KR200331986Y1 - substrate processing equipment having one process line capable of handling plural substrates simultaneously - Google Patents
substrate processing equipment having one process line capable of handling plural substrates simultaneously Download PDFInfo
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- KR200331986Y1 KR200331986Y1 KR20-2003-0021576U KR20030021576U KR200331986Y1 KR 200331986 Y1 KR200331986 Y1 KR 200331986Y1 KR 20030021576 U KR20030021576 U KR 20030021576U KR 200331986 Y1 KR200331986 Y1 KR 200331986Y1
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- 239000000758 substrate Substances 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 37
- 235000012431 wafers Nutrition 0.000 claims abstract description 25
- 238000004380 ashing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
개시된 본 고안은 반도체 기판 처리를 위해 각 유닛들이 형성된 원(one) 라인 상부에 복수의 반도체 기판이 위치될 수 있도록 하여 하나의 유닛에서 복수의 반도체 기판에 대해 동일 공정이 이루어질 수 있도록 하기 위한 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치에 관한 것으로서, 기판처리장치에 있어서, 복수의 기판 또는 반도체 웨이퍼를 동시에 이송할 수 있는 기판 또는 반도체 웨이퍼 이송로봇; 상기 기판 또는 반도체 웨이퍼 이송로봇에 의해 장입된 복수의 기판에 해당 공정이 이루어질 수 있도록 하는 복수의 처리유닛; 을 포함하여 이루어진 것을 특징으로 한다.The disclosed subject matter allows a plurality of semiconductor substrates to be positioned above a one line on which each unit is formed for processing a semiconductor substrate, so that a plurality of semiconductor substrates may be processed in one unit. A substrate processing apparatus having one line capable of simultaneously processing a substrate, the substrate processing apparatus comprising: a substrate or semiconductor wafer transfer robot capable of simultaneously transferring a plurality of substrates or semiconductor wafers; A plurality of processing units for performing a corresponding process on a plurality of substrates loaded by the substrate or the semiconductor wafer transfer robot; Characterized in that consisting of.
Description
본 고안은 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치에 관한 것이다.The present invention relates to a substrate processing apparatus having a circle line capable of simultaneously processing a plurality of substrates.
보다 상세하게는 반도체 기판 처리를 위해 각 유닛들이 형성된 원(one) 라인상부에 복수의 반도체 기판이 위치될 수 있도록 하여 하나의 유닛에서 복수의 반도체 기판에 대해 동일 공정이 이루어 질 수 있도록 하기 위한 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치에 관한 것이다.More specifically, a plurality of semiconductor substrates may be disposed on a line where each unit is formed for processing a semiconductor substrate, such that the same process may be performed on a plurality of semiconductor substrates in one unit. A substrate processing apparatus having a one line capable of simultaneously processing a substrate of.
일반적으로 액정표시장치 또는 플라즈마 표시장치용의 유리기판(FPD기판)이나 반도체 웨이퍼 등의 제조 공정에 있어서는, 기판의 표면에 포토레지스트 막을 형성시켜 기판 상부에 원하는 패턴을 형성시킨다. 이때 상기 포토레지스트 막은 에싱 공정에 의해 제거된다. 상기 에싱 공정 등을 처리하는 기판처리장치는 원(one) 라인을 갖는 경우와 더블(double) 라인을 갖는 경우로 나눌 수 있으며, 상기 원 라인의 경우 다수의 처리 유닛들이 하나씩 구비되어 있다. 그러므로 상기 원 라인을 통해 기판 또는 반도체 웨이퍼를 한 장씩 이송시키면서 각 처리공정이 이루어질 수 있도록 해야 한다.In general, in a manufacturing process such as a glass substrate (FPD substrate) or a semiconductor wafer for a liquid crystal display device or a plasma display device, a photoresist film is formed on the surface of the substrate to form a desired pattern on the substrate. At this time, the photoresist film is removed by an ashing process. The substrate processing apparatus for processing the ashing process and the like can be divided into a case having one line and a case having a double line. In the case of the one line, a plurality of processing units are provided one by one. Therefore, each process must be carried out while transferring the substrate or semiconductor wafer one by one through the circle line.
따라서, 상기와 같은 원 라인을 갖는 기판처리장치의 경우 그 처리 속도가 느리다는 문제점이 있었다.Therefore, there is a problem that the processing speed is slow in the case of the substrate processing apparatus having the one line as described above.
상기 더블(double) 라인을 갖는 기판처리장치는 상기 원(one) 라인을 갖는 기판처리장치에서 각 공정의 처리속도가 늦다는 문제점을 해결하기 위한 기판처리장치로서, 한번에 두장의 기판 또는 반도체 웨이퍼를 처리할 수 있도록 구축된 장치이므로, 처리 공정 시간을 감소시킬 수는 있으나, 첨부 도면 도 1에 도시된 바와 같이 두장의 기판 또는 반도체 웨이퍼를 처리할 수 있는 유닛들이 각각의 라인에 구비되어야 하므로, 초기 시설비 및 처리비가 많이 소모된다는 문제점이 있었다.The substrate processing apparatus having the double line is a substrate processing apparatus for solving the problem that the processing speed of each process is slow in the substrate processing apparatus having the one line, and includes two substrates or semiconductor wafers at once. Since the device is built to be capable of processing, processing time can be reduced, but as shown in FIG. 1, units capable of processing two substrates or semiconductor wafers must be provided in each line. There was a problem that a lot of facility and processing costs are consumed.
따라서, 본 고안은 상기한 종래기술의 문제점을 감안하여 안출된 것으로서, 본 고안의 목적은, 반도체 기판 처리를 위해 각 유닛들이 형성된 원(one) 라인 상부에 복수의 반도체 기판이 위치될 수 있도록 하여 하나의 유닛에서 복수의 반도체 기판에 대해 동일 공정이 이루어 질 수 있도록 하기 위한 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치를 제공하는데 있다.Accordingly, the present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to allow a plurality of semiconductor substrates to be positioned above a one line on which each unit is formed for processing a semiconductor substrate. The present invention provides a substrate processing apparatus having a circle line capable of simultaneously processing a plurality of substrates so that the same process can be performed on a plurality of semiconductor substrates in one unit.
도 1은 일반적인 기판처리장치를 설명하기 위한 도면,1 is a view for explaining a general substrate processing apparatus,
도 2 및 도 3은 본 고안이 적용된 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치를 설명하기 위한 도면이다.2 and 3 are views for explaining a substrate processing apparatus having a circle line capable of simultaneously processing a plurality of substrates to which the present invention is applied.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
10 : 기판 또는 반도체 웨이퍼 이송로봇10: substrate or semiconductor wafer transfer robot
20 : 더블(double) 라인20 double line
30 : 원(one) 라인30: one line
40 : 기판 또는 반도체 웨이퍼40: substrate or semiconductor wafer
상기한 기술적 과제를 해결하기 위한 본 고안은, 기판처리장치에 있어서, 복수의 기판 또는 반도체 웨이퍼를 동시에 이송할 수 있는 기판 또는 반도체 웨이퍼 이송로봇; 상기 기판 또는 반도체 웨이퍼 이송로봇에 의해 장입된 복수의 기판에 해당 공정이 이루어질 수 있도록 하는 복수의 처리유닛; 을 포함하여 이루어진 것을 특징으로 하는 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치로서, 상술한 과제를 해결한다.The present invention for solving the above technical problem, in the substrate processing apparatus, a substrate or semiconductor wafer transfer robot capable of simultaneously transferring a plurality of substrates or semiconductor wafers; A plurality of processing units for performing a corresponding process on a plurality of substrates loaded by the substrate or the semiconductor wafer transfer robot; A substrate processing apparatus having a circle line capable of simultaneously processing a plurality of substrates, comprising: a solution to the above problems.
또한, 상기 원 라인의 폭은, 2장의 기판 또는 반도체 웨이퍼가 놓여져 이송될 수 있는 폭인 것을 특징으로 하는 원 라인을 갖는 기판처리장치로서, 상술한 과제를 해결한다.In addition, the width of the circle line is a substrate processing apparatus having a circle line, characterized in that the width of two substrates or semiconductor wafers can be placed and transported, solving the above problems.
이하, 첨부한 도면들을 참조하여 본 고안의 바람직한 실시예에 대해 설명한다.Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.
도 2 및 도 3은 본 고안이 적용된 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치를 설명하기 위한 도면이다.2 and 3 are views for explaining a substrate processing apparatus having a circle line capable of simultaneously processing a plurality of substrates to which the present invention is applied.
본 고안은 도 2 및 도 3에 도시된 바와 같이, 원 라인을 갖는 기판처리장치는 복수의 기판 또는 반도체 웨이퍼(40)를 동시에 이송할 수 있는 기판 또는 반도체 웨이퍼 이송로봇(10)과, 상기 기판 또는 반도체 웨이퍼 이송로봇(10)에 의해 장입된 복수의 기판 또는 반도체 웨이퍼에 해당 공정이 이루어질 수 있도록 하는 처리유닛(30)으로 이루어진다.2 and 3, a substrate processing apparatus having a one-line includes a substrate or semiconductor wafer transfer robot 10 capable of simultaneously transferring a plurality of substrates or semiconductor wafers 40, and the substrate. Or it consists of a processing unit 30 to allow a corresponding process to be performed on a plurality of substrates or semiconductor wafers loaded by the semiconductor wafer transfer robot (10).
또한, 상기 원 라인의 폭은, 2장의 기판 또는 반도체 웨이퍼가 놓여져 이송될 수 있는 폭이어야 한다.In addition, the width of the circle line should be a width to which two substrates or semiconductor wafers can be placed and transported.
상기와 같이 이루어진 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는 기판처리장치의 동작은 다음과 같다.The operation of the substrate processing apparatus having a circle line capable of simultaneously processing a plurality of substrates made as described above is as follows.
첨부 도면 도 2에 도시된 바와 같이 기판 또는 반도체 웨이퍼 이송로봇(10) 각각이 한 장의 기판 또는 반도체 웨이퍼(40)를 동시에 이송 라인에 접속되어 설치된 다수의 처리 유닛 중 최초 공정을 수행하는 처리유닛에 장입시키면, 상기 이송 라인에 놓여진 2장의 기판 또는 반도체 웨이퍼(40)는 이송 라인이 이송됨에 따라 각 처리 유닛으로 장입되어 해당 공정처리가 이루어질 수 있도록 한다.As shown in FIG. 2, each of the substrate or semiconductor wafer transfer robot 10 is connected to a substrate or semiconductor wafer 40 at the same time in a transfer line to a processing unit that performs an initial process among a plurality of processing units installed. When charged, the two substrates or the semiconductor wafers 40 placed on the transfer line are loaded into each processing unit as the transfer line is transferred to allow the corresponding process to be performed.
본 고안은 반도체 기판 처리를 위해 각 유닛들이 형성된 원(one) 라인 상부에 복수의 반도체 기판이 위치될 수 있도록 하여 하나의 유닛에서 복수의 반도체 기판이 동일한 공정을 수행할 수 있도록 하여, 초기 시설비 및 처리비용을 30% 정도 절감할 수 있을 뿐만 아니라, foot print를 57%이상을 감소시킬 수 있어 생산효율을 증대시킬 수 있다는 효과가 있다.The present invention allows a plurality of semiconductor substrates to be positioned above the one line on which each unit is formed for processing a semiconductor substrate, thereby allowing a plurality of semiconductor substrates to perform the same process in one unit, thereby providing an initial facility cost and Not only can the processing cost be reduced by 30%, but the foot print can be reduced by more than 57%, which increases the production efficiency.
본 고안은 상기 실시예에만 한정되지 않으며, 본 고안의 기술적 사상 내에서 당 분야의 통상의 지식을 가진 자에 의해 많은 변형이 가능함은 명백하다.The present invention is not limited to the above embodiments, and it is apparent that many modifications are possible by those skilled in the art within the technical idea of the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0021576U KR200331986Y1 (en) | 2003-07-04 | 2003-07-04 | substrate processing equipment having one process line capable of handling plural substrates simultaneously |
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| Application Number | Priority Date | Filing Date | Title |
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| KR20-2003-0021576U KR200331986Y1 (en) | 2003-07-04 | 2003-07-04 | substrate processing equipment having one process line capable of handling plural substrates simultaneously |
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| KR200331986Y1 true KR200331986Y1 (en) | 2003-11-03 |
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| KR20-2003-0021576U Expired - Lifetime KR200331986Y1 (en) | 2003-07-04 | 2003-07-04 | substrate processing equipment having one process line capable of handling plural substrates simultaneously |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100810809B1 (en) * | 2005-08-05 | 2008-03-06 | 동경 엘렉트론 주식회사 | Substrate Feeder, Substrate Feeder Method and Storage Media |
| US7458469B2 (en) | 2005-08-05 | 2008-12-02 | Tokyo Electron Limited | Substrate transfer apparatus and method, and storage medium |
| KR101442334B1 (en) * | 2011-08-30 | 2014-09-23 | 다이니폰 스크린 세이조우 가부시키가이샤 | Substrate processing apparatus |
| WO2014189788A1 (en) * | 2013-05-20 | 2014-11-27 | Varian Semiconductor Equipment Associates, Inc. | System and method for quick-swap of multiple substrates |
-
2003
- 2003-07-04 KR KR20-2003-0021576U patent/KR200331986Y1/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100810809B1 (en) * | 2005-08-05 | 2008-03-06 | 동경 엘렉트론 주식회사 | Substrate Feeder, Substrate Feeder Method and Storage Media |
| US7458469B2 (en) | 2005-08-05 | 2008-12-02 | Tokyo Electron Limited | Substrate transfer apparatus and method, and storage medium |
| KR101442334B1 (en) * | 2011-08-30 | 2014-09-23 | 다이니폰 스크린 세이조우 가부시키가이샤 | Substrate processing apparatus |
| WO2014189788A1 (en) * | 2013-05-20 | 2014-11-27 | Varian Semiconductor Equipment Associates, Inc. | System and method for quick-swap of multiple substrates |
| US9669552B2 (en) | 2013-05-20 | 2017-06-06 | Varian Semiconductor Equipment Associates, Inc. | System and method for quick-swap of multiple substrates |
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