is located in the chip groove 21;

(4) Install the shell 5, which can be a grounded metal sleeve or a heat-shrinkable plastic tube.

Those skilled in the art will appreciate that, although specific embodiments have been described herein for purposes of explanation, various changes can be made without departing from the spirit and scope of the invention. Accordingly, nothing should be taken to limit the invention, except as by the appended claims.

Claims (7)

1. a kind of SAW device blade inserting encapsulating structure, it is characterised in that：Including package floor（1）, encapsulation cover plate（2）、 SAW device chip（3）, shell（5）；Shell（5）Encapsulation cover plate is set gradually from top to bottom inside（2）, package floor（1）；

Package floor（1）Upper end is die bonding bonding region（11）, die bonding bonding region（11）Interior making has chip bonding electricity Pole, including input/output signal bonding electrode（111）With ground connection bonding electrode（112）, package floor（1）Lower end makes contact pin Electrode, including input/output signal contact pin electrode（121）With ground connection contact pin electrode（122）, in the middle part of package floor, make metal film Input and output wire, including input/output signal wire（131）And earth lead（132）, input/output signal wire（131）Point Lian Jie not input/output signal bonding electrode（111）With signal pin electrode（121）, earth lead（132）Connection respectively is grounded Bonding electrode（112）With ground connection contact pin electrode（122）；

Encapsulation cover plate（2）Top makes the chip slot of break-through（21）, chip slot（21）Glue corresponding to the chip on package floor top Connect bonding region（11）；

SAW device chip（3）It is bonded in package floor（1）Die bonding bonding region（11）Top is simultaneously located at encapsulation cover plate （2）Chip slot（21）It is interior.

2. a kind of SAW device blade inserting encapsulating structure according to claim 1, it is characterised in that：The sound surface Wave device chip（3）With package floor die bonding bonding region（11）Between be bonded several leads（6）, chip electrode difference By lead（6）Correspondence connection die bonding bonding region（11）Input/output signal bonding electrode（111）With ground connection bonding Electrode（112）.

3. SAW device blade inserting encapsulating structure according to claim 2, it is characterised in that：The package floor （1）And encapsulation cover plate（2）Bonding connection.

4. a kind of SAW device blade inserting encapsulating structure according to claim 3, it is characterised in that：The encapsulation bottom Plate（1）Copper organic substrate or ceramic substrate are covered using high frequency one side or ltcc substrate makes.

5. a kind of SAW device blade inserting encapsulating structure according to claim 4, it is characterised in that：The cap Plate（2）Copper organic substrate or ceramic substrate are covered using high frequency one side or ltcc substrate makes.

6. a kind of SAW device blade inserting encapsulating structure according to claim 4, it is characterised in that：The lead （6）Using Si-Al wire or spun gold.

7. a kind of SAW device blade inserting encapsulating structure according to claim 5, it is characterised in that：The shell （5）Material be ground connection metallic sheath or thermal contraction plastic expects pipe.