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CN203085512U - 伺服放大器 - Google Patents

伺服放大器 Download PDF

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Publication number
CN203085512U
CN203085512U CN2012207066970U CN201220706697U CN203085512U CN 203085512 U CN203085512 U CN 203085512U CN 2012207066970 U CN2012207066970 U CN 2012207066970U CN 201220706697 U CN201220706697 U CN 201220706697U CN 203085512 U CN203085512 U CN 203085512U
Authority
CN
China
Prior art keywords
mentioned
fin
heat
conducting plate
interarea
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012207066970U
Other languages
English (en)
Chinese (zh)
Inventor
泷川宏
奥秋兼一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Application granted granted Critical
Publication of CN203085512U publication Critical patent/CN203085512U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2012207066970U 2012-01-11 2012-12-19 伺服放大器 Expired - Fee Related CN203085512U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012003103A JP5249434B2 (ja) 2012-01-11 2012-01-11 直交する２組の放熱フィンを有する放熱用ヒートシンクを備えたサーボアンプ
JP2012-003103 2012-01-11

Publications (1)

Publication Number Publication Date
CN203085512U true CN203085512U (zh) 2013-07-24

Family

ID=48743111

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2012105552979A Pending CN103208468A (zh) 2012-01-11 2012-12-19 伺服放大器
CN2012207066970U Expired - Fee Related CN203085512U (zh) 2012-01-11 2012-12-19 伺服放大器

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN2012105552979A Pending CN103208468A (zh) 2012-01-11 2012-12-19 伺服放大器

Country Status (4)

Country Link
US (1) US20130175021A1 (ja)
JP (1) JP5249434B2 (ja)
CN (2) CN103208468A (ja)
DE (1) DE102013000223A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377828B2 (en) * 2013-08-12 2016-06-28 Dell Products L.P. Adjustable heat sink supporting multiple platforms and system configurations
US20150257249A1 (en) * 2014-03-08 2015-09-10 Gerald Ho Kim Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same
JP2017098274A (ja) * 2014-03-27 2017-06-01 三菱電機株式会社 ヒートシンク装置
WO2015157523A1 (en) * 2014-04-10 2015-10-15 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
CN104602500A (zh) * 2015-01-30 2015-05-06 周玉翔 一种温度可视双层散热片
JP6126149B2 (ja) * 2015-02-26 2017-05-10 ファナック株式会社 放熱フィンを有する熱伝導部材を備えた空冷式レーザ装置
JP6062516B1 (ja) * 2015-09-18 2017-01-18 古河電気工業株式会社 ヒートシンク
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
CN109716512B (zh) * 2016-09-21 2021-08-03 华为技术有限公司 散热器
US20180106500A1 (en) * 2016-10-18 2018-04-19 Trane International Inc. Enhanced Tubular Heat Exchanger
US20180192545A1 (en) * 2017-01-03 2018-07-05 Quanta Computer Inc. Heat dissipation apparatus
JP6931716B2 (ja) 2017-04-21 2021-09-08 ケーエムダブリュ・インコーポレーテッド Ｍｉｍｏアンテナ装置
US11985797B2 (en) 2018-02-02 2024-05-14 Telefonaktiebolaget Lm Ericsson (Publ) Cooling device for dissipating heat from an object
JP6918765B2 (ja) * 2018-11-29 2021-08-11 ファナック株式会社 放熱装置
CN112911893B (zh) * 2020-12-25 2023-05-05 Oppo广东移动通信有限公司 散热器及电子设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138237Y2 (ja) * 1978-11-17 1986-11-05
JPS6130292U (ja) * 1984-07-26 1986-02-24 三菱アルミニウム株式会社 電気素子用放熱器
JP2685918B2 (ja) 1989-09-08 1997-12-08 古河電気工業株式会社 ヒートパイプ式冷却器
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
JP3431004B2 (ja) 2000-01-14 2003-07-28 松下電器産業株式会社 ヒートシンクおよびそれを用いた冷却装置
JP2006013296A (ja) * 2004-06-29 2006-01-12 Fuji Electric Holdings Co Ltd 半導体素子の冷却体
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
CN100543972C (zh) * 2005-08-08 2009-09-23 富准精密工业(深圳)有限公司 热管散热装置
JP2007180453A (ja) * 2005-12-28 2007-07-12 Nippon Densan Corp ヒートシンク冷却装置
US7690418B2 (en) * 2005-12-28 2010-04-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
JP5041346B2 (ja) * 2006-06-02 2012-10-03 株式会社安川電機 モータ制御装置
JP2009225497A (ja) * 2008-03-13 2009-10-01 Fanuc Ltd 電源回生機能を有するサーボアンプ

Also Published As

Publication number Publication date
US20130175021A1 (en) 2013-07-11
DE102013000223A1 (de) 2013-12-05
JP5249434B2 (ja) 2013-07-31
JP2013143488A (ja) 2013-07-22
CN103208468A (zh) 2013-07-17

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130724

Termination date: 20171219