JP6062516B1 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP6062516B1 JP6062516B1 JP2015185647A JP2015185647A JP6062516B1 JP 6062516 B1 JP6062516 B1 JP 6062516B1 JP 2015185647 A JP2015185647 A JP 2015185647A JP 2015185647 A JP2015185647 A JP 2015185647A JP 6062516 B1 JP6062516 B1 JP 6062516B1
- Authority
- JP
- Japan
- Prior art keywords
- heat
- base plate
- radiating fin
- heat sink
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/34—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
10 ベースプレート
11、51 第1の放熱フィン
12、42 第2の放熱フィン
13、33、53 第3の放熱フィン
14、24、44 ヒートパイプ
17、57 第1の放熱フィン群
18、48 第2の放熱フィン群
19、39、59 第3の放熱フィン群
Claims (6)
- 発熱体と熱的に接続される平板状のベースプレートと、側面視U字状、側面視L字状または側面視コ字状である熱伝導部材を介して該ベースプレートと熱的に接続された第1の放熱フィンと、該第1の放熱フィンの側端部と隣接した、端部が該ベースプレートに取り付けられていることで該ベースプレートと熱的に接続された第2の放熱フィンと、該第2の放熱フィンの側端部と隣接した、前記熱伝導部材を介して該ベースプレートと熱的に接続された第3の放熱フィンと、を有し、前記第1の放熱フィンの表面が、前記第2の放熱フィンの表面に対して平行ではなく、前記第3の放熱フィンの表面が、前記第2の放熱フィンの表面に対して平行ではないヒートシンクであって、
前記第2の放熱フィンの端部が取り付けられた前記ベースプレートの領域に、前記熱伝導部材が、前記ベースプレートに取り付けられており、
前記第2の放熱フィンの端部が取り付けられた前記ベースプレートの領域に、前記発熱体が熱的に接続されるヒートシンク。 - 複数枚の前記第1の放熱フィン及び複数枚の前記第3の放熱フィンが、前記ベースプレートの表面に対して鉛直方向に並べられ、複数枚の前記第2の放熱フィンが、前記ベースプレートの表面に対して平行方向に並べられている請求項1に記載のヒートシンク。
- 前記熱伝導部材が、ヒートパイプである請求項1または2に記載のヒートシンク。
- 前記第2の放熱フィンが、端部において前記ベースプレートと直接接することで熱的に接続されている請求項1乃至3のいずれか1項に記載のヒートシンク。
- 前記第2の放熱フィンの、前記ベースプレートに取り付けられた端部と対向する端部が、ヒートパイプを介して、前記ベースプレートと熱的に接続されている請求項1乃至4のいずれか1項に記載のヒートシンク。
- 請求項1乃至5のいずれか1項に記載のヒートシンクが2基設置されたヒートシンクであって、冷却風の風上側に配置された前記ヒートシンクの、第2の放熱フィンの高さが、冷却風の風下側に配置された前記ヒートシンクの第2の放熱フィンの高さよりも低いヒートシンク。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015185647A JP6062516B1 (ja) | 2015-09-18 | 2015-09-18 | ヒートシンク |
PCT/JP2016/077461 WO2017047756A1 (ja) | 2015-09-18 | 2016-09-16 | ヒートシンク |
CN201690001111.7U CN208970501U (zh) | 2015-09-18 | 2016-09-16 | 散热器 |
CN201821512703.2U CN209527029U (zh) | 2015-09-18 | 2016-09-16 | 散热器 |
TW109110734A TWI748393B (zh) | 2015-09-18 | 2016-09-19 | 散熱器 |
TW105130121A TWI692613B (zh) | 2015-09-18 | 2016-09-19 | 散熱器 |
US15/813,035 US10598441B2 (en) | 2015-09-18 | 2017-11-14 | Heat sink |
US16/460,878 US20190323779A1 (en) | 2015-09-18 | 2019-07-02 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015185647A JP6062516B1 (ja) | 2015-09-18 | 2015-09-18 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6062516B1 true JP6062516B1 (ja) | 2017-01-18 |
JP2017059768A JP2017059768A (ja) | 2017-03-23 |
Family
ID=57800030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015185647A Active JP6062516B1 (ja) | 2015-09-18 | 2015-09-18 | ヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (2) | US10598441B2 (ja) |
JP (1) | JP6062516B1 (ja) |
CN (2) | CN209527029U (ja) |
TW (2) | TWI692613B (ja) |
WO (1) | WO2017047756A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101780624B1 (ko) * | 2017-03-23 | 2017-09-21 | 송장섭 | 방열핀 융착형 히트싱크와 그 제조방법 및 제조장치. |
US20170303441A1 (en) * | 2016-04-15 | 2017-10-19 | Google Inc. | Cooling electronic devices in a data center |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015157523A1 (en) * | 2014-04-10 | 2015-10-15 | Advanced Thermal Solutions, Inc. | Multiple flow entrance heat sink |
JP6395914B1 (ja) * | 2017-08-31 | 2018-09-26 | 古河電気工業株式会社 | ヒートシンク |
JP2019152351A (ja) * | 2018-03-01 | 2019-09-12 | 古河電気工業株式会社 | ヒートシンク |
JP7157591B2 (ja) * | 2018-08-21 | 2022-10-20 | 古河電気工業株式会社 | ヒートシンク |
CN213907324U (zh) * | 2020-07-20 | 2021-08-06 | 双鸿电子科技工业(昆山)有限公司 | 具有防电磁波干扰的散热装置 |
EP4068930B1 (en) | 2021-04-01 | 2024-03-13 | Ovh | A rack system for housing an electronic device |
EP4068925A1 (en) | 2021-04-01 | 2022-10-05 | Ovh | Scissor structure for cable/tube management of rack-mounted liquid-cooled electronic assemblies |
CA3152605A1 (en) | 2021-04-01 | 2022-10-01 | Ovh | Systems and methods for autonomously activable redundant cooling of a heat generating component |
TWM628143U (zh) * | 2022-01-13 | 2022-06-11 | 華碩電腦股份有限公司 | 散熱裝置 |
CN218417125U (zh) * | 2022-02-18 | 2023-01-31 | 安徽维鸿电子科技有限公司 | 散热装置 |
Citations (9)
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JPS5351463A (en) * | 1976-10-20 | 1978-05-10 | Hitachi Ltd | Electronic device |
JPH07254794A (ja) * | 1994-03-16 | 1995-10-03 | Fujitsu Ltd | 冷却構造 |
JPH09223883A (ja) * | 1996-02-16 | 1997-08-26 | Hitachi Ltd | 電子機器の冷却装置 |
JP3104468B2 (ja) * | 1993-05-20 | 2000-10-30 | 松下電器産業株式会社 | 電気スチーマの制御装置 |
JP2008193007A (ja) * | 2007-02-07 | 2008-08-21 | Sankyo Material Inc | アルミ押出形材製ヒートシンク |
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JP2015164166A (ja) * | 2014-02-03 | 2015-09-10 | 水谷電機工業株式会社 | 放熱器及びその製造方法 |
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US7143819B2 (en) * | 2002-09-17 | 2006-12-05 | Hewlett-Packard Development Company, L.P. | Heat sink with angled heat pipe |
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WO2013142826A1 (en) * | 2012-03-23 | 2013-09-26 | Sapa Extrusions,Inc. | Cooling apparatus using stackable extruded plates |
-
2015
- 2015-09-18 JP JP2015185647A patent/JP6062516B1/ja active Active
-
2016
- 2016-09-16 CN CN201821512703.2U patent/CN209527029U/zh active Active
- 2016-09-16 WO PCT/JP2016/077461 patent/WO2017047756A1/ja active Application Filing
- 2016-09-16 CN CN201690001111.7U patent/CN208970501U/zh active Active
- 2016-09-19 TW TW105130121A patent/TWI692613B/zh active
- 2016-09-19 TW TW109110734A patent/TWI748393B/zh active
-
2017
- 2017-11-14 US US15/813,035 patent/US10598441B2/en active Active
-
2019
- 2019-07-02 US US16/460,878 patent/US20190323779A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5351463A (en) * | 1976-10-20 | 1978-05-10 | Hitachi Ltd | Electronic device |
JP3104468B2 (ja) * | 1993-05-20 | 2000-10-30 | 松下電器産業株式会社 | 電気スチーマの制御装置 |
JPH07254794A (ja) * | 1994-03-16 | 1995-10-03 | Fujitsu Ltd | 冷却構造 |
JPH09223883A (ja) * | 1996-02-16 | 1997-08-26 | Hitachi Ltd | 電子機器の冷却装置 |
JP2008193007A (ja) * | 2007-02-07 | 2008-08-21 | Sankyo Material Inc | アルミ押出形材製ヒートシンク |
JP2011103384A (ja) * | 2009-11-11 | 2011-05-26 | Fujitsu Ltd | ヒートシンク |
JP2012023146A (ja) * | 2010-07-13 | 2012-02-02 | Furukawa Electric Co Ltd:The | ヒートシンク |
JP5654180B2 (ja) * | 2012-12-14 | 2015-01-14 | 古河電気工業株式会社 | 冷却装置 |
JP2015164166A (ja) * | 2014-02-03 | 2015-09-10 | 水谷電機工業株式会社 | 放熱器及びその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170303441A1 (en) * | 2016-04-15 | 2017-10-19 | Google Inc. | Cooling electronic devices in a data center |
US10349561B2 (en) * | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
KR101780624B1 (ko) * | 2017-03-23 | 2017-09-21 | 송장섭 | 방열핀 융착형 히트싱크와 그 제조방법 및 제조장치. |
Also Published As
Publication number | Publication date |
---|---|
CN209527029U (zh) | 2019-10-22 |
TW202028685A (zh) | 2020-08-01 |
TWI692613B (zh) | 2020-05-01 |
WO2017047756A1 (ja) | 2017-03-23 |
TWI748393B (zh) | 2021-12-01 |
US20190323779A1 (en) | 2019-10-24 |
JP2017059768A (ja) | 2017-03-23 |
TW201719103A (zh) | 2017-06-01 |
US10598441B2 (en) | 2020-03-24 |
US20180080717A1 (en) | 2018-03-22 |
CN208970501U (zh) | 2019-06-11 |
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