JP7324734B2 - Substrate transfer device and substrate processing device - Google Patents

Description

TECHNICAL FIELD Embodiments of the present invention relate to a substrate transfer apparatus and a substrate processing apparatus.

2. Description of the Related Art Substrate processing apparatuses for processing substrates such as glass substrates and semiconductor substrates are used in manufacturing processes for liquid crystal display devices, semiconductor devices, and the like. Substrate processing includes, for example, resist coating processing, resist stripping processing, etching processing, cleaning processing, and drying processing. A substrate processing apparatus processes a substrate by applying a processing fluid (for example, a processing liquid or a drying gas) to the substrate while transporting the substrate with a plurality of transport rollers.

Substrates to be transported are usually flat substrates, but there are also warped substrates (warped substrates). For example, when a thin substrate with a thickness of about 1 mm is used as a substrate to be processed and a film is formed on the upper surface of the substrate, the substrate may warp due to the stress of the film. If the warped substrate is conveyed with the upper surface facing up or down while being warped by a plurality of conveying rollers, the processing fluid is not uniformly supplied to the warped portion of the substrate, and the substrate cannot be processed. become uneven. As a result, uneven processing (for example, uneven coating, uneven peeling, uneven etching, uneven cleaning, and uneven drying) may occur, and the quality of the substrate deteriorates.

JP-A-11-10096

A problem to be solved by the present invention is to provide a substrate transfer apparatus and a substrate processing apparatus capable of improving substrate quality.

A substrate transfer apparatus according to an embodiment of the present invention includes:
a plurality of transport rollers for transporting a warped substrate;
a plurality of pressing rollers provided to face and be spaced apart from the plurality of transport rollers, respectively, and press the substrate transported by the plurality of transport rollers;
with
The conveying rollers and the pressing rollers that face and are separated from each other form one set, and a plurality of sets are arranged along the conveying direction of the substrate,
The separation distance between the conveying rollers and the pressing rollers for each set is shortened along the conveying direction of the substrate by increasing the outer diameter of the pressing roller for each set along the conveying direction of the substrate. there is

A substrate processing apparatus according to an embodiment of the present invention includes:
A substrate transfer device according to the above-described embodiment;
a liquid supply unit that supplies a processing liquid to the substrate transported by the substrate transport device;
Prepare.

A substrate processing apparatus according to an embodiment of the present invention includes:
A substrate transfer device according to the above-described embodiment;
a drying unit that dries the substrate transported by the substrate transport device;
Prepare.

According to embodiments of the present invention, substrate quality can be improved.

1 is a first diagram showing part of a schematic configuration of a substrate processing apparatus according to a first embodiment; FIG. FIG. 2 is a second diagram showing part of the schematic configuration of the substrate processing apparatus according to the first embodiment; 3 is a third diagram showing part of the schematic configuration of the substrate processing apparatus according to the first embodiment; FIG. FIG. 4 is a fourth diagram showing part of the schematic configuration of the substrate processing apparatus according to the first embodiment; It is a figure which shows a part of schematic structure of the substrate processing apparatus which concerns on 2nd Embodiment. It is the 1st figure which shows a part of schematic structure of the substrate processing apparatus which concerns on 3rd Embodiment. It is the 2nd figure which shows a part of schematic structure of the substrate processing apparatus which concerns on 3rd Embodiment. It is the 1st top view which shows a part of schematic structure of the substrate processing apparatus which concerns on 4th Embodiment. FIG. 8A is an arrow view AA′ and an arrow BB′ view is FIG. It is a 2nd top view which shows a part of schematic structure of the substrate processing apparatus which concerns on 4th Embodiment. FIG. 10 is an arrow view AA' (A) and an arrow view BB' (B) of FIG. It is the 1st figure which shows a part of schematic structure of the substrate processing apparatus which concerns on 5th Embodiment. It is the 2nd figure which shows a part of schematic structure of the substrate processing apparatus which concerns on 5th Embodiment.

<First Embodiment>
A first embodiment will be described with reference to FIGS. 1 to 4. FIG.

(basic configuration)
As shown in FIGS. 1 and 2, the substrate processing apparatus 10 according to the first embodiment includes a processing chamber 20, a transfer section (substrate transfer apparatus) 30, a liquid supply section 40, a drying section 50, a control a portion 60; As the substrate W to be processed, for example, a rectangular thin substrate such as a glass substrate is used. For example, the thickness of the substrate W is approximately 0.5 to 1.1 mm, and the amount of warpage of the substrate W is approximately 7 to 10 mm. Warps are present on all four sides of the rectangular substrate.

The processing chamber 20 has a correction processing chamber 21 , a cleaning processing chamber 22 and a drying processing chamber 23 . The correction processing chamber 21, the cleaning processing chamber 22, and the drying processing chamber 23 are housings each having therein a transport path H1 along which the substrate W is transported. is formed to be possible. The correction processing chamber 21, the cleaning processing chamber 22, and the drying processing chamber 23 each function as a chamber for processing the substrate W moving on the transport path H1. At the bottom of each of the cleaning processing chamber 22 and the drying processing chamber 23, a discharge port (not shown) for discharging liquid is formed.

The transport section 30 has a plurality of transport rollers 31A and a plurality of pressing rollers 31B. The conveying unit 30 is provided throughout the processing chamber 20, that is, the entire interior of the correction processing chamber 21, the cleaning processing chamber 22, and the drying processing chamber 23 (hereinafter referred to as the processing chamber 20 as appropriate). The substrate W is transported by each transport roller 31A while the upper surface of the substrate W is pressed by the .

The transport rollers 31A are arranged at predetermined intervals below the transport path H1 along the transport direction A1 of the substrate W (hereinafter referred to as transport direction A1). Each pressing roller 31B is positioned above the conveying path H1 so as to face each conveying roller 31A with the conveying path H1 interposed therebetween. They are arranged along the direction A1. These conveying roller 31A and pressing roller 31B are rotatably provided in the processing chamber 20, and configured to rotate in synchronization with each other by a drive source (not shown). The conveying roller 31A rotates clockwise, and the pressing roller 31B rotates counterclockwise. In this embodiment, as shown in FIGS. 1 and 2, each transport roller 31A forms a horizontal transport path H1 along the transport direction A1.

Here, a plurality of pairs of the transport rollers 31A and the pressing rollers 31B, which are spaced apart in the vertical direction and face each other across the transport path H1, are arranged along the transport direction A1. The separation distance between the rollers in each set in the correction processing chamber 21, that is, the separation distance (for example, the vertical separation distance) between the conveying roller 31A and the pressing roller 31B in each set, more specifically, shown in FIG. Thus, the vertical separation distance between the rollers 31a and 31c for each set (to be described later) is gradually shortened along the transport direction A1, and becomes constant in the middle of the transport path H1 inside the correction processing chamber 21. , and remains constant in the cleaning processing chamber 22 and the drying processing chamber 23 as well. Here, the fixed distance is, for example, a predetermined distance in which a substrate having a thickness equal to or less than the thickness of the substrate W can be transported. The separation distance between the set of the transport rollers 31A and the pressing rollers 31B positioned most upstream (upstream end) in the transport direction A1 is the amount of warpage of the substrate W (the plane on which the substrate W is placed and the is longer than the maximum vertical separation distance from the upper surface of the substrate W placed thereon.

Each conveying roller 31A has three rollers 31a and one shaft 31b, as shown in FIG. The three rollers 31a are circular and have the same diameter and are made of, for example, rubber or resin. Each functions as a roller that supports the substrate W in contact with the lower surface. The shaft 31b is formed longer than the width of the substrate W (the width in the direction perpendicular to the transport direction A1 in the horizontal plane), and is rotatably provided in the processing chamber 20 . When the shaft 31b rotates, each roller 31a attached to the shaft 31b rotates around the shaft 31b as a rotation axis.

As shown in FIG. 3, each pressing roller 31B has two circular rollers (upper rollers) 31c having the same diameter and two shafts 31d. The two rollers 31c are rollers made of, for example, rubber or resin, and individually press both end regions (both end regions in the width direction of the substrate W) of the upper surface of the substrate W on each transport roller 31A from above. is made possible. These rollers 31c are attached to two shafts 31d, respectively, and function as rollers that press the substrate W in contact with the upper surface of the substrate W being conveyed. The two rollers 31c are arranged so as to face the respective outer ends of the two rollers 31a located at both ends of the transport roller 31A with the transport path H1 interposed therebetween. The two shafts 31d are positioned so that the two rollers 31c individually contact both end regions of the upper surface of the substrate W, and are rotatably provided within the processing chamber 20 . When the shaft 31d rotates, the roller 31c attached to the shaft 31d rotates around the shaft 31d as a rotation axis. Two rollers 31c located at both ends of the pressing roller 31B are configured to rotate in synchronization with each other. When the rollers 31a and 31c are rotationally driven, both are rotationally driven at the same peripheral speed. By changing the distance between the shaft 31b of the conveying roller 31A and the shaft 31d of the pressing roller 31B, the distance between the conveying roller 31A and the pressing roller 31B can be changed for each set as described above.

Returning to FIG. 2 , the liquid supply section 40 has a plurality of liquid injection sections 41 . The liquid supply unit 40 is provided in the cleaning processing chamber 22, and supplies the cleaning liquid (an example of the processing liquid) from each liquid injection unit 41 to the substrate W moving on the transport path H1. Seven liquid injection units 41 are provided above and below the transport path H1 so as to face each other with the transport path H1 interposed therebetween without interfering with the transport of the substrate W by the transport unit 30 . These liquid ejecting portions 41 eject the cleaning liquid in a shower-like manner toward the transport path H1. In addition, each liquid ejector 41 positioned below the transport path H1 is arranged so as to avoid each transport roller 31A and eject the cleaning liquid onto the transport path H1. The cleaning liquid is jetted toward the transport path H1 by each liquid jetting part 41, and the cleaning liquid is supplied to both the upper surface and the lower surface of the substrate W moving in the transport path H1. As the liquid injection part 41, for example, a shower pipe having a plurality of through holes or a pipe having a plurality of shower nozzles is used.

The drying section 50 has a plurality of gas blowing sections 51 . The drying section 50 is provided in the drying processing chamber 23, and supplies drying gas (for example, air or nitrogen gas) from each gas blowing section 51 to the substrate W moving on the transport path H1. Each of the gas blowing units 51 is provided above and below the transport path H1 so as to face each other with the transport path H1 interposed therebetween without interfering with the transport of the substrate W by the transport unit 30 . These gas blowing portions 51 blow high-pressure gas toward the substrates W passing through the transport path H1 to blow off the cleaning liquid adhering to the substrates W and dry both the upper and lower surfaces of the substrates W.

Each gas blowing part 51 has a slit-like blowing port (long blowing port) 51a longer than the width of the substrate W, as shown in FIG. Each of these gas blowing portions 51 has its longitudinal direction inclined in the horizontal plane with respect to the transport direction A1, and blows out gas from the blow outlet 51a toward the upstream side in the transport direction A1 to remove the liquid adhering to the substrate W. It is provided so as to blow off toward the corner of the substrate W. The vertical separation distance (gap) between the blowing port 51a of the gas blowing part 51 and the upper surface of the substrate W being transported is about several millimeters (for example, 3 mm).

Here, as shown in FIG. 4, among the shafts 31b in the drying processing chamber 23, three shafts 31b existing at positions intersecting with the gas blowing section 51 below the transport path H1 are located below the transport path H1. In order not to block the gas blown out by the gas blowing part 51, it is divided at a position facing the gas blowing part 51 (or formed short in some cases). One end of the divided shaft 31b is rotatably supported by a support member (not shown). Such a support member is provided on the bottom surface of the drying processing chamber 23 . Note that the pressing roller 31B is not provided for the conveying roller 31A having the roller 31a provided only on one side. If the roller (upper roller) 31c is provided only on one side of the pressing roller 31B, a difference in the transport speed of the substrate W occurs between the side provided with the roller 31c and the side not provided with the roller 31c. The sheet cannot be conveyed straight along the conveying direction A1. As a result, the front end of the substrate W (the downstream end of the substrate W) may be cracked. The pressing roller 31B is not provided.

Returning to FIG. 1, the control section 60 has a microcomputer that centrally controls each section, and a storage section (both not shown) that stores substrate processing information and various programs related to substrate processing. The control unit 60 controls each unit such as the transport unit 30, the liquid supply unit 40, and the drying unit 50 based on substrate processing information and various programs.

(Substrate processing step)
Next, a substrate processing process performed by the substrate processing apparatus 10 described above will be described.

In the substrate processing apparatus 10 shown in FIGS. 1 and 2, the transport rollers 31A and the pressing rollers 31B of the transport unit 30 rotate synchronously, and the substrate W on the transport rollers 31A is transported in the transport direction A1. It moves along the path H1 and passes through the straightening processing chamber 21, the cleaning processing chamber 22 and the drying processing chamber 23. As shown in FIG.

In the correction processing chamber 21, when the warped substrate W shown in FIG. 1 is inserted into the correction processing chamber 21, it is conveyed in the conveying direction A1 by the rotating conveying rollers 31A and moves along the conveying path H1. . The separation distance between the conveying roller 31A and the pressing roller 31B for each set becomes shorter toward the downstream side in the conveying direction A1. Therefore, as the substrate W moves, when the upper surface of the warped substrate W on the conveying rollers 31A on the downstream side (front end side) sequentially contacts the pressing rollers 31B, the substrate W is moved by the pressing rollers 31B. Gradually pressed down. At this time, when the warped state of the substrate W is such that the downstream end portion and the upstream (rear end side) end portion of the substrate W are warped upward as shown in FIG. When the upper surface of the substrate W on the downstream side is gradually pressed by the pressing rollers 31B, the upper surface of the substrate W on the upstream side also approaches and contacts the pressing rollers 31B, and is pressed by the pressing rollers 31B (see FIG. 1). ). As the warped substrate W moves along the transport path H1, the substrate W is gradually straightened to a flat state from the downstream side of the substrate W, and the straightened substrates W are then kept at a constant distance. , and is sandwiched between the conveying rollers 31A and the pressing rollers 31B for each pair, and is conveyed to the next cleaning processing chamber 22 in a flat state as it is. A substrate W that is not warped does not need to be corrected, and is conveyed to the next cleaning processing chamber 22 in a flat state from the beginning.

In the cleaning processing chamber 22, the cleaning liquid is supplied in advance from the upper and lower sides of the transport path H1 by the respective liquid injection parts 41 to the liquid supply area (processing area) located in the middle of the transport path H1. In this liquid supply state, when the substrate W is transported in a flat state and passes through the liquid supply region, the cleaning liquid is supplied to both the upper and lower surfaces of the substrate W, and both surfaces of the substrate W are cleaned with the cleaning liquid. The cleaning liquid dropped from both sides of the substrate W flows along the bottom surface of the processing chamber 20 and is discharged from the discharge port.

In the drying processing chamber 23, drying gas is supplied in advance from the upper and lower sides of the transport path H1 by the gas blowing units 51 to the gas supply area (processing area) located in the middle of the transport path H1. In this gas supply state, when the substrate W is transported in a flat state and passes through the gas supply region in the middle of the transport path H1, the processing liquid adhering to both the upper and lower surfaces of the substrate W is blown off by the gas. are blown off from both sides of the substrate W, and both sides of the substrate W are dried. At this time, the liquid adhering to both surfaces of the substrate W moves from the upper right corner toward the lower left corner (see FIG. 4) of both surfaces of the substrate W due to the blowing of the gas. Dry from the bottom corner to the bottom left corner. The processing liquid blown off from both sides of the substrate W flows along the bottom surface of the processing chamber 20 and is discharged from the discharge port.

In such a substrate processing process, as the warped substrate W moves along the transport path H1 in the correction processing chamber 21, the substrate W is pressed by the pressing rollers 31B, and the substrate W is pushed from the downstream side. The substrate W is gradually flattened, that is, the substrate W is corrected to a flat state by the pressing rollers 31B, and passes through the liquid supply area and the gas supply area in this flat state. A cleaning process and a drying process are performed on the substrate W in the flat state. As a result, the processing liquid and the drying gas can be uniformly supplied to both the upper surface and the lower surface of the substrate W, so that both surfaces of the substrate W can be uniformly processed. Therefore, the uniformity of the cleaning process and the drying process for the substrate W can be improved, and the occurrence of uneven cleaning and drying of the substrate W can be suppressed, so that the quality of the substrate can be improved.

In addition, when the separation distance between the transport roller 31A and the pressing roller 31B for each set is constant in the entire region of the transport path H1 at a predetermined distance that allows transport of a substrate having a thickness equal to or less than the thickness of the substrate W, the warp occurs. When the substrate W is inserted into the correction processing chamber 21, the warped substrate W is forcibly pressed by the pressing rollers 31B to be flattened, so that the substrate W may be broken or damaged. On the other hand, in the first embodiment, the separation distance between the conveying roller 31A and the pressing roller 31B for each set becomes shorter toward the downstream side in the conveying direction A1. As a result, the warped substrate W is gradually pressed by the pressing rollers 31B (so that the amount of warping is gradually reduced), so that the warped substrate W is forcibly pressed by the pressing rollers 31B (so that the amount of warping is rapidly reduced). (2) Damage to the substrate W can be suppressed as compared with the case where the warp of the substrate W is suppressed by pressing.

As described above, according to the first embodiment, the separation distance (for example, the vertical separation distance) between the conveying roller 31A and the pressing roller 31B for each set is shortened along the conveying direction A1. This makes it possible to suppress the warping of the substrate W without damaging the warped substrate W, so that the uniformity of processing on the substrate W can be improved. Therefore, it is possible to suppress the occurrence of processing unevenness (for example, cleaning unevenness or drying unevenness) on the substrate W and improve the substrate quality.

<Second embodiment>
A second embodiment will be described with reference to FIG. In the second embodiment, the difference from the first embodiment (the separation distance between the conveying roller 31A and the pressing roller 31B in the drying processing chamber 23) will be explained, and other explanations will be omitted.

(basic configuration)
As shown in FIG. 5, in the drying processing chamber 23 according to the second embodiment, the separation distance (for example, the vertical separation distance) between the conveying roller 31A and the pressing roller 31B for each set gradually increases along the conveying direction A1. It is shortened, and is constant at a predetermined distance that allows substrates having a thickness equal to or less than the thickness of the substrate W to be transported in the middle of the transport path H1. In the drying processing chamber 23, the separation distance between the pair of transport rollers 31A and the pressing rollers 31B positioned most upstream (upstream end) in the transport direction A1 is longer than the amount of warpage of the substrate W. As shown in FIG.

Here, in the washing processing chamber 22 located upstream of the drying processing chamber 23, the pressing rollers 31B at the locations where the liquid jetting portions 41 are provided are omitted so as not to interfere with the liquid jetting and installation of the liquid jetting portions 41. There is In this case, since the substrate W floats from the lower transport roller 31A at several points, the downstream end of the substrate W may float at the exit of the cleaning processing chamber 22, and the cleaning processing chamber 22 may be separated from the drying processing chamber 23. It becomes difficult to continuously transport to In order to facilitate this continuous transport and to realize the drying process for the substrate W in a flat state, a set of transport rollers 31A and a presser are positioned most upstream in the transport direction A1 in the drying process chamber 23, as described above. The distance between the rollers 31B is longer than the amount of warpage of the substrate W, and the distance between the transport rollers 31A and the pressing rollers 31B for each set becomes shorter toward the downstream side in the transport direction A1.

As shown in FIG. 5, when the warped substrate W enters the drying chamber 23, it moves along the transport path H1 and is pressed by the pressing rollers 31B as in the first embodiment. , gradually becomes flat from the downstream side, and passes through the gas supply region in the flat state. A drying process is performed on the substrate W in this flat state. As a result, the drying gas can be uniformly supplied to both the upper surface and the lower surface of the substrate W, so that both surfaces of the substrate W can be dried uniformly. Therefore, it is possible to improve the uniformity of the drying process on the substrate W and suppress the occurrence of uneven drying on the substrate W, thereby improving the substrate quality. In addition, since the warped substrate W is gradually pressed by the pressing rollers 31B (so that the amount of warpage is gradually reduced), the warped substrate W is forcibly pressed by the pressing rollers 31B (so that the amount of warp is rapidly reduced). ) Damage to the substrate W can be suppressed as compared with the case where the warp of the substrate W is suppressed by pressing.

The separation distance between the set of conveying rollers 31A and the pressing rollers 31B located most upstream in the conveying direction A1 in the drying processing chamber 23 is equal to the distance between the pair of conveying rollers 31A and 31B located most upstream in the conveying direction A1 in the correction processing chamber 21. It can be set shorter than the separation distance between the roller 31A and the pressing roller 31B. This is because the substrate W carried into the drying processing chamber 23 has passed through the correction processing chamber 21 and the cleaning processing chamber 22, and the warpage has been corrected to some extent.

Further, in the present embodiment, the separation distance between the conveying roller 31A and the pressing roller 31B, which are positioned most upstream in the drying processing chamber 23, has been described. This embodiment can also be applied to other places. That is, when the distance between two adjacent transport rollers 31A is longer than the distance between the other transport rollers 31A, the corrected warp of the substrate W may return to some extent. By adopting a configuration in which the separation distance between the conveying roller 31A and the pressing roller 31B is gradually reduced again at such a location, it becomes possible to correct the warp of the substrate W while suppressing damage to the warped substrate W. .

As described above, according to the second embodiment, it is possible to obtain the same effects as those of the first embodiment. That is, since the warp of the substrate W can be suppressed without damaging the warped substrate W, the uniformity of the processing of the substrate W can be improved. Therefore, it is possible to suppress the occurrence of processing unevenness (for example, cleaning unevenness or drying unevenness) on the substrate W, and the substrate quality can be improved.

<Third Embodiment>
A third embodiment will be described with reference to FIG. In addition, in this embodiment, the difference from the first or second embodiment (the outer diameter of the top roller 31c) will be explained, and other explanations will be omitted. The arrangement of the transport rollers 31A and the pressing rollers 31B perpendicular to the transport direction A1 of the substrate W and parallel to the shafts 31b and 31d is called a row. Further, as described above, the conveying roller 31A has the roller 31a and the shaft 31b, and the pressing roller 31B has the top roller 31c and the shaft 31d. In this embodiment, the outer diameter of the roller 31a corresponds to the outer diameter of the conveying roller 31A, the outer diameter of the top roller 31c corresponds to the outer diameter of the pressing roller 31B, and the distance between the roller 31a and the top roller 31c is the conveying roller. It corresponds to the separation distance between the roller 31A and the pressing roller 31B.

In this embodiment, the distance between the rollers 31a and the rollers 31c for each set is shortened along the transport direction A1 by increasing the outer diameter of the top roller 31c for each set along the transport direction A1. have That is, in this embodiment, the outer diameter of the top roller 31c is gradually increased along the transport direction A1 while keeping the distance between the shaft 31b of the transport roller 31A and the shaft 31d of the pressing roller 31B constant. As a result, the present embodiment has a portion where the separation distance between the top roller 31c and the roller 31a gradually decreases. The outer diameter referred to here is the diameter of a cross section perpendicular to the axis of the cylindrical top roller 31c.

For example, the outer diameter of the top roller 31c in the row that contacts the substrate W first is the smallest, and the outer diameters of the top rollers 31c in several rows from the top roller 31c increase in order along the transport direction A1, reaching the maximum outer diameter. The outer diameter is constant after the top roller 31c. As a result, the separation distance between the rollers 31c and 31a is the longest between the rollers 31c and 31a having the smallest outer diameter. It is preferable that the distance between the roller 31a and the top roller 31c, which is the longest, is longer than the warp amount of the substrate W. FIG.

Further, the separation distance between the roller 31c and the roller 31a is gradually shortened along the conveying direction A1, becomes the shortest between the roller 31a and the roller 31c with the largest outer diameter, and then becomes constant. . It is preferable that the constant separation distance be a predetermined distance that allows the substrate to be transported with a thickness of the substrate W or less.

In the example of FIG. 6, the row of the top rollers 31c that comes into contact with the substrate W first starts from the fourth row of rollers 31a from the upstream side in the transport direction A1. The outer diameters of the four rows of topping rollers 31c including this row gradually increase along the conveying direction A1, and become constant from the fourth row of topping rollers 31c. The outer diameter of at least two rows of the topping rollers 31c from the upstream side in the conveying direction A1 should be gradually increased. , more preferred. Further, when the top roller 31c is rotationally driven, it is preferable that the top roller 31c having a different outer diameter is rotationally driven at the same peripheral speed, more preferably the same peripheral speed as the roller 31a.

In this embodiment as described above, both ends of the warped substrate W are pressed from above by the pressing rollers 31B, and the warping is corrected by driving the conveying rollers 31A and the pressing rollers 31B that support the substrate W from below. The substrate W can be transported by Then, the outer diameter of the upper roller 31c of the pressing roller 31B is increased in several rows along the conveying direction A1 from the row of the upper roller 31c that contacts the warped substrate W first. As a result, the separation distance between the top roller 31c and the roller 31a becomes narrower along the conveying direction A1, thereby reducing the risk of damage to the warped substrate W due to rapid correction.

The distance between the shafts 31b and 31d does not necessarily have to be constant, but if the distance is constant, the structure for supporting the shafts 31b and 31d can be simplified compared to the case where the distance is changed. . Furthermore, by replacing the roller 31c with a roller 31c having a different outer diameter, it is possible to easily adjust the gap between the roller 31c and the roller 31a.

As shown in FIG. 7, when the pressure roller 31B has an O-ring 31e in a groove provided on the outer periphery of the top roller 31c, the outer diameter of the O-ring 31e in the pressure roller 31B for each set is By increasing along the conveying direction A1, the separation distance between the conveying roller 31A and the pressing roller 31B for each set may have a portion shortened along the conveying direction A1. In this embodiment, the outer diameter of the O-ring 31e corresponds to the outer diameter of the pressing roller 31B, and the distance between the roller 31a and the O-ring 31e corresponds to the distance between the conveying roller 31A and the pressing roller 31B.

In this mode, the outer diameter of the top roller 31c is kept constant, and the outer diameter of the O-ring 31e is gradually increased along the conveying direction A1, thereby gradually increasing the distance between the conveying roller 31A and the pressing roller 31B. It has a smaller portion. The outer diameter referred to here is the diameter of the outer circumference circle in a cross section perpendicular to the axis of the O-ring 31e. Assuming that the length in the radial direction of the O-ring 31e is the thickness and the length in the axial direction is the width, the thickness of the O-ring 31e gradually increases along the transport direction A1.

Also in this mode, the separation distance between the pressing roller 31B and the conveying roller 31A gradually narrows along the conveying direction A1, so the risk of damage to the warped substrate W due to rapid correction is reduced. In addition, although the outer diameter of the top roller 31c does not necessarily have to be constant, if the outer diameter is constant, the pressing roller 31B and the conveying roller 31A can be easily separated by simply replacing the O-ring 31e with a different outer diameter. The interval can be easily adjusted, and the cost can be suppressed.

<Fourth Embodiment>
A fourth embodiment will be described with reference to FIGS. 8 to 11. FIG. In addition, in this embodiment, the difference from the first to third embodiments (the distance between the pair of top rollers 31c) will be explained, and other explanations will be omitted. In this embodiment, the distance between the pair of top rollers 31c corresponds to the distance between the pair of pressing rollers 31B.

This embodiment has a portion where the distance between the pair of top rollers 31c arranged in the direction perpendicular to the transport direction A1 is longer along the transport direction A1. In the present embodiment, the distance between the pair of top rollers 31c facing each other in the direction perpendicular to the transport direction A1 is set to the top roller 31c that first contacts the warped substrate W, that is, the top roller 31c positioned most upstream in the transport direction A1. , in order along the conveying direction A1.

For example, the distance between the pair of topping rollers 31c in the row that contacts the substrate W first is the narrowest, and the distances between the topping rollers 31c and several rows of the topping rollers 31c gradually widen along the transport direction A1 to reach the maximum width. After the pair of top rollers 31c in the adjacent row, the interval is constant.

In the example of FIG. 8, the distance between the four pairs of top rollers 31c including the row that contacts the substrate W first gradually increases along the transport direction A1 until a constant distance from the fourth top roller 31c. It has become. It is sufficient that the spacing between the pair of topping rollers 31c in at least two rows is gradually increased, but it is more preferable that the spacing between the paired topping rollers 31c in three or more rows is gradually increased. Further, as shown in FIG. 9A, the narrowest distance between the pair of top rollers 31c is such that even when the width of the substrate W in the direction perpendicular to the transport direction A1 is shortened due to warpage of the substrate W, It is preferable that the distance is such that both end regions of the upper surface of the are in contact with each other. Furthermore, as shown in FIG. 9(B), it is preferable that the constant spacing between the pair of top rollers 31c is a spacing that contacts both end regions of the flattened upper surface of the substrate W. As shown in FIG. In this embodiment, the distance between the shaft 31b of the conveying roller 31A and the shaft 31d of the pressing roller 31B is set from the position shown in FIG. 9A to the position shown in FIG. It becomes narrower toward the position shown in (B).

In this embodiment as described above, both ends of the warped substrate W are pressed from above by the pressing rollers 31B, and the warping is corrected by driving the conveying rollers 31A and the pressing rollers 31B that support the substrate W from below. The substrate W can be transported by Then, the interval between the pair of top rollers 31c is widened in several rows along the transport direction A1 from the pair of top rollers 31c in the row that contacts the warped substrate W first. As a result, the end portion of the substrate W whose width is narrowed due to the warp is pressed by the upper roller 31c, and the warp can be corrected and the substrate W can be transported.

That is, as shown in FIG. 9A, in the case of the substrate W warped in the direction orthogonal to the transport direction A1, the width in the direction orthogonal to the transport direction A1 is narrow. Then, if the spacing between the pair of top rollers 31c is set according to the width of the substrate W that does not have warpage (see FIG. 9B), the top rollers 31c may not be able to press the edge of the substrate W. have a nature. In the present embodiment, the gap between the pair of top rollers 31c in the row that first contacts the warped substrate W is narrow, and then the gaps between the pair of top rollers 31c in several rows are widened in order, so that the edge of the warped substrate W is can be pressed to correct the warp. Furthermore, by combining this embodiment with the first, second, or third embodiment, it is possible to correct the substrate W warped in both the transport direction A1 and the direction orthogonal to the transport direction A1. .

As shown in FIG. 10, the pressing roller 31B has an O-ring 31e in a groove provided on the outer circumference of the top roller 31c. may have a portion that increases along the transport direction A1. In this embodiment, the widths of the O-rings 31e of the upper rollers 31c in the row that first contacts the warped substrate W and the upper rollers 31c in several rows increase in order along the transport direction A1.

In the example of FIG. 10, the width of the O-rings 31e of the pressing rollers 31B in three rows from the top roller 31c that contacts the substrate W first is small, and the width of the O-rings 31e in the fourth row is wide. The width of the O-rings 31e of at least two rows of the top rollers 31c should be gradually increased. Further, as shown in FIG. 11A, the width of the narrowest O-ring 31e is the same as that of the upper surface of the substrate W even when the width in the direction orthogonal to the transport direction A1 is reduced due to the warp of the substrate W. , but preferably has a width that does not contact the pattern P such as a circuit formed on the substrate W. As shown in FIG. Further, as shown in FIG. 11B, it is preferable that the widened width of the O-ring 31e is such that it contacts both end regions of the flattened upper surface of the substrate W but does not contact the pattern P. As shown in FIG. Also in this aspect, the distance between the shaft 31b of the conveying roller 31A and the shaft 31d of the pressing roller 31B is changed from the position shown in FIG. 11A to the position shown in FIG. B) becomes narrower as it goes to the position shown in FIG.

In this manner, as shown in FIG. 11(A), the non-pattern formation portion other than the pattern P on the warped substrate W, which has a narrower area when viewed from above due to the warp of the substrate W, is It is possible to prevent contact between the O-ring 31e and the pattern P formed on the substrate W while allowing the upper roller 31c to press the substrate W, thereby performing the transport.

<Fifth Embodiment>
A fifth embodiment will be described with reference to FIGS. 12 and 13. FIG. In addition, in the fifth embodiment, the difference from the first to fourth embodiments (the aspect of the top roller 31c in the vicinity of the gas blowing section 51) will be explained, and other explanations will be omitted. In this embodiment as well, the outer diameter of the roller 31a corresponds to the outer diameter of the conveying roller 31A, the outer diameter of the top roller 31c corresponds to the outer diameter of the pressing roller 31B, and the distance between the roller 31a and the top roller 31c corresponds to the outer diameter of the conveying roller 31a. This corresponds to the distance between the roller 31A and the pressing roller 31B, and the distance between the gas blowing portion 51 and the additional roller 31c corresponds to the distance between the gas blowing portion 51 and the pressing roller 31B.

In this embodiment, as shown in FIG. 12, in the drying section 50, the separation distance between the roller 31a and the top roller 31c becomes shorter along the conveying direction A1 from the downstream side of the conveying direction A1 of the gas blowing section 51. have a part For example, the outer diameter of the top roller 31c in the row closest to the gas blowing portion 51 downstream of the gas blowing portion 51 in the conveying direction A1 is the smallest, and the separation distance from the roller 31a is the largest. It is preferable that the maximum separation distance be longer than the warp amount of the substrate W. FIG. The separation distance between the rollers 31a and the rollers 31c arranged in several rows from the roller 31c with the smallest outer diameter gradually decreases along the conveying direction A1, and then becomes constant. It is preferable that the constant separation distance be a predetermined distance that allows the substrate to be transported with a thickness of the substrate W or less.

In the example of FIG. 12, the outer diameter of the top-up roller 31c in the row closest to the gas blowing section 51 is smaller than the other top-up rollers 31c, and the distance between the top-up rollers 31c and the rollers 31a in the three downstream rows is larger than the distance between the rollers 31a and 31c. It gradually becomes smaller along the direction A1, and the separation distance from the roller 31c and the roller 31a in the fourth row from the row closest to the gas blowing part 51 is constant. It is sufficient that the separation distance between at least two rows of rollers 31c and rollers 31a is gradually reduced. The separation distance may be adjusted by changing the position of the shaft 31d of the pressing roller 31B or by changing the outer diameter of the pressing roller 31B, as shown in the above embodiment. When changing the outer diameter of the pressing roller 31B, the outer diameter of the top roller 31c may be changed, or the outer diameter of the O-ring 31e may be changed.

In the present embodiment, the distance between the additional roller 31c and the roller 31a downstream of the gas blowing section 51 is gradually narrowed along the conveying direction A1, thereby reducing the risk of damage to the warped substrate W due to rapid correction. can be transported. Further, in the above-described embodiment, the presence of the gas blowing portion 51 widens the interval in the conveying direction A1 between the top rollers 31c (see FIGS. 4 and 5). However, in the present embodiment, an additional roller 31c having a small outer diameter is arranged at the position closest to the gas blowing section 51, and the warped portion of the substrate W having a large amount of warp can be pressed by the additional roller 31c. and Furthermore, since the warped portion of the substrate W can be pressed by the upper roller 31c while the distance between the gas blowing portion 51 and the additional roller 31c is reduced, the substrate W can be prevented from coming into contact with the gas blowing portion 51 and being damaged.

As shown in FIG. 13, in the drying section 50, while keeping the distance between the top roller 31c and the roller 31a constant, a roller having a smaller outer diameter than the other top rollers 31c is placed at the position closest to the gas blowing section 51. A top roller 31c having an outer diameter may be arranged. In this case as well, the distance between the gas blowing part 51 and the top roller 31c can be reduced to press the substrate W, so that the substrate W can be prevented from coming into contact with the gas blowing part 51 and being damaged.

<Other embodiments>
In the above description, as the substrate processing apparatus 10, a cleaning processing apparatus for cleaning the substrate W and a drying processing apparatus for drying the substrate W are exemplified. For manufacturing the mask, for example, a resist processing device, an exposure processing device, a development processing device, an etching processing device, and a stripping processing device may be used. Various chemical solutions can be used as the treatment liquid.

In the above description, the substrate W is conveyed in a horizontal state as an example, but the present invention is not limited to this. The substrate W may be conveyed while being tilted with one end in the width direction being higher than the other end.

In the above description, the straightening process and the cleaning process are performed in different processing chambers, but the present invention is not limited to this, and the straightening process and the cleaning process may be performed in the same processing chamber. A cleaning process is performed after the treatment.

Further, in the above description, a measurement unit for measuring the amount of warpage of the substrate W and a moving mechanism for lifting and lowering each pressing roller 31B are provided, and each pair of transport rollers 31A is arranged according to the amount of warpage of the substrate W measured by the measurement unit. and the separation distance of the pressing roller 31B may be adjusted. For example, when the amount of warpage of the substrate W measured by the measurement unit is larger than a predetermined value, the pressing roller 31B is lifted by the moving mechanism according to the difference between them, and a set of substrates positioned most upstream in the transport direction A1 is placed. The separation distance between the transport rollers 31A and the pressing rollers 31B is made larger than the measured amount of warping of the substrate W, and accordingly, the other sets of transporting rollers 31A and 31B are arranged so that the warped substrate W is gradually pressed by the pressing rollers 31B. The separation distance of the pressing roller 31B is also adjusted. Conversely, when the amount of warpage of the substrate W measured by the measurement unit is smaller than the predetermined value, the pair of transport rollers 31A and the presser rollers 31B positioned most upstream in the transport direction A1 is determined according to the difference between them. The separation distance is brought close to the measured amount of warp of the substrate W (under the condition that it is equal to or greater than the amount of warp), and accordingly, the warped substrate W is gradually pressed by each of the pressing rollers 31B. The distance between the rollers 31B is also adjusted.

Further, in the above description, the cleaning liquid from each liquid ejecting section 41 is ejected so as to avoid each conveying roller 31A, but the present invention is not limited to this, and the cleaning liquid may be supplied to the conveying roller 31A. .

Further, in the above description, the substrate W that is warped on all sides (the substrate W that is warped on all four sides) is described as an object, but the present invention is not limited to this. The present invention is applicable even if there is

Alternatively, a belt may be wound around the pressing roller 31B to form a roller conveyor. By adopting such a configuration, the contact area against the warp of the substrate W is increased compared to the case where only the pressing roller 31B is used. It becomes possible to correct the warp.

In the above description, the separation distance between the conveying roller 31A and the pressing roller 31B is gradually reduced one row at a time. It may be configured so that it becomes smaller.

Although several embodiments of the invention have been described above, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof.

10 Substrate processing device 30 Transfer unit (substrate transfer device)
31A Conveying roller 31B Pressing roller 31a Roller 31b, 31d Shaft 31c Topping roller 31e O-ring 40 Liquid supply unit 50 Drying unit 60 Control unit A1 Conveying direction H1 Conveying path W Substrate

Claims (11)

a plurality of transport rollers for transporting a warped substrate;
a plurality of pressing rollers provided so as to be spaced apart from each of the plurality of transport rollers and pressing the substrate transported by the plurality of transport rollers;
with
The conveying rollers and the pressing rollers that face and are separated from each other form one set, and a plurality of sets are arranged along the conveying direction of the substrate,
The separation distance between the conveying rollers and the pressing rollers for each set is shortened along the conveying direction of the substrate by increasing the outer diameter of the pressing roller for each set along the conveying direction of the substrate. A substrate transport apparatus having a portion. a plurality of transport rollers for transporting a warped substrate;
a plurality of pressing rollers provided to face and be spaced apart from the plurality of transport rollers, respectively, and press the substrate transported by the plurality of transport rollers;
with
The pressing roller has a top-up roller and an O-ring provided on the outer periphery of the top-up roller,
The conveying rollers and the pressing rollers that face and are separated from each other form one set, and a plurality of sets are arranged along the conveying direction of the substrate,
The separation distance between the conveying rollers and the pressing rollers for each set is increased along the conveying direction of the substrate by increasing the outer diameter of the O-ring in the pressing rollers for each set along the conveying direction of the substrate. substrate transport apparatus having a shortened portion. 3. The substrate transport according to claim 1 , wherein a distance between the set of transport rollers and the pressing roller positioned most upstream in the transport direction of the substrate is longer than an amount of warpage of the substrate. Device. The pressing roller has a pair of overlaying rollers spaced apart in a direction orthogonal to the conveying direction of the substrate,
3. The substrate conveying apparatus according to claim 1 , wherein the pair of top rollers has a portion where the distance between them is longer along the conveying direction of the substrate. The pressing roller has a top-up roller and an O-ring provided on the outer periphery of the top-up roller,
4. The substrate conveying apparatus according to claim 1, wherein the width of said O-ring in said pressing roller for each set has a portion that increases along the conveying direction of said substrate. a substrate transfer apparatus according to any one of claims 1 to 5 ;
a liquid supply unit that supplies a processing liquid to the substrate transported by the substrate transport device;
A substrate processing apparatus comprising: a substrate transfer apparatus according to any one of claims 1 to 6 ;
a drying unit that dries the substrate transported by the substrate transport device;
A substrate processing apparatus comprising: The separation distance between the set of the transport rollers and the pressure roller positioned most upstream in the transport direction of the substrate in the drying processing chamber in which the drying section is provided is 8. The substrate processing apparatus according to claim 7 , wherein the distance between the pressing rollers is the longest. The separation distance between the set of the transport rollers and the pressing roller positioned most upstream in the transport direction of the substrate in the drying processing chamber in which the drying section is provided is the most upstream in the transport direction of the substrate in the substrate transport device. 9. The substrate processing apparatus according to claim 8 , wherein the distance between a pair of said conveying rollers and said pressing rollers located at . The drying unit has a gas blowing unit,
10. The substrate according to any one of claims 7 to 9 , further comprising a portion where a separation distance between the conveying roller and the pressing roller becomes shorter along the substrate conveying direction from a position downstream of the gas blowing portion in the substrate conveying direction. The substrate processing apparatus according to . 11. The substrate processing apparatus according to claim 10 , wherein the outer diameter of the pressing roller closest to the gas blowing portion from the downstream of the gas blowing portion in the substrate conveying direction is smaller than the outer diameter of the other pressing rollers.

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