CN202979452U - Plasma discharge device - Google Patents

Abstract

The utility model discloses a plasma discharge device, which comprises two radio frequency electrodes, a dielectric barrier layer, a gas uniform plate, a gas source, a radio frequency power supply and a metal shell; the radio frequency power supply is connected with the radio frequency electrode; the discharge device is in operation , the metal shell is grounded; the radio frequency electrode is covered by a dielectric barrier layer; the plasma nozzle is between the two radio frequency electrodes; the gas uniform plate is located above the dielectric barrier layer; the working gas provided by the gas source Through the constriction port formed by the gas uniform plate, it reaches the plasma nozzle, and under normal pressure, after the power is turned on, a large area of glow plasma is formed at the nozzle, and the plasma is carried by the airflow. Spray down and out. The utility model avoids the scattered discharge, improves the discharge efficiency, increases the air flow rate, increases the length of the plasma ejection nozzle, and reduces the requirements of the device on the shape of the material to be processed.

Description

plasma discharge device

technical field

The utility model relates to the technical field of silicon chip cleaning, in particular to a plasma discharge device.

Background technique

In semiconductor production, the process of cleaning photoresist on the surface of silicon wafers occupies a very important link. The quality of cleaning directly affects the stability and reliability of devices. In other industries, in addition to cleaning surface organic pollutants, the surface of liquid crystal glass panels, PCB boards and other materials also needs to improve the hydrophilicity or hydrophobicity of the material surface.

The traditional way to clean the surface of silicon wafers is to use wet chemical methods. There are many problems that need to be solved urgently in wet chemical methods, such as insufficient cleaning, the waste liquid generated by cleaning is easy to pollute the environment, the use of solutions is easy to introduce impurities, and consumes a lot of water. water and acid etc. At present, a dry cleaning device has appeared. This cleaning device works in a vacuum state. It is necessary to continuously cut off the equipment, take out the silicon wafers, put in another batch of silicon wafers, vacuumize, and then perform discharge cleaning, resulting in equipment operation. It is complicated and costly, and continuous online work cannot be realized; in addition, some atmospheric pressure cleaning technologies that have appeared use metal electrodes, which have the disadvantage of being easy to introduce metal impurities.

Utility model content

The technical problem to be solved by the utility model is to provide a plasma discharge device.

In order to solve the above technical problems, the utility model provides a plasma discharge device, which includes two radio frequency electrodes, a dielectric barrier, a gas uniform plate, a gas source, a radio frequency power supply and a metal casing; the radio frequency power supply and the radio frequency electrode connect;

When the discharge device is working, the metal casing is grounded;

The radio frequency electrode is covered by a dielectric barrier layer;

Between the two radio frequency electrodes is the plasma nozzle;

The gas distribution plate is located above the dielectric barrier layer;

The working gas provided by the gas source passes through the constriction port formed by the gas uniform plate, reaches the plasma nozzle, and under normal pressure, after the power is turned on, a large area of glow plasma is formed at the nozzle. body, the plasma is ejected outwards under the airflow.

Further, the gas homogenization plate is divided into three layers, wherein, the gas homogenization plate near the radio frequency electrodes is provided with an outlet for shrinking air flow, so that the working gas reaches the gap between the radio frequency electrodes after passing through the third outlet. spout.

Further, the first layer of gas uniform plate is composed of two gas uniform plates, a gas outlet is provided between the two gas uniform plates, and a gas outlet is provided between the two gas uniform plates and the metal shell;

The second layer of gas uniform plate is composed of a gas uniform plate, and gas outlets are arranged between the gas uniform plate and the metal shell;

The third layer of gas-distributing plates is composed of two said gas-distributing plates, and the two gas-distributing plates are respectively connected with the said metal shell, and an outlet for gas contraction flow is arranged between the two gas-distributing plates.

Further, the area of the outlet for gas contraction airflow provided on the third layer of gas uniform plate is smaller than the area between the two radio frequency electrodes.

Further, the two radio frequency electrodes are semicircular metal strips, and when the device is discharged, the plasma is only transferred along the semicircular arc surface.

Further, an insulating block with holes is provided on the surface of the metal shell, and the radio frequency power supply is connected to the radio frequency electrode through the insulating block.

In the plasma discharge device provided by the utility model, the two radio frequency electrodes are semicircular metal strips. When the device is in operation, the plasma is only transferred along the arc surface, which avoids scattered discharge, improves the discharge efficiency, and the shrinkage of the device The airflow outlet increases the airflow rate, and the plasma is sprayed to the material to be processed under the airflow, and reacts with the organic matter on the surface of the material to be processed to generate carbon dioxide and water, which can be directly discharged into the atmosphere. The atmospheric pressure dielectric barrier plasma discharge device is used to clean the photoresist on the surface of the silicon wafer, clean or activate the liquid crystal glass plate, clean or improve the hydrophilicity or hydrophobicity of the surface of the PCB board or other organic materials. The metal radio-frequency electrode of the utility model is covered by a dielectric barrier layer, and the metal shell and the radio-frequency electrode are also separated by the dielectric barrier layer, which can overcome the disadvantage of easy introduction of metal impurities in the prior art. Due to the use of the radio frequency electrode of the plate circular metal strip, the plasma generated by the discharge is transferred along the arc surface, which avoids the scattered discharge and improves the discharge efficiency. The length of the body ejection nozzle reduces the requirements of the device on the shape of the material to be processed.

Description of drawings

Fig. 1 is a schematic diagram of the principle of the plasma discharge device provided by the embodiment of the present invention.

Fig. 2 is an outline view of the plasma discharge device provided by the embodiment of the present invention.

Detailed ways

Referring to Fig. 1, the plasma discharge device provided by the embodiment of the present invention includes two semicircular radio frequency electrodes 107, a dielectric barrier layer 106 coated outside the radio frequency electrodes, a metal shell 104 as a ground electrode, a radio frequency electrode and a metal Dielectric barrier layer 112 between shells, three-layer gas uniform plate 105 inside the device, a radio frequency power supply 111 , gas source 101 , flow meter 102 and gas supply pipeline 103 . The two radio frequency electrodes 107 are in the form of semicircular metal strips. When the device discharges, the plasma only transfers along the arc surface, which improves the discharge efficiency and expands the contact area between the plasma and the surface of the material to be processed such as a silicon wafer.

In the three-layer gas distribution board 105, the first gas distribution board is composed of two gas distribution boards, and a gas outlet is arranged between the two gas distribution boards, and a gas outlet is arranged between the two gas distribution boards and the metal shell. All are equipped with gas outlets. The second layer of gas uniform plate is composed of one gas uniform plate, and gas outlets are evenly arranged between the gas uniform plate and the metal shell; the third layer of gas uniform plate is composed of two said gas uniform plates, and the two gas uniform plates are The gas plates are respectively connected to the metal shells, and an outlet for contracting gas flow is arranged between the two gas uniform plates, and the outlet is similar to an inverted "eight" shape.

The dielectric barrier layer 106 is an insulating material such as quartz or ceramics. The gas source 101 provides gases such as helium, argon, oxygen, nitrogen, carbon tetrafluoride or a mixture of several gases in a certain proportion. The gas enters the gas supply pipeline 103 after passing through the flow meter 102 , and the gas is evenly distributed after passing through two layers of gas uniform plates, and then passes through the third layer of gas uniform plates to shrink and accelerate, and then enters the nozzle between the two RF electrodes 107 . Under normal pressure, when the RF electrode 107 is connected to the RF power supply 111, after the power supply is connected, a large area of glow plasma 110 is formed at the nozzle, and the plasma 110 transfers along the arc surface of the electrode, and is driven by the airflow. Down, squirt out. When reaching the surface of the processed material 108 on the stage 109, it reacts with the photoresist or other organic matter on the surface of the processed material to generate products such as carbon dioxide and water. In addition to removing the photoresist or other organic matter on the substrate surface, this The device can also clean or modify the surfaces of liquid crystal glass plates and PCB boards.

Referring to Fig. 2, in this atmospheric pressure dielectric barrier plasma discharge device, the gas supply pipeline 103 is connected to the air inlet 201 of the device, and the two ends of the radio frequency electrode 107 are isolated from the metal shell 104 by a dielectric barrier layer 112, and the surface of the metal shell is There is an insulating block 203 with holes, and the connection of the radio frequency power supply and the radio frequency electrode is isolated from the metal shell 104 through the insulating block 203 .

An atmospheric dielectric barrier plasma discharge device provided by the embodiment of the utility model, the two radio frequency electrodes of the device are semicircular metal strips, when the device is working, the plasma is only transferred along the arc surface, avoiding the scattering discharge , improve the discharge efficiency, the contracted airflow outlet of the device increases the airflow rate, the plasma is sprayed to the material to be processed under the airflow, and reacts with the organic matter on the surface of the material to be processed to generate carbon dioxide and water. The device is used for cleaning Silicon wafer surface photoresist, glass surface organic matter, metal or organic material surface activation. Since the radio frequency electrode uses a semi-circular metal strip, when the device discharges, the plasma is only transferred along the arc surface, which improves the discharge efficiency and expands the contact area between the plasma and the surface of the processed material such as silicon wafers.

Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present utility model without limitation. Although the utility model has been described in detail with reference to examples, those of ordinary skill in the art should understand that the utility model can be Modifications or equivalent replacements of the technical solutions without departing from the spirit and scope of the technical solutions of the utility model shall be covered by the claims of the utility model.

Claims (6)

1. a plasma discharge apparatus, is characterized in that: comprise two radio frequency electrodes, dielectric barrier, uniform gas board, source of the gas, radio-frequency power supply and metal shells; Described radio-frequency power supply is connected with described radio frequency electrode;

Electric discharge device is in when work, described metal shell ground connection;

Described radio frequency electrode is coated by dielectric barrier;

Be the plasma spout between two radio frequency electrodes;

Described uniform gas board is positioned at above described dielectric barrier;

The contraction mouth of the working gas that described source of the gas provides by being consisted of by described uniform gas board, arrive described plasma spout, and under normal pressure, after power connection, form large-area glow plasma at described nozzle, plasma is outside ejection under the carrying of air-flow.

2. plasma discharge apparatus according to claim 1 is characterized in that:

Described uniform gas board is divided into three layers, and wherein, one deck uniform gas board of close described radio frequency electrode is provided with for the outlet of shrinking air-flow, makes working gas by described the 3rd rear spout that arrives between radio frequency electrode of outlet.

3. plasma discharge apparatus according to claim 2 is characterized in that:

The ground floor uniform gas board is made of two uniform gas boards, is provided with gas vent between these two uniform gas boards, is provided with gas vent between these two these uniform gas boards and described metal shell;

Second layer uniform gas board is made of a uniform gas board, is provided with gas vent between this uniform gas board and described metal shell;

The 3rd layer of uniform gas board is made of two described uniform gas boards, and these two uniform gas boards are connected with described metal shell respectively, is provided with the outlet for the contraction of gas air-flow between these two uniform gas boards.

4. plasma discharge apparatus according to claim 3 is characterized in that:

The described discharge area for the contraction of gas air-flow that arranges at the 3rd layer of uniform gas board is less than the area between two radio frequency electrodes.

5. plasma discharge apparatus described according to right 1 is characterized in that:

Two described radio frequency electrodes are all semicircular in shape bonding jumpers, and when the device discharge, plasma only shifts along semicircle cambered surface.

6. plasma discharge apparatus according to claim 1 is characterized in that:

Described metal shell surface is provided with collets with holes, and described radio-frequency power supply is connected by described collets and described radio frequency electrode.

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