CN205264681U - Substrate processing apparatus - Google Patents

Abstract

The utility model provides a substrate processing device, comprising: a conveying mechanism, which conveys the substrate from the upstream side of the conveying direction to the downstream side; a processing liquid spray nozzle, which sprays the processing liquid on the surface of the substrate conveyed by the conveying mechanism toward the downstream side; and a processing liquid supply part, which supplies the processing liquid to the processing liquid discharge nozzle, and the conveying mechanism includes: a first conveying roller having a plurality of disk-shaped members arranged in a direction perpendicular to the conveying direction of the substrate; and a second conveying roller The roller has a cylindrical member extending in a perpendicular direction, and the second transport roller is arranged in a plurality toward the downstream side from the discharge position where the processing liquid is discharged from the processing liquid discharge nozzle to the surface of the substrate. The first conveying roller is disposed adjacently on the downstream side of the second conveying roller, which is arranged in a plurality of consecutively. Thereby, surface unevenness of the substrate can be suppressed.

Description

Substrate processing equipment

technical field

The utility model relates to a substrate processing device, which is used for liquid crystal display (Liquid Crystal Display, LCD), plasma display (Plasma Display Panel, PDP), organic light-emitting diode (Organic Light-Emitting Diode, OLED) and field emission display (Field Emission Display). , FED), glass substrates for solar cell panels, glass/ceramic substrates for magnetic/optical discs, semiconductor wafers, electronic device substrates, printing for printing Various substrates such as plates, spray cleaning liquid, etching liquid, developer liquid, stripping liquid for resist, etc., or various processing liquids such as pure water to treat the substrate .

Background technique

Conventionally, as such a substrate processing apparatus, a technique has been proposed in which a substrate is carried into a processing chamber by means of rollers arranged in parallel in the direction in which the substrate is conveyed, and a processing liquid is supplied to the substrate conveyed by the rollers to perform processing. processing (for example, Patent Document 1).

The substrate transfer device included in the substrate processing apparatus disclosed in Patent Document 1 is provided on each transfer roller such that transfer rollers in contact with the substrate form zigzags as a whole in the transfer direction of the substrate. This allows the plurality of transport rollers to evenly abut against the back surface of the substrate, and thus prevents contact unevenness of the transport rollers when developing or the like is performed on the surface of the substrate.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2013-110195

Utility model content

[Problems to be solved by the utility model]

However, in the substrate transfer device of Patent Document 1, the transfer rollers in contact with the back surface of the substrate are arranged at constant intervals with respect to one shaft, and irregularities may occur on the back surface of the substrate with respect to the direction in which the shaft extends. The non-contact portion that is in contact with the contact portion that the transport roller contacts. In this case, when the substrate generates heat due to a chemical reaction caused by the processing liquid supplied to the surface of the substrate, temperature unevenness may occur between the contact portion and the non-contact portion. Then, there is a possibility that the unevenness of the transfer rollers may occur on the surface of the substrate due to the temperature unevenness.

Therefore, an object of the present invention is to provide a substrate processing apparatus capable of suppressing occurrence of surface unevenness of a substrate even when a processing liquid is supplied to the surface of a substrate conveyed by conveying rollers to perform predetermined processing.

[Technical means to solve the problem]

In order to solve the above problems, a first aspect is a substrate processing apparatus including: a transport mechanism for transporting the substrate from the upstream side toward the downstream side in the transport direction; and a processing liquid discharge nozzle for transporting the substrate toward the downstream side by the transport mechanism. and a processing liquid supply unit that supplies the processing liquid to the processing liquid discharge nozzle, and the conveying mechanism includes: a first conveying roller having a conveying roller along the substrate A plurality of disc-shaped members are arranged in a direction perpendicular to the direction; and a second conveying roller has a cylindrical member extending in the orthogonal direction, and the second conveying roller is ejected from the treatment liquid. A plurality of nozzles for discharging the processing liquid onto the surface of the substrate are continuously arranged toward the downstream side, and the first conveying roller is downstream of the plurality of continuously arranged second conveying rollers. side-by-side arrangement.

A second aspect is the substrate processing apparatus according to the first aspect, wherein three or more of the second conveyance rollers are continuously arranged downstream from the discharge position.

A third aspect is the substrate processing apparatus according to the first aspect or the second aspect, wherein the substrate has an inactive area at both ends in the transport direction, and both ends of the cylindrical member are located in the inactive area. .

A fourth aspect is the substrate processing apparatus according to any one of the first aspect to the third aspect, wherein one or more and seven or less of the first conveyance rollers are arranged continuously along the conveyance direction.

A fifth aspect is the substrate processing apparatus according to any one of the first aspect to the fourth aspect, wherein the processing liquid is a developer, and the processing liquid discharge nozzle applies the developer to the surface of the substrate. Overlay.

(effect of utility model)

According to the first aspect to the fifth aspect of the present invention, a plurality of conveyance rollers having a cylindrical member are continuously arranged downstream from the ejection position for ejecting the treatment liquid on the surface of the substrate. Even when the processing liquid is supplied to the surface of the substrate conveyed by the conveying rollers to perform a predetermined process, it is possible to suppress the occurrence of unevenness on the surface of the substrate.

Description of drawings

FIG. 1 is a schematic plan view of a substrate processing system.

FIG. 2 is a block diagram showing an electrical configuration of a control unit.

3 is a schematic side view showing the configuration of the substrate processing apparatus according to the first embodiment.

4 is a schematic plan view showing the structure of the substrate processing apparatus according to the first embodiment.

5 is a schematic plan view for explaining the positional relationship between the second conveyance roller and the substrate.

6 is a schematic plan view showing the configuration of a substrate processing apparatus according to a second embodiment.

[explanation of the symbol]

1: Substrate processing system

11: Indexer part

12: Cleaning device

13: Dehydration baking device

14: Resist coating device

15: Decompression drying device

16: Pre-baking device

17: Exposure device

18: Developing device

19: Post-baking device

20: Transfer mechanism

21: 1st conveying roller

22: 2nd conveying roller

23: Rotation axis

30: effective area

33: Non-effective area

40: spray nozzle

48: Etching device

60: Control Department

61: CPU

62: ROM

63: RAM

64: storage device

65: bus

66: input part

67: Display

68: Ministry of Communications

181: Processing room

182: Treatment liquid ejection nozzle

183: Piping

184: Treatment liquid storage unit

185: Treatment liquid supply unit

211: Disc-shaped member

213: The first roll group

221: Cylindrical member

223: The second roll group

225: Both ends position

AR1: Transport direction

AR2: Arrow

CP: ejection position

D: width dimension

L: developer

P: handler

S: Substrate

detailed description

Hereinafter, the substrate processing system 1 will be described with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of a substrate processing system 1 according to the present embodiment. The substrate processing system 1 is a coater/developer device capable of performing a series of processes by connecting a plurality of processing devices.

The substrate processing system 1 mainly includes: each processing device, that is, a cleaning device 12, a dehydration baking (bake) device 13, a resist (resist) coating device 14, a reduced pressure drying device 15, and a prebake (prebake) device 16 , an exposure device 17 , a developing device 18 , and a postbake (postbake) device 19 ; and an indexer (indexer) unit 11 , which performs entry and exit of the substrate S with respect to the device group.

On the line from the indexer unit 11 to the exposure device 17, a cleaning device 12, a dehydration baking device 13, a resist coating device 14, a reduced-pressure drying device 15, a pre-baking device 16, and the like are disposed. On the return line from the exposure device 17 to the indexer unit 11, a developing device 18, a post-baking device 19, and the like are disposed.

A cassette for accommodating a plurality of substrates S is placed on the indexer unit 11 . The substrate S taken out from the cassette by an indexer robot (robot) arranged in the indexer unit 11 is first cleaned in the cleaning device 12 . The substrate S that has been processed in the cleaning device 12 is transported to the dehydration baking device 13 and subjected to dehydration baking treatment. The substrate S subjected to the dehydration baking treatment is then transported to the resist coating device 14 and subjected to a resist coating treatment. The substrate S subjected to the resist coating process is then conveyed to the reduced-pressure drying device 15 , and the solvent of the resist solution applied to the surface of the substrate S is evaporated by reducing pressure to dry the substrate S. The substrate S subjected to reduced-pressure drying is then transported to the prebaking device 16 and subjected to heat treatment to cure the resist component on the surface of the substrate S. The substrate S subjected to the heat treatment is then transported to the exposure device 17 and subjected to exposure treatment.

The board|substrate S which completed these processes is conveyed to the developing device 18, and is subjected to a developing process. The substrate S on which the development process has been completed is sent to the post-baking apparatus 19, and heat-processed. Subsequently, the substrate S is accommodated in the original cassette placed on the indexer unit 11 by the indexer robot.

Furthermore, the substrate processing system 1 has a control unit 60 that controls processing in each processing apparatus and conveyance of the substrate S. As shown in FIG. As shown in Figure 2, the control unit 60, for example, includes a general computer, which is composed of a central processing unit (Central Processing Unit, CPU) 61, a read-only memory (Read-OnlyMemory, ROM) 62, a random access memory (Random-AccessMemory, The RAM 63 , the storage device 64 , and the like are connected to each other via a bus line 65 . ROM62 stores a basic program (program) etc., and RAM63 is provided as a work area when CPU61 performs predetermined processing. The storage device 64 includes a nonvolatile storage device such as a flash memory or a hard disk device.

Furthermore, in the control unit 60 , the input unit 66 , the display unit 67 , and the communication unit 68 are also connected to the bus 65 . The input unit 66 includes various switches, touch panels, and the like, and receives various input setting instructions such as recipes from an operator. The display unit 67 includes a liquid crystal display device, a lamp, and the like, and displays various information based on the control of the CPU 61 . The communication unit 68 has a data communication function via a local area network (Local Area Network, LAN) or the like. Moreover, each robot and each processing device are connected to the control part 60 as a control object.

When the processing program P is executed by the CPU 61 of the control unit 60 , the conveyance operation of the substrate S and the processing operation in each processing apparatus are controlled. The control part 60 has a function as a conveyance control part in this invention.

Hereinafter, the configuration of the developing device 18 as an example of a substrate processing device will be described with reference to the drawings. 3 is a schematic side view showing the configuration of the developing device 18 according to the first embodiment, and FIG. 4 is a schematic plan view showing the configuration of the developing device 18 . In addition, in FIG. 4 , description of some symbols is omitted due to space reasons.

The developing device 18 has a conveying mechanism 20 for conveying the substrate S along the conveying direction AR1, a processing chamber 181 for developing the substrate S, and a processing liquid jet for spraying a developer L as a processing liquid onto the surface of the substrate S being conveyed. The discharge nozzle 182 and the processing liquid supply part 185 that supplies the developer L to the processing liquid discharge nozzle 182 . In the following description, unless otherwise specified, the upstream side of the conveyance direction of the board|substrate S is simply called "upstream side", and the opposite side is called "downstream side".

The processing chamber 181 has a processing space inside, and an inlet for carrying the substrate S processed by the exposure device 17 is provided at an upstream end of the processing chamber 181 . Furthermore, a discharge port for carrying out the processed substrate S to the post-baking apparatus 19 is provided at the downstream end portion of the processing chamber 181 . Furthermore, a discharge mechanism (not shown) for discharging the processing liquid used in the processing chamber is provided on the bottom surface of the processing chamber 181 .

The processing liquid discharge nozzle 182 is provided in the processing space of the processing chamber 181 and discharges the processing liquid onto the surface of the substrate S conveyed downstream by a conveying mechanism described later. The processing liquid discharge nozzle 182 is a so-called slit nozzle (slit nozzle), that is, it extends along a direction (Y-axis direction) perpendicular to the conveyance direction AR1, and on its lower surface (the surface facing the substrate S) , a discharge port with a slit extending elongatedly in the perpendicular direction is formed. The dimension in the direction perpendicular to the discharge port is substantially the same as the dimension in the direction perpendicular to the substrate S. As shown in FIG. Then, the developer L is supplied to the surface of the substrate S by ejecting the developer L from the discharge port in a curtain shape.

The substrate S and the discharge port of the processing liquid discharge nozzle 182 are arranged at a predetermined interval, and by passing the substrate S directly under the discharge port, the entire upper surface of the substrate S is in a state covered with the developer L by surface tension. (That is, a state in which a slurry (puddle) of the developer L is formed). The development process is performed by conveying the surface of the board|substrate S in the state covered with developing solution L. As such a developing solution L, tetramethylammonium hydroxide (Tetramethylammonium Hydroxide, TMAH) etc. of normal temperature can be used.

The processing liquid supply part 185 has the processing liquid storage part 184 which stores the developing liquid L, and the pipe 183 which connects the processing liquid storage part 184 and the processing liquid discharge nozzle 182, and supplies the developing liquid L to the processing liquid discharge nozzle 182. A pump or the like can be used for feeding the liquid from the processing liquid storage unit 184 to the processing liquid discharge nozzle 182 . In addition, for example, if the processing liquid storage unit 184 is realized by a pressurized tank, the developer liquid L can be sent to the processing liquid discharge nozzle 182 through the pipe 183 by pressurizing the inside of the pressurized tank. Therefore no pump is required.

The transport mechanism 20 includes a plurality of transport rollers and a drive unit for rotating the transport rollers, and transports the substrate S from the upstream side toward the downstream side in the transport direction AR1 in the processing chamber 181 . The plurality of conveying rollers includes: a plurality of first conveying rollers 21 having a plurality of disc-shaped members 211 arranged in a direction perpendicular to the conveying direction AR1 of the substrate S; and a plurality of second conveying rollers 22 having The cylindrical member 221 extending in the cross direction. A well-known motor (motor) etc. can be used as a drive part, and is controlled by the control part 60. As shown in FIG.

The first conveying roller 21 has a rotating shaft 23 extending in a direction perpendicular to the rotating shaft 23 , and a plurality of disk-shaped members 211 arranged along the longitudinal direction of the rotating shaft 23 . The rotating shaft 23 is connected to a drive unit (not shown). In this embodiment, as shown in FIG. 4 , six disc-shaped members 211 are attached along the longitudinal direction of the rotating shaft 23 . And the drive part drives according to the command from the control part 60, and the 1st conveyance roller 21 rotates to the direction shown by arrow AR2 centering on the rotation shaft 23 by this.

Furthermore, since the diameters of the plurality of disk-shaped members 211 constituting the first conveyance roller 21 are the same, the substrate S is supported horizontally on the outer peripheral surface of the disk-shaped members 211 . Furthermore, since the disk-shaped member 211 is arrange|positioned at substantially the same interval with respect to the rotating shaft 23, it can suppress and support the board|substrate S from bending.

Here, when the first conveying rollers 21 are arranged continuously along the conveying direction AR1 of the substrate S, the position of contact with the substrate S is different for the adjacent first conveying rollers 21, so two kinds of first conveying rollers 21 are included, that is, six types of first conveying rollers 21 are included. Two disk-shaped members 211 and a structure including five disk-shaped members 211 are available. In addition, in order to eliminate the problem caused by the disc-shaped members 211 of the adjacent first conveying rollers 21 contacting at the same position on the substrate S, it is preferable to adopt the above-mentioned configuration, but from the viewpoint of conveying the substrate S, this arrangement is not necessary. .

The 2nd conveyance roller 22 has the cylindrical member 221 extended in the direction (Y-axis direction) orthogonal to the conveyance direction of the board|substrate S. More specifically, the second conveying roller 22 has a rotating shaft 23 extending in a direction perpendicular to the first conveying roller 21 , and a cylindrical member attached to the rotating shaft 23 and whose outer peripheral surface is in contact with the back surface of the substrate S. 221. Since the driving of the second conveying roller 22 is the same as that of the first conveying roller 21 , description thereof will be omitted. The cylindrical member 221 has substantially the same diameter as the disc-shaped member 211 . Therefore, even when the 1st conveyance roller 21 and the 2nd conveyance roller are combined and arrange|positioned as mentioned later, board|substrate S can be conveyed substantially horizontally.

Next, the arrangement of the first conveying rollers 21 and the second conveying rollers 22 in the processing space of the processing chamber 181 will be described in detail.

In the processing chamber 181 , the developer solution L is discharged in a curtain shape from the processing liquid discharge nozzle 182 to the upper surface of the substrate S conveyed by the conveyance mechanism 20 . In FIG. 3 , the position where the developing solution L is discharged onto the substrate S in a curtain shape and the developing solution L contacts the substrate S is shown as a discharge position CP. The upper surface of the substrate S that has passed the ejection position CP is covered with the developer solution L, and the development process starts.

In the processing chamber 181, the second conveying roller 22 is continuously arranged toward the downstream side in the conveying direction from the discharge position CP where the developer L as the processing liquid is discharged from the processing liquid discharge nozzle 182 to the surface of the substrate S. Multiple. In FIG. 3, three 2nd conveyance rollers 22 are arrange|positioned continuously (adjacently) toward the downstream side from discharge position CP. However, the number of the second conveyance rollers 22 arranged continuously is not limited thereto, as long as at least two or more second conveyance rollers 22 are arranged continuously, it is more preferable to continue from the discharge position CP toward the downstream side. There are more than 3 ground configurations. Thereby, occurrence of unevenness can be suppressed more effectively.

Generally, a conveyance roller having a cylindrical member like the second conveyance roller 22 is more expensive than a conveyance roller having a disc-shaped member like the first conveyance roller 21 . Therefore, in order to suppress unevenness due to the developing process and reduce the number of second conveying rollers 22 arranged, the maximum number of second conveying rollers 22 arranged continuously is preferably six. In addition, the maximum number of continuous arrangements may be determined in consideration of the occurrence of unevenness and cost according to the type of treatment liquid, etc., through experiments.

Moreover, in this embodiment, the 1st conveyance roller 21 is arrange|positioned adjacently on the downstream side of the 2nd conveyance roller 22 arrange|positioned three consecutively from discharge position CP. Specifically, seven first conveying rollers 21 are arranged continuously. Moreover, although illustration is omitted, the downstream side where the seven 1st conveyance rollers 21 are arrange|positioned continuously, the some 2nd conveyance roller 22 is arrange|positioned continuously adjacently.

That is, three second conveying rollers 22 are arranged continuously from the discharge position CP, seven first conveying rollers 21 are arranged continuously on the downstream side thereof, and two or more conveying rollers 21 are arranged continuously on the downstream side thereof. The second conveying roller 22. In this way, by alternately arranging the second roller group 223 including the second conveying roller 22 and the first roller group 213 including the first conveying roller 21 from the ejection position CP for ejecting the developer L on the upper surface of the substrate S, Accordingly, it is possible to suppress unevenness caused on the substrate S due to the development process. In addition, what is necessary is just to arrange|position the 1st conveyance roller 21 on the upstream side of the discharge position CP. Moreover, it is preferable that the 1st conveyance roller 21 which comprises the 1st roller group 213 is continuously arrange|positioned with respect to conveyance direction AR1, and 7 or less. Accordingly, the cost of the conveyance roller can be reduced while suppressing occurrence of unevenness.

Next, the positional relationship between the 2nd conveyance roller 22 and the board|substrate S is demonstrated. FIG. 5 is a schematic plan view for explaining the positional relationship between the second transport roller 22 and the substrate S. As shown in FIG.

The board|substrate S has the non-effective area|region 33 in the both ends of conveyance direction AR1, and has the effective area 30 in the center part. The effective area 30 refers to an area used for processing in a post-process or the like, and in this area, it is necessary to prevent occurrence of unevenness due to development processing. On the other hand, the non-effective area 33 refers to an area surrounding the effective area 30 , and is an area that will not be used in subsequent processes or the like. Therefore, even if unevenness due to the development process occurs in the non-effective area 33 , there is no problem with product quality or the like. In addition, the non-effective area 33 does not necessarily have to be an area including the surrounding area of the effective area 30 , for example, a structure may be adopted in which only the areas at both ends of the substrate S in the conveyance direction are the non-effective area 33 .

In the present embodiment, both end positions 225 of the cylindrical member 221 of the second transport roller 22 are located within the range of the width dimension D in the direction perpendicular to the non-active region 33 of the substrate S. As shown in FIG. In this way, the length dimension of the cylindrical member 221 in the Y-axis direction is longer than the effective region 30 of the substrate S in the Y-axis direction and shorter than the length dimension of the substrate S in the Y-axis direction. The end position 225 is located within the non-active area 33 . Therefore, in the effective area 30 of the substrate S, since the cylindrical member 221 of the second conveying roller 22 is in contact with and supported, it is possible to suppress the occurrence of temperature variation in the effective area 30 with respect to the heat generated by the developing process. Thereby, occurrence of unevenness on the surface of the substrate S can be suppressed.

As described above, in the above-described embodiment, the arrangement of the first conveyance roller 21 having a plurality of disk-shaped members 211 and the second conveyance roller 22 having a cylindrical member 221 is relatively opposite to the upper direction of the substrate S. The ejection position CP of the developer L ejected from the surface is continuously arranged toward the downstream side from the ejection position CP. The downstream side of the roller 22 is adjacently arranged, whereby the substrate S is conveyed by the second conveyance roller 22 in the conveyance section where heat unevenness due to the developing process is most likely to occur. Thereby, it is possible to suppress temperature variations due to the conveying rollers, and it is possible to suppress occurrence of development unevenness on the substrate S. As shown in FIG.

Next, an etching apparatus 48 as a second embodiment of the substrate processing apparatus will be described with reference to FIG. 6 . In addition, the difference in configuration from the developing device 18 of the first embodiment is only a nozzle for ejecting an etching liquid as a processing liquid. The other structures are the same, and the same symbols are assigned and descriptions are omitted.

The etching device 48 has a spray nozzle (spray nozzle) 40 that sprays high-temperature etching liquid onto the upper surface of the substrate S. As shown in FIG. The spray nozzle 40 is supplied with a high-temperature etching solution from the processing solution reservoir 184 through the pipe 183 , and when the etching solution is sprayed onto the substrate S, a chemical reaction occurs on the upper surface of the substrate S to cause a temperature rise. Therefore, similarly to the first embodiment, a plurality of second conveying rollers 22 are arranged continuously toward the downstream side from the discharge position CP where the etching liquid is discharged to the substrate S. As shown in FIG. Further, on the downstream side of the second conveyance roller 22, a plurality of first conveyance rollers 21 are arranged adjacently. Thereby, occurrence of etching unevenness with respect to the board|substrate S can be suppressed.

As mentioned above, although embodiment was described, this invention is not limited to what was mentioned above, Various deformation|transformation is possible.

For example, in the above-described embodiment, one processing liquid discharge nozzle is used, but the number is not limited to this number, and a plurality of processing liquid discharge nozzles may be used. For example, two slit nozzles may be used, and the present invention is also effective when using a slit nozzle and a spray nozzle in combination. At this time, it is preferable that the second transport roller 22 is arranged from a position where heat is generated by a chemical reaction due to spraying the processing liquid onto the substrate.

In addition, in the said embodiment, although the development process and the etching process were demonstrated as an example, this is just an example of this invention. For example, the present invention is also effective in other substrate processing such as peeling processing.

In addition, in the above-mentioned embodiment, the example in which the substrate is conveyed horizontally has been described, but the present invention is also effective for a conveyance mechanism that conveys, for example, an inclined state with respect to the conveyance direction of the substrate.

Although this invention was demonstrated in detail, the said description is an illustration in every point, and this invention is not limited to this. It should be understood that numerous modified examples not illustrated can be conceived without departing from the scope of the present invention. Moreover, each structure demonstrated in the said embodiment can be combined suitably as long as it does not contradict each other.

Claims (5)

1. a substrate board treatment, is characterized in that comprising:

Transport mechanism, from the upstream side of conveyance direction towards downstream conveyance substrate;

Treatment fluid jetting nozzle, to the surface towards the described substrate of downstream conveyance by described transport mechanismEjection treatment fluid; And

Treatment fluid supply unit, supplies with described treatment fluid to described treatment fluid jetting nozzle,

Described transport mechanism comprises:

The 1st carrying roller, has along disposing multiple circles with the orthogonal direction of the conveyance direction of described substrateTabular component; And

The 2nd carrying roller, has the cylindrical structural member extending along described orthogonal direction,

Described the 2nd carrying roller is from the surface ejection of described substrate being processed from described treatment fluid jetting nozzleThe ejection position of liquid towards downstream side be equipped with continuously multiple,

Described the 1st carrying roller is in the downstream adjacency that is equipped with continuously multiple described the 2nd carrying rollersArrange.

2. substrate board treatment according to claim 1, is characterized in that,

Described the 2nd carrying roller be from described ejection position towards downstream side be equipped with continuously more than 3.

3. substrate board treatment according to claim 1 and 2, is characterized in that,

Described substrate has non-effective region at the both ends of conveyance direction,

The two ends of described cylindrical structural member are positioned at described non-effective region.

4. substrate board treatment according to claim 1 and 2, is characterized in that,

Described the 1st carrying roller is to be equipped with continuously more than 1 and below 7 along conveyance direction.

5. substrate board treatment according to claim 1 and 2, is characterized in that,

Described treatment fluid is developer solution,

Described treatment fluid jetting nozzle covers liquid with described developer solution to the surface of described substrate.