CN101081395A - Method for Cleaning Surface Contaminants of Substrates with Composite Type - Google Patents

Abstract

The invention discloses a method for cleaning surface pollutants of a substrate by a composite method, which comprises the steps of providing a substrate, providing a plasma supply unit, providing a carbon dioxide snowflake supply unit, performing a plasma spray substrate operation step and performing a plasma and carbon dioxide snowflake spray substrate operation step.

Description

Method for Cleaning Surface Contaminants of Substrates with Composite Type

technical field

The invention relates to a method for cleaning the surface pollutants of a substrate with a composite method, in particular to a method for effectively removing the composite of various organic pollutants and particles without consuming a large amount of resources and energy, and without causing environmental problems. A method for cleaning substrates from surface contamination.

Background technique

At present, whether it is the semiconductor industry, the flat panel display (FPD) industry, the printed circuit board (PCB) industry, the flexible circuit board (FPCB) industry, etc., the cleaning methods of the products produced mainly use wet processes to remove grease, fingerprints, Organic pollutants such as residual solvents, and particulates such as metals or oxides.

However, the existing wet cleaning process technology has the disadvantages of chemical emission regulations and increasing costs of pure water and solvents, and because of the use of a large amount of water, solvents, and chemicals, it leads to environmental problems and wastes resources and energy. At that time, the more environmentally friendly dry cleaning process was gradually developed.

At present, in order to solve the above-mentioned problems of the wet cleaning process, the existing technology combines the method of RF plasma and carbon dioxide snowflake spray cleaning, and applies it to the photoresist removal process of the wafer. Although it can accelerate the removal of pollutants compared with the existing wet cleaning process , but it also has the following disadvantages: for example, it takes a long time and the energy may damage the surface of the substrate, a vacuum chamber is required to generate radio frequency (RF) plasma, the cost of vacuum equipment is high, and it is not suitable for rapid cleaning of large-sized flat workpieces . Therefore, in the cleaning of flat-panel displays such as TFT-LCD panels, in order to avoid damage to the panel surface, the wet washing process is still used, especially the size of glass substrates above the fifth generation factory is larger, so the cleaning equipment is also more bulky. Of course, it also consumes a lot of water. And the prior art dry cleaning process such as using UV/03 (ultraviolet/ozone) and atmospheric plasma to remove organic pollutants has the advantages of environmental protection, water saving, small footprint of equipment, and fast cleaning speed, but it is only for The removal of organic pollutants is effective, but it has almost no effect on the removal of particles. Therefore, it still needs to be combined with deionized (De-ionized) washing and drying steps, resulting in little commercialization benefits at present.

Therefore, for the above-mentioned pollutant removal effect on the substrate surface, the wet cleaning process has the disadvantage of wasting resources and energy, while the dry cleaning process can only be effective for the removal of organic pollutants, and it is almost useless if it is applied to the removal of particles. Therefore, how to redesign a method for removing surface pollutants of the substrate, which can effectively improve the removal effect of organic pollutants and particles, and avoid the lack of the prior art wet cleaning process and dry cleaning process, is the present invention target.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method for cleaning the surface pollutants of the substrate in a composite manner, so as to solve the problems of waste of resources, energy consumption and environmental protection caused by the use of a large amount of water and chemical solvents in the prior art wet cleaning process , At the same time, it also overcomes the shortcoming that the dry cleaning process in the prior art can only be aimed at the removal of organic pollutants, but cannot effectively remove particles.

In order to achieve the above object, the present invention provides a method for compound cleaning substrate surface pollutants, which includes providing a substrate step, providing a plasma supply unit step, providing a carbon dioxide snowflake supply unit step, performing plasma spray cleaning substrate operation 1. Perform plasma and carbon dioxide snowflake spraying substrate operation, first provide a substrate step, the substrate surface has pollutants; then provide a plasma supply unit step, which is located above the substrate; provide a carbon dioxide snowflake supply unit step, which is located above the substrate And put it on the side of the plasma supply unit, and perform the operation step of plasma spraying the substrate, the substrate and the plasma supply unit move relatively to perform plasma spraying the substrate, and perform the operation steps of plasma and carbon dioxide snowflake spraying the substrate, the substrate and the The plasma supply unit and the carbon dioxide snow supply unit move relative to each other to spray the substrate with plasma and carbon dioxide snow.

The method of the present invention for cleaning the surface pollutants of the substrate with the following points is superior to the prior art, and has the following remarkable efficiency improvement.

1. A kind of method with the surface pollutant of composite type clean substrate of the present invention, implement and use by the method for the surface pollutant of a kind of composite type clean substrate of the present invention, because it combines the organic pollutant removal ability of atmospheric plasma and The particle removal ability of carbon dioxide snowflakes can effectively improve the cleaning effect of surface pollutants on the substrate.

2. A kind of method of the surface pollutant of composite clean substrate of the present invention, implement and use by the method of a kind of composite clean substrate surface pollutant of the present invention, because it combines atmospheric plasma and carbon dioxide snowflake, both all It can be implemented under normal pressure, so it is suitable for continuous cleaning of large-sized flat workpieces, and carbon dioxide can also be used as a dissociated gas of atmospheric plasma and a source of carbon dioxide snowflakes.

3. A method of the present invention to clean the surface pollutants of the composite substrate is implemented by the method of the present invention to clean the surface pollutants of the substrate, and it can be operated under normal pressure, so no vacuum is needed cavity, thus reducing equipment cost.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

Fig. 1 is the schematic flow chart of the method of the present invention to clean the surface pollutants of the composite substrate; and

FIG. 2 is a schematic diagram of cleaning a substrate by a composite method for cleaning surface pollutants of the substrate according to the present invention.

Among them, reference signs:

S1 Composite Cleaning Method for Surface Contaminants of Substrates

Step S10 provides a substrate

Step S20 provides a plasma supply unit

Step S30 provides a carbon dioxide snow supply unit

Step S40 is to carry out the operation of plasma spraying the substrate

In step S50, plasma and carbon dioxide snowflakes are sprayed to clean the substrate

10 substrates

20 plasma supply unit

30 CO2 Snowflake Supply Units

40 shades

50 suction device

Detailed ways

As shown in FIG. 1 , a method of the present invention for cleaning surface pollutants of a composite substrate, the method S1 of the composite cleaning substrate surface pollutants includes providing a substrate (step S10), providing a plasma supply unit ( Step S20 ), providing a carbon dioxide snowflake supply unit (step S30 ), performing plasma spraying operation on the substrate (step S40 ), and performing plasma and carbon dioxide snowflake spraying operation on the substrate (step S50 ).

With reference to Fig. 1 and Fig. 2, a kind of method of the present invention is with the method S1 of the surface contamination of composite cleaning substrate, the method S1 of the surface contamination of this composite cleaning substrate, firstly provide a substrate (step S10), substrate 10 surface There are pollutants, and the substrate 10 can be moved, that is, the substrate 10 is arranged on a moving mechanism (not shown in the figure) to reach the substrate to move; then provide a plasma supply unit (step S20), the plasma supply unit 20 It is arranged above the substrate 10, and the plasma supply unit 20 is movable. Similarly, the plasma supply unit 20 is arranged on a moving mechanism (not shown) so as to be able to move; and a carbon dioxide snowflake supply unit is provided (step S30 ), the carbon dioxide snowflake supply unit 30 is located above the substrate 10, and placed on one side of the plasma supply unit 20, and the carbon dioxide snowflake supply unit 30 is movable, more specifically, the carbon dioxide snowflake supply unit 30 is arranged on a movement mechanism ( not shown in the figure) to be able to move; this method also includes a shield 40, which is arranged between the plasma supply unit 20 and the carbon dioxide snowflake supply unit 30, in order to eliminate static charges, and isolate the carbon dioxide snowflake eruption for the plasma supply unit 20; and the periphery of the above-mentioned substrate 10 can also be provided with a suction device 50, in order to suck away the exhaust gas and pollutants produced after the surface of the above-mentioned substrate 10 is cleaned; and then perform the plasma spraying operation of the substrate (step S40), The substrate 10 and the plasma supply unit 20 move relatively to perform plasma spraying to clean the substrate 10; finally, perform plasma and carbon dioxide snowflake spraying operation on the substrate (step S50), and the substrate 10 moves relatively to the plasma supply unit 20 and the carbon dioxide snowflake supply unit 30 Plasma and carbon dioxide snowflakes are used to clean the pollutants on the surface of the substrate 10 .

According to the present invention, a composite method for cleaning substrate surface pollutants, in the composite method S1 for cleaning substrate surface pollutants, the shielding member 40 is an ion generating source. In addition, in the present invention, a composite method for cleaning substrate surface contamination, the composite method S1 for cleaning substrate surface contamination, the disclosure above discloses that the substrate 10 and the plasma supply unit 20 move relative to each other for the relative plasma supply of the substrate 10 The unit 20 moves; or, the plasma supply unit 20 moves relative to the substrate 10 . In addition, the above-mentioned operation step of performing plasma spraying on the substrate (step S40 ) and performing the operation step of performing plasma and carbon dioxide snow spraying on the substrate (step S50 ) can be performed simultaneously or in successive steps.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (10)

1. the method with the surface contaminant of combined type clean substrate is characterized in that, comprises following steps:

One substrate is provided, and this substrate surface has pollutant;

One plasma feeding unit is provided, and this plasma feeding unit is positioned at this substrate top;

One carbon dioxide snowflake feeding unit is provided, and this carbon dioxide snowflake feeding unit is positioned at this substrate top and places a side of this plasma feeding unit;

Carry out the operation of plasma hydro-peening substrate, this substrate and this plasma feeding unit relatively move to carry out plasma hydro-peening substrate; And

Carry out the operation of plasma and carbon dioxide snowflake hydro-peening substrate, this substrate and this plasma feeding unit and this carbon dioxide snowflake feeding unit relatively move to carry out plasma and carbon dioxide snowflake hydro-peening substrate.

2. the method for the surface contaminant of combined type clean substrate according to claim 1, it is characterized in that, this method also comprises a block piece, be arranged between this plasma feeding unit and this carbon dioxide snowflake feeding unit, in order to the elimination electrostatic charge, and isolate the interference that this carbon dioxide snowflake eruption causes for this plasma feeding unit.

3. the method for the surface contaminant of combined type clean substrate according to claim 1 is characterized in that, this block piece is that an ion produces the source.

4. the method for the surface contaminant of combined type clean substrate according to claim 1 is characterized in that, this substrate is removable.

5. the method for the surface contaminant of combined type clean substrate according to claim 4 is characterized in that, this substrate of this method and this plasma feeding unit relatively move and move relative to this plasma feeding unit for this substrate.

6. the method for the surface contaminant of combined type clean substrate according to claim 1 is characterized in that, this plasma feeding unit is removable.

7. the method for the surface contaminant of combined type clean substrate according to claim 6 is characterized in that, this substrate of this method and this plasma feeding unit relatively move and move relative to this substrate for this plasma feeding unit.

8. the method for the surface contaminant of combined type clean substrate according to claim 1 is characterized in that, this carbon dioxide snowflake feeding unit is removable.

9. the method for the surface contaminant of combined type clean substrate according to claim 1, it is characterized in that, this method carry out plasma hydro-peening substrate operating procedure and this carries out plasma and carbon dioxide snowflake hydro-peening substrate operating procedure, can carry out simultaneously or the front and back step is carried out.

10. the method for the surface contaminant of combined type clean substrate according to claim 1 is characterized in that, this substrate peripheral can also be provided with a getter device, in order to inhale waste gas and this pollutant that is produced after this substrate surface cleaning.

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